GB2226700B - Encapsulated diode and protective resistance - Google Patents

Encapsulated diode and protective resistance

Info

Publication number
GB2226700B
GB2226700B GB8929207A GB8929207A GB2226700B GB 2226700 B GB2226700 B GB 2226700B GB 8929207 A GB8929207 A GB 8929207A GB 8929207 A GB8929207 A GB 8929207A GB 2226700 B GB2226700 B GB 2226700B
Authority
GB
United Kingdom
Prior art keywords
protective resistance
encapsulated diode
encapsulated
diode
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8929207A
Other languages
English (en)
Other versions
GB8929207D0 (en
GB2226700A (en
Inventor
Kenji Tsugj
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15907361&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=GB2226700(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of GB8929207D0 publication Critical patent/GB8929207D0/en
Publication of GB2226700A publication Critical patent/GB2226700A/en
Application granted granted Critical
Publication of GB2226700B publication Critical patent/GB2226700B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
GB8929207A 1988-12-27 1989-12-27 Encapsulated diode and protective resistance Expired - Fee Related GB2226700B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988170574U JPH0289854U (enExample) 1988-12-27 1988-12-27

Publications (3)

Publication Number Publication Date
GB8929207D0 GB8929207D0 (en) 1990-02-28
GB2226700A GB2226700A (en) 1990-07-04
GB2226700B true GB2226700B (en) 1993-02-17

Family

ID=15907361

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8929207A Expired - Fee Related GB2226700B (en) 1988-12-27 1989-12-27 Encapsulated diode and protective resistance

Country Status (4)

Country Link
JP (1) JPH0289854U (enExample)
DE (1) DE3943013C2 (enExample)
GB (1) GB2226700B (enExample)
SG (1) SG59493G (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10032389A1 (de) 2000-07-06 2002-01-17 Philips Corp Intellectual Pty Empfänger mit Kapazitätsvariationsdiode
NL2027146B1 (en) * 2020-12-17 2022-07-11 Ampleon Netherlands Bv A radiofrequency power package and device with improved ESD performance

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047411A (enExample) *
EP0035331A2 (en) * 1980-02-29 1981-09-09 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device
GB2086134A (en) * 1980-09-22 1982-05-06 Hitachi Ltd Resin encapsulated electronic devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5393781A (en) * 1977-01-27 1978-08-17 Toshiba Corp Semiconductor device
DE3522652A1 (de) * 1985-06-25 1987-01-08 Blaupunkt Werke Gmbh Schaltungsanordnung zur abstimmung von empfaengern
US4847572A (en) * 1986-10-30 1989-07-11 Toko, Inc. Electronic tuning circuit for AM receiver

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1047411A (enExample) *
EP0035331A2 (en) * 1980-02-29 1981-09-09 Kabushiki Kaisha Toshiba Resin-sealed semiconductor device
GB2086134A (en) * 1980-09-22 1982-05-06 Hitachi Ltd Resin encapsulated electronic devices

Also Published As

Publication number Publication date
JPH0289854U (enExample) 1990-07-17
DE3943013A1 (de) 1990-06-28
DE3943013C2 (de) 1994-12-22
SG59493G (en) 1993-07-09
GB8929207D0 (en) 1990-02-28
GB2226700A (en) 1990-07-04

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20021227