JPH05256693A - Cooling structure of infrared detector - Google Patents
Cooling structure of infrared detectorInfo
- Publication number
- JPH05256693A JPH05256693A JP4057926A JP5792692A JPH05256693A JP H05256693 A JPH05256693 A JP H05256693A JP 4057926 A JP4057926 A JP 4057926A JP 5792692 A JP5792692 A JP 5792692A JP H05256693 A JPH05256693 A JP H05256693A
- Authority
- JP
- Japan
- Prior art keywords
- infrared detector
- substrate
- infrared
- cooling structure
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 238000005219 brazing Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 238000001514 detection method Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000919 ceramic Substances 0.000 description 16
- 230000006866 deterioration Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、赤外線検知器の冷却構
造に係り、とくに電子冷却素子の取付構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an infrared detector, and more particularly to a mounting structure for an electronic cooling element.
【０００２】電子冷却型赤外線検知器は、赤外線検知素
子を冷却するために電子冷却素子（ペルチェ効果を利用
したもの）を用いているが、その冷却効果を妨げない取
付構造が要望されている。The electronic cooling type infrared detector uses an electronic cooling element (using the Peltier effect) to cool the infrared detecting element, but a mounting structure that does not interfere with the cooling effect is desired.
【０００３】[0003]
【従来の技術】従来の赤外線検知器の冷却構造は図２の
側断面図に示すように、コバールまたは銅製の放熱基板
１上に絶縁基板２、即ちセラミック基板を介挿して複数
段（図示は２段）の電子冷却素子群３（図示の下段は４
×４、上段は３×３の電子冷却素子が配列されている）
をピラミッド型に積み重ね、その上段のセラミック基板
2-3 上には水銀−カドミウム−テルル(HgCdTe)でなる赤
外線検知素子４を搭載し、下段の電子冷却素子群３を接
合したセラミック基板2-1 は赤外線検知素子４の冷却効
果を向上させるために放熱基板１に固着している。2. Description of the Related Art As shown in the side sectional view of FIG. 2, a conventional infrared detector cooling structure has a plurality of stages (not shown) in which an insulating substrate 2, that is, a ceramic substrate is inserted on a heat dissipation substrate 1 made of Kovar or copper. 2 stages of electronic cooling element group 3 (lower stage in the figure is 4)
X4, 3x3 thermoelectric coolers are arranged in the upper row)
Stacked in a pyramid shape, the upper ceramic substrate
The ceramic substrate 2-1 on which the infrared detection element 4 made of mercury-cadmium-tellurium (HgCdTe) is mounted on the 2-3, and the lower electronic cooling element group 3 is bonded improves the cooling effect of the infrared detection element 4. Therefore, it is fixed to the heat dissipation substrate 1.
【０００４】そして、全体をサファイア製の赤外線透過
窓5aを有するコバール製の封止ケース５で気密に封止し
ている。その封止ケース５を２分する中間には、図示し
ない外部接続端子を配線したセラミック基板でなる端子
基板６が挟んであり、外部接続端子の一端と赤外線検知
素子４の図示しない電極とをボンディングワイヤ７で接
続している。The whole is hermetically sealed by a Kovar sealing case 5 having an infrared transmitting window 5a made of sapphire. In the middle of dividing the sealing case 5 into two parts, a terminal board 6 made of a ceramic board on which external connection terminals (not shown) are wired is sandwiched, and one end of the external connection terminals and an electrode (not shown) of the infrared detection element 4 are bonded. Connected by wire 7.
【０００５】上記構成部品間の接合は銀ロー付け（溶融
温度 600〜800 ℃）によっているが、最下段のセラミッ
ク基板2-1 と放熱基板１との接合は接合部分を高温度に
加熱しないことからエポキシ樹脂系の接着剤８によって
いる。The above-mentioned components are joined by silver brazing (melting temperature of 600 to 800 ° C.), but the joining of the lowermost ceramic substrate 2-1 and the heat dissipation substrate 1 should not heat the joint portion to a high temperature. Therefore, an epoxy resin adhesive 8 is used.
【０００６】そして、赤外線検知器（封止ケース５）内
は結露による検知性能の劣化を防止するために図示しな
い乾燥窒素ガスの封入、または高真空封止により気密を
保っている。The inside of the infrared detector (sealing case 5) is kept airtight by sealing dry nitrogen gas (not shown) or high vacuum sealing in order to prevent deterioration of detection performance due to dew condensation.
【０００７】なお、電子冷却素子群３のそれぞれの電子
冷却素子は上段から順次、下段方向に熱が伝わるように
セラミック基板2-1,2-2,2-3 には電気配線が施されてい
る。Each of the electronic cooling elements of the electronic cooling element group 3 is electrically connected to the ceramic substrates 2-1, 2-2, 2-3 so that heat is transferred from the upper stage to the lower stage. There is.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、このよ
うな上記構造によれば、最下段のセラミック基板と放熱
基板との接合に接着剤を用いているため、使用中に接着
剤からの水素や水分などのアウトガスにより真空劣化を
引き起こし、それらのガス分子の熱伝導により冷却効果
が低下するといった問題があった。However, according to the above structure, since the adhesive is used for joining the lowermost ceramic substrate and the heat dissipation substrate, hydrogen or moisture from the adhesive is used during use. However, there is a problem in that the outgassing causes vacuum deterioration, and the cooling effect decreases due to heat conduction of those gas molecules.
【０００９】上記問題点に鑑み、本発明は赤外線検知素
子の冷却効果を妨げない赤外線検知器の冷却構造を提供
することを目的とする。In view of the above problems, it is an object of the present invention to provide a cooling structure for an infrared detector that does not interfere with the cooling effect of the infrared detecting element.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明の赤外線検知器の冷却構造においては、放熱
基板上に赤外線検知素子及び電子冷却素子群を搭載した
絶縁基板を固着し全体を封止ケースによって気密封止し
てなる赤外線検知器の冷却構造において、前記放熱基板
は前記封止ケースの接合面より高くした接合用突起を備
え、該接合用突起に前記絶縁基板をアウトガスの少ない
低融点ロー材で接合するように構成する。In order to achieve the above object, in an infrared detector cooling structure according to the present invention, an insulating substrate having an infrared detector element and an electronic cooling element group mounted thereon is fixed on a heat dissipation substrate. In a cooling structure of an infrared detector, which is hermetically sealed by a sealing case, the heat dissipation substrate is provided with a bonding projection that is higher than a bonding surface of the sealing case, and the insulating projection is used to outgas the insulating substrate. The low melting point brazing material is used for joining.
【００１１】[0011]
【作用】放熱基板に前記封止ケースの接合面より高くし
た接合用突起を備えることにより、接合面の大きさを絶
縁基板の大きさに合わせることができて放熱基板への熱
の逃げを少なくできるため低温度でロー付けができる。
また、放熱基板の接合用突起に絶縁基板をアウトガスの
少ない低融点ロー材で接合することにより、アウトガス
による真空劣化はなくなり赤外線検知素子の冷却効果の
低下を防止することができる。By providing the heat-dissipating substrate with the bonding projections that are higher than the bonding surface of the sealing case, the size of the bonding surface can be adjusted to the size of the insulating substrate, and the escape of heat to the heat-dissipating substrate is reduced. As a result, brazing can be done at low temperatures.
Also, by bonding the insulating substrate to the bonding projection of the heat dissipation substrate with a low melting point brazing material with less outgas, vacuum deterioration due to outgas disappears and a decrease in the cooling effect of the infrared detection element can be prevented.
【００１２】[0012]
【実施例】以下、図面に示した実施例に基づいて本発明
の要旨を詳細に説明する。なお、従来と同じ部品、部位
は同じ符号を付している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The gist of the present invention will be described in detail below with reference to the embodiments shown in the drawings. The same parts and parts as in the conventional case are designated by the same reference numerals.
【００１３】赤外線検知器の冷却構造は図１の側断面図
に示すように、図２の従来構成を基本に構成する。即
ち、絶縁基板２、即ちセラミック基板2-1,2-2,2-3 間に
複数段（図示は２段）の電子冷却素子群３を、一番上の
セラミック基板2-3 上に赤外線検知素子４を搭載し、一
番下のセラミック基板2-1 を放熱基板11上に固着し、そ
の全体を封止ケース５によって気密に封止し、内部に乾
燥窒素ガスの封入、または高真空封止して構成する。As shown in the side sectional view of FIG. 1, the infrared detector has a cooling structure based on the conventional structure of FIG. That is, a plurality of stages (two stages in the figure) of electronic cooling elements 3 are provided between the insulating substrate 2, that is, the ceramic substrates 2-1, 2-2, 2-3, and infrared rays are provided on the top ceramic substrate 2-3. The detection element 4 is mounted, the bottom ceramic substrate 2-1 is fixed on the heat dissipation substrate 11, and the whole is hermetically sealed by the sealing case 5, and the inside is filled with dry nitrogen gas, or high vacuum is applied. It is configured by sealing.
【００１４】しかし、本発明における放熱基板11は、と
くに封止ケース５の接合面より高くし、かつ最下段のセ
ラミック基板2-1 の大きさに合わせた接合面を有する接
合用突起11a を備え、その接合用突起11a に最下段のセ
ラミック基板2-1 をアウトガスの少ない低融点ロー材1
8、即ち低融点半田（溶融温度約 120℃）で接合し構成
する。However, the heat dissipation board 11 of the present invention is provided with the joining projection 11a having a joining surface which is higher than the joining surface of the sealing case 5 and has a joining surface matching the size of the lowermost ceramic substrate 2-1. , The lowermost ceramic substrate 2-1 on the bonding protrusion 11a is a low melting point brazing material 1 with little outgassing.
8, that is, it is constructed by joining with a low melting point solder (melting temperature about 120 ° C).
【００１５】なお、セラミック基板2-1 の接合面はロー
付け可能にするためメタライズ処理により金属膜19を蒸
着する。また、従来の構成部品間の接合は銀ロー付けに
よっているが、直接、ロー付けできないセラミック基板
などの接合部も同様にメタライズ処理を施した後、ロー
付けする。A metal film 19 is deposited on the bonding surface of the ceramic substrate 2-1 by metallization so as to be brazable. Further, although the conventional method of joining the components is by silver brazing, the joint portion such as a ceramic substrate which cannot be directly brazed is similarly metalized and then brazed.
【００１６】このように、本発明においては、放熱基板
に、封止ケースの接合面より高く、かつ相手方接合面の
大きさに合わせた接合面積の接合用突起を備えることに
より、放熱基板への熱の逃げを少なくできるため、従来
のように接着剤に頼ることなく低温度でロー付けするこ
とができる。また、放熱基板の封止ケースの接合面を一
段低くしていることにより、赤外線検知器の高さをその
分だけ低くすることができ小形化できる。また更に、放
熱基板の接合用突起と最下段のセラミック基板との接合
にアウトガスの少ない低融点ロー材（低融点半田）を用
いることにより、赤外線検知器内のアウトガスによる真
空劣化はなくなり赤外線検知素子の冷却効果の低下を防
止することができる。As described above, according to the present invention, the heat dissipation board is provided with the bonding projections which are higher in height than the bonding surface of the sealing case and have a bonding area matching the size of the mating bonding surface. Since the escape of heat can be reduced, it is possible to perform brazing at a low temperature without relying on an adhesive as in the past. Further, by lowering the joint surface of the sealing case of the heat dissipation substrate by one step, the height of the infrared detector can be lowered by that amount and the size can be reduced. Furthermore, by using a low melting point brazing material (low melting point solder) with a small amount of outgas for joining the bonding projection of the heat dissipation board and the lowermost ceramic substrate, there is no vacuum deterioration due to outgas in the infrared detector, and the infrared sensing element It is possible to prevent a decrease in the cooling effect.
【００１７】[0017]
【発明の効果】以上、詳述したように本発明によれば、
赤外線検知器内の真空劣化を防止することができるた
め、赤外線検知素子の冷却効果を妨げることはなくな
り、しかも赤外線検知器の小形化も図ることができると
いった産業上極めて有用な効果を発揮する。As described above in detail, according to the present invention,
Since the vacuum deterioration in the infrared detector can be prevented, the cooling effect of the infrared detection element is not hindered, and the infrared detector can be downsized, which is extremely useful in industry.
【図１】 本発明による一実施例の側断面図FIG. 1 is a side sectional view of an embodiment according to the present invention.
【図２】 従来技術による側断面図FIG. 2 is a side sectional view according to the related art.
２は絶縁基板（セラミック基板） ３は電子冷却素子群 ４は赤外線検知素子 ５は封止ケース 11は放熱基板 11aは接合用突起 18は低融点ロー材（低融点半田） 2 is an insulating substrate (ceramic substrate) 3 is a thermoelectric cooling element group 4 is an infrared detection element 5 is a sealing case 11 is a heat dissipation substrate 11a is a bonding protrusion 18 is a low melting point brazing material (low melting point solder)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 上田 知史 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 (72)発明者 濱嶋 茂樹 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tomofumi Ueda 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa, Fujitsu Limited
Claims (1)
び電子冷却素子群(3) を搭載した絶縁基板(2) を固着し
全体を封止ケース(5) によって気密封止してなる赤外線
検知器の冷却構造において、 前記放熱基板(11)は前記封止ケース(5) の接合面より高
くした接合用突起(11a) を備え、該接合用突起(11a) に
前記絶縁基板(2) をアウトガスの少ない低融点ロー材(1
8)で接合することを特徴とする赤外線検知器の冷却構
造。1. An insulating substrate (2) having an infrared detection element (4) and a thermoelectric cooling element group (3) mounted on a heat dissipation substrate (11), and the whole is hermetically sealed by a sealing case (5). In the cooling structure of the infrared detector, the heat dissipation substrate (11) includes a bonding protrusion (11a) higher than the bonding surface of the sealing case (5), and the insulating protrusion is provided on the bonding protrusion (11a). (2) is a low melting point brazing material (1
Cooling structure of infrared detector characterized by joining in 8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4057926A JP2737518B2 (en) | 1992-03-16 | 1992-03-16 | Cooling structure of infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4057926A JP2737518B2 (en) | 1992-03-16 | 1992-03-16 | Cooling structure of infrared detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05256693A true JPH05256693A (en) | 1993-10-05 |
| JP2737518B2 JP2737518B2 (en) | 1998-04-08 |
Family
ID=13069614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4057926A Expired - Fee Related JP2737518B2 (en) | 1992-03-16 | 1992-03-16 | Cooling structure of infrared detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2737518B2 (en) |
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-
1992
- 1992-03-16 JP JP4057926A patent/JP2737518B2/en not_active Expired - Fee Related
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