GB2226447A - An infrared ray detector - Google Patents
An infrared ray detector Download PDFInfo
- Publication number
- GB2226447A GB2226447A GB9000493A GB9000493A GB2226447A GB 2226447 A GB2226447 A GB 2226447A GB 9000493 A GB9000493 A GB 9000493A GB 9000493 A GB9000493 A GB 9000493A GB 2226447 A GB2226447 A GB 2226447A
- Authority
- GB
- United Kingdom
- Prior art keywords
- infrared ray
- submount
- detection element
- infrared
- ray detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 7
- 238000011156 evaluation Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 229910001080 W alloy Inorganic materials 0.000 claims description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 12
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910000830 fernico Inorganic materials 0.000 description 5
- 239000012467 final product Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002471 indium Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
- G01J2005/283—Array
- G01J2005/286—Arrangement of conductor therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Light Receiving Elements (AREA)
Abstract
An infrared ray detector includes an infrared detection element (15) fabricated in a wafer which is produced by growing a semiconductor responsive to infrared on a high resistance substrate, a metal submount (16) provided with two lead terminals (20) insulated from each other, to which submount the infrared ray detection element is soldered and an adiabatic vacuum vessel (23) for containing and cooling the infrared detection element, to which vessel the metal submount is soldered. <IMAGE>
Description
An Infrared Ray Detector
FIELD OF THE INVENTION
The present invention relates to an infrared ray detector, and more particularly to that of high efficiency and high mass producibility.
BACKGROUND ART
Figures 6 and 7 show a perspective view and a side view of a structure of a prior art infrared ray detection element, and figure 8 shows a structure of a prior art infrared ray detector.
In these figures, the reference numeral 2 designates a HgCdTe crystal, the numeral 3 designates an electrode, the numeral 4 designates a light receiving surface, and the reference numeral 1 designates an infrared ray detection element. The reference numeral 5 designates a supporting plate for supporting the infrared ray detection element 1, comprising insulating material such as sapphire, and the numeral 6 designates an adhesive. The reference numeral 7 designates an adiabatic vacuum vessel (hereinafter referred to as "dewar"). The reference numeral 8 designates glass constituting a surrounding of the vessel 7, the numeral 9 designates fernico series alloy constituting a portion to which the infrared ray dete#tion element 1 is mounted.The reference numeral 10 designates an infrared ray transparent window comprising such as ZnS for introducing infrared ray into the vessel 7, the reference numeral 11 designates a lead wire one end of which is connected to the electrode 3 of the infrared ray detection element 1, and the other end thereof is connected to the electrode lead 27. The reference numeral 12 designates a hollow section for containing a cooler, provided at the center of the dewar 7, and the reference numeral 13 designates an infrared ray detector constituted as such.
The HgCdTe crystal 2 is a compound semiconductor having a small band gap, and is widely used as infrared ray detection element material for detecting infrared ray of the band of 3 to 5 tm or 10 lire.
The HgCdTe crystal 2 is attached to a supporting plate 5 by an adhesive 6, and thereafter the same is made have a thickness of about 10 am by such as grinding or etching, and vapor plating material such as indium is vapor plated on the surface other than the light receiving surface 4 to produce an electrode 3.
An anode oxidated film, a protection film such as ZnS film, and a reflection reducing coating or the like is provided on the light receiving surface 4. An infrared ray detection element 1 is fabricated in this way.
The infrared ray detection element 1 is fixed onto the fernico series alloy 9 of the dewar 7 with making the side of the supporting plate 5 at the side of the alloy 9 with the use of the adhesive 6, and thereafter the inside air of the dewar 7 is exhausted up to a vacuum, thereby producing an infrared ray detector 13.
The infrared ray detection element 1 is contained in the dewar 7 so as to enable cooling of the infrared ray detection element 1 down to below 200 K. This cooling of the infrared ray detection element 1 is conducted by a cooler inserted in the hollow section 12 at the center of the dewar 7. A Joule-Thomson cooler,
Stirling cycle cooler, Peltier element cooler, or liquid nitrogen may be used as the cooler.
In an infrared ray detector for a guided flying object, the time period from the start of cooling to the start of operation (hereinafter referred to as "cool down time") is required to be short. Actually, a
Joule-Thomson cooler is usually used and the cool down time is required to be below several seconds.
Furthermore, although the dewar 7 may be used with exhausting the air therein by a vacuum pump connected thereto, W7.5en the iaturization, and lightening of the i#frare# ray detector 13 is required, the sealing of the dewar 7 should be conducted after the inside air is exhaused. At this sealing, air exhaustion is conducted with conducting heating for several tens hours so as to maintain the inside of the dewar 7 in vacuum for a long time.
Since it takes a long time for the sealing as such, it is generally required to conduct the sealing after conducting evaluation and selection of the infrared ray detection element 1 in view of the mass producibility.
In the prior art infrared ray detector 13 of such a construction, since the thermal conductivities of both the adhesive 6 and the supporting plate 5 are low and the heat capacitances thereof are large, the cool down time is disadvantageously long as is from 10 several seconds to several minutes.
Furthermore, because it is required to fix the infrared ray detection element 1 to the dewar by the adhesive 6 and connect the wire thereof directly to the electrode 3 in order to conduct an evaluation of the element characteristics of the infrared ray detection element 1, it was impossible to conduct evaluation and ~selection of the infrared ray detection element 1 before conducting sealing of the dewar 7. This resulted in badness in mass producibility.
As another prior art infrared ray detector, there is one which is disclosed in Japanese Laid-open Patent
Publication No. 57-73637. In this infrared ray detector, a base plate onto which an infrared ray detection element is mounted is provided detachably, and thus it is enabled to provisionally fix an infrared ray detection element to a dewar.
Another prior art infrared ray detector is disclosed in Japanese Laid-Open Patent Publication No.
57-62569. In this detector, an infrared ray detection element is fixed to a supporting plate having a pin electrode, and thus it is enabled to provisionally fix an infrared ray detection element to a dewar.
Another prior art infrared ray detector is described in Japanese Laid-open Patent Publication No.
57-24580. In this detector, an infrared ray detection element is obtained by producing a Hgl Cd Te crystal layer on a CdTe substrate by epitaxial growth.
SUMMARY OF THE INVENTION
An object of the present invention is to provide an infrared ray detector capable of shortening the cool down time and enhancing the mass producibility.
Other objects and advantages of the present invention will U apparent from the detailed description girl7 hereinafter; it should be understood, however, that the detailed description and specific embodiment are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
According to the present invention, a plurality of infrared ray detection elements are obtained from a wafer which is produced by growing a semiconductor layer responsive to infrared ray on a high resistance substrate, an infrared ray detection element is mechanically fixed to a metal submount having I/O lead terminals, the metal submount is mechanically fixed to an adiabatic vacuum vessel for cooling the infrared ray detection element, and the infrared ray detection element and the metal submount, and the metal submount and the adiabatic vacuum vessel are respectively adhered to each other by solder. This enables of shortening the cool down time and enhancing the mass producibility.
BRIEF DESCRIPTION OF THE DRAWINGS
Figures 1 and 2 are a perspective view and a side view showing an infrared ray detection element as an embodiment of the present invention, respectively;
Figure 3 is a perspective view showing an infrared ray detection element attached to a metal submount of the above-described embodiment;
Figure 4 is a perspective view showing a state where the infrared ray detection element attached to the metal submount of figure 3 is provisionally fixed to an evaluation dewar;
Figure 5 is a perspective view showing a state where the infrared ray detection element attached to the metal submount of figure 3 is fixed to the final product dewar;
Figures 6 and 7 are a perspective view and a side view showing a prior art infrared ray detection element, respectively; and
Figure 8 is a diagram showing a structure of a prior art infrared ray detector.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
An embodiment of the present invention will be described with reference to figures 1 to 5.
In these figures, the same reference numerals designate the same elements as those shown in figure 6.
The reference numeral 14 designates a substrate of high resistance comprising such as cadmium telluride, the reference numeral 2a designates a HgCdTe crystal which is epitaxially grown on the substrate 14. The
reference numeral 15 designates an infrared ray d et element Comprising the substrate 14 and the
HgCdTe crystal 2a. The reference numeral 16 designates a metal submount comprising e.g. copper tungsten alloy (hereinafter referred to as "Cu-W") or fernico series alloy. The reference numeral 17 designates a hole for provisional fixation of the same to a mounting portion of a dewar, apertured at the metal submount 16.The reference numeral 18 designates a ceramic block provided on the metal submount 16, and the reference numeral 19 designate an input and an output lead terminals comprising copper, provided on the ceramic blocks 18, respectively. The reference numeral 20 designates a wiring for electrically connecting the electrode 3 and the lead terminal 19. The reference numeral 23 designates an internal wall of an evaluation dewar (whose entire view is not shown). The reference numeral 22 designates a screw for fixing the metal submount 16 to the evaluation dewar. The reference numeral 21 designates solder for connecting the lead wire 24 of the evaluation dewar 23 to the lead terminal 19. The reference numeral 25 designates an internal wall of the final product dewar 7.
The construction process of the infrared ray detector of this embodiment will be described.
At first, a HgCdTe crystal 2a is produced on a high resistance substrate 14 by an epitaxial growth to a predetermined thickness thereby to produce a wafer.
Next, a plurality of infrared ray detection elements are produced onto the wafer by a usual wafer process such as photolithography or vacuum vapor plating.
Thereafter, the wafer is divided into a plurality of chips by a dicing saw, and a plurality of infrared ray detection elements 15 each provided with the electrodes 3 and the light receiving surface 4 are obtained similarly as in the prior art device.
Next, an infrared ray detection element 15 produced as such is soldered to a metal submount 16, and thereafter it is provisionally fixed onto the top surface of the internal wall 23 of the evaluation dewar comprising e.g. fernico series alloy 9 with making the side of the metal submount 16 at the side of the alloy 9 by using the screw 22. The lead wire 24 of the evaluation dewar 23 and the I/O lead terminal 19 are connected with each other by soldering 21.
After the evaluation of the infrared ray detection element 15 which is provisionally mounted onto the evaluation dewar 23 is conducted, the infrared ray detection element 15 is detached from the evaluation dewar 23, and it is soldered onto the top surface of the internal wall 25 of the final product dewar 7.
le#eter, the lead wire 11 of the final product dewar 7 and the I/O lead terminal 19 are connected with each other by such as soldering or spot welding.
Thereafter, in a similar manner to that in the prior art device, the inside air of the dewar 7 is exhausted up to a vacuum, and an infrared ray detector is completed.
In the infrared ray detector of this embodiment, the thickness of the HgCdTe crystal 2a is about 10 similarly as in the prior art device, and the thicknesses of the substrate 14 and the metal submount 16 are both in a range of 100 to 1000 fim. In greater detail, the substrate 14 and the metal submount 16 are preferred to be thin in view of the cool down time if it arises no problem in view of intensity, and it is preferred to be about 300 Xm.
Furthermore, a gold plating or a gold vapor plating may be executed to the surface of the metal submount 16 and the surface of the substrate 14 to which soldering should be conducted, in order to improve wetness of the solder.
Low melting point solder of such as indium series alloy or bismuth series alloy is used as the solder, and the soldering is conducted at below 150 C. This is because the HgCdTe crystal 2a has less heat-proofness.
Cu-W or fernico series alloy 9 which has thermal expansion coefficient close to that of HgCdTe crystal is used for the metal submount 16 in order to prevent the destruction of the HgCdTe crystal 2a or the deterioration in the element characteristics thereof, which may arise at cooling when there is a large difference between their thermal expansion coefficients.
The infrared ray detector 13 constructed as such can be used in a similar manner to that in the prior art device, and the respective constitutional elements are adhered to each other by solder having a large thermal conductivity, without using insulating material such as an adhesive or a supporting plate which has inadvantageously restricted the cooling speed. This enables of accomplishing a cool down time of several seconds.
In the infrared ray detector of the present invention, since the infrared ray detection element 15 is supported by a metal submount 16, the evaluation and selection can be easily conducted. Actually, the infrared ray detection element 15 is soldered to the metal submount 16, a wiring is conducted as shown in figure 3, and thereafter, the element 15 is provisionally fixed to an evaluation dewar by a screw with utiliz#ng the hole 17 and the inside air of the evaluation dewar is exhausted up to a vacuum by a vacuum pump.After conducting the evaluation and selection in such a manner, the infrared ray detection element 15 is taken out from the'evaluation dewar, and only those which have good characteristics are soldered to the final product dewar 7 to obtain an infrared ray detector. This enhances the work efficiency and the mass-producibility.
In the above-illustrated embodiment, HgCdTe crystal 2a is used as a semiconductor responsive to infrared ray, but the present invention may be also applied to a device using other semiconductor e.g.
InSb.
As is evident from the foregoing description, according to the present invention, a plurality of infrared ray detection elements are obtained from a wafer which is produced by growing a semiconductor layer responsive to infrared ray on a high resistance substrate, an infrared ray detection element is mechanically fixed to a metal submount having I/O lead terminals, the metal submount is mechanically fixed to an adiabatic vacuum vessel for containing the infrared ray detection element and cooling the same, and the infrared ray detection element and the metal submount, and the metal submount and the adiabatic vacuum vessel are respectively adhered to each other by solder. This enables of shortening the cool down time and enhancing the mass-producibility.
Claims (7)
1. An infrared ray detector comprising:
an infrared ray detection element fabricated
in a wafer which is produced by growing a
semiconductor responsive to infrared ray on
a high resistance substrate;
a metal submount provided with two lead
terminals insulated from each other, to
which submount said infrared ray detection
element is mechanically fixed;
an adiabatic vacuum vessel for containing and
cooling said infrared ray detection
element, to which vessel said metal submount
is mechanically fixed; and
said infrared ray detection element and said
metal submount, and said metal submount and
said adiabatic vacuum vessel are
respectively adhered to each other by
solder.
2. An infrared ray detector as defined in claim
1, wherein said metal submount comprises copper
tungsten alloy.
3. An infrared ray detector as defined in claim
1 or 2, wherein said lead terminals are provided on said metal submount via a ceramic material; respectively.
4. An infrared ray detector as defined in claim
1, 2 or 3, wherein said metal submount is provided
with a hole for provisionally fixing said submount to
an adiabatic vacuum vessel for evaluating said
infrared ray detection element.
5. An infrared ray detector as defined in claim
1, 2, 3 or 4, wherein said solder is low melting
point solder.
6. A method of making an infrared detection
device comprising
fixing an infrared sensitive element to a
submount,
placing the submount to which the element is
fixed in a test vacuum vessel to evaluate the element,
and, after successful evaluation,
fixing the evaluated element and submount in
a production vacuum vessel.
7. An infrared detector comprising
an infrared sensitive element fixed by
solder to a heat conductive submount, and
a vessel containing the element and
submount, the submount being fixed to a
heat-conductive support therefor in the vessel by
solder.
8 An infrared detector substantially as herei.##efore described with reference to Figures 1 to 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62045635A JPH0766976B2 (en) | 1987-02-27 | 1987-02-27 | Infrared detector |
| GB8804393A GB2202674B (en) | 1987-02-27 | 1988-02-25 | An infrared ray detector |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9000493D0 GB9000493D0 (en) | 1990-03-07 |
| GB2226447A true GB2226447A (en) | 1990-06-27 |
| GB2226447B GB2226447B (en) | 1990-10-31 |
Family
ID=26293537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9000493A Expired - Fee Related GB2226447B (en) | 1987-02-27 | 1990-01-09 | An infrared ray detector |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2226447B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114353953B (en) * | 2022-01-13 | 2024-04-12 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1310766A (en) * | 1966-12-24 | 1973-03-21 | Max Planck Gesellschaft | Apparatus for the continuous cooling of objects to temperatures below 2.18k |
| GB2110469A (en) * | 1981-11-21 | 1983-06-15 | Bosch Gmbh Robert | Cooling a semiconductor diode wafer |
| GB2148051A (en) * | 1983-10-13 | 1985-05-22 | Telefunken Electronic Gmbh | Housing arrangement for an electronic component operable at low temperatures |
| GB2178595A (en) * | 1985-07-26 | 1987-02-11 | Sony Corp | Semiconductor laser devices |
| GB2186741A (en) * | 1986-02-14 | 1987-08-19 | Philips Electronic Associated | Infrared detectors |
-
1990
- 1990-01-09 GB GB9000493A patent/GB2226447B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1310766A (en) * | 1966-12-24 | 1973-03-21 | Max Planck Gesellschaft | Apparatus for the continuous cooling of objects to temperatures below 2.18k |
| GB2110469A (en) * | 1981-11-21 | 1983-06-15 | Bosch Gmbh Robert | Cooling a semiconductor diode wafer |
| GB2148051A (en) * | 1983-10-13 | 1985-05-22 | Telefunken Electronic Gmbh | Housing arrangement for an electronic component operable at low temperatures |
| GB2178595A (en) * | 1985-07-26 | 1987-02-11 | Sony Corp | Semiconductor laser devices |
| GB2186741A (en) * | 1986-02-14 | 1987-08-19 | Philips Electronic Associated | Infrared detectors |
Non-Patent Citations (1)
| Title |
|---|
| Mullard :electronic components and applications, vol,4,No 4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2226447B (en) | 1990-10-31 |
| GB9000493D0 (en) | 1990-03-07 |
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| 746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 19951107 |
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| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20000225 |