GB2212944B - Improved process in the manufacture of integrated circuits - Google Patents

Improved process in the manufacture of integrated circuits

Info

Publication number
GB2212944B
GB2212944B GB8727958A GB8727958A GB2212944B GB 2212944 B GB2212944 B GB 2212944B GB 8727958 A GB8727958 A GB 8727958A GB 8727958 A GB8727958 A GB 8727958A GB 2212944 B GB2212944 B GB 2212944B
Authority
GB
United Kingdom
Prior art keywords
manufacture
integrated circuits
improved process
wafer
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8727958A
Other versions
GB2212944A (en
GB8727958D0 (en
Inventor
Ian Phillips
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB8727958A priority Critical patent/GB2212944B/en
Publication of GB8727958D0 publication Critical patent/GB8727958D0/en
Publication of GB2212944A publication Critical patent/GB2212944A/en
Application granted granted Critical
Publication of GB2212944B publication Critical patent/GB2212944B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60Substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A step and repeat process using a mask transfers circuit information onto a die forming a portion of a wafer (Fig 3). The circuit information is confined within the mask which is of octagonal shape to maximise the number of steps across a given surface area of wafer and to provide a maximum area of transferred circuits. <IMAGE>
GB8727958A 1987-11-30 1987-11-30 Improved process in the manufacture of integrated circuits Expired - Fee Related GB2212944B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8727958A GB2212944B (en) 1987-11-30 1987-11-30 Improved process in the manufacture of integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8727958A GB2212944B (en) 1987-11-30 1987-11-30 Improved process in the manufacture of integrated circuits

Publications (3)

Publication Number Publication Date
GB8727958D0 GB8727958D0 (en) 1988-01-06
GB2212944A GB2212944A (en) 1989-08-02
GB2212944B true GB2212944B (en) 1991-10-23

Family

ID=10627745

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8727958A Expired - Fee Related GB2212944B (en) 1987-11-30 1987-11-30 Improved process in the manufacture of integrated circuits

Country Status (1)

Country Link
GB (1) GB2212944B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2590700B2 (en) * 1993-09-16 1997-03-12 日本電気株式会社 Projection exposure equipment

Also Published As

Publication number Publication date
GB2212944A (en) 1989-08-02
GB8727958D0 (en) 1988-01-06

Similar Documents

Publication Publication Date Title
KR900015344A (en) Process of forming high and low voltage CMOS transistors on a single integrated circuit chip
KR960007635B1 (en) Forming method of photoresist mask pattern
EP0092871A3 (en) Semiconductor integrated circuits and method of manufacturing
KR100199259B1 (en) Fabrication method of semiconductor integrated circuit device
GB2153590B (en) Matrix of functional circuits on a semiconductor wafer
SG88787G (en) A semiconductor integrated circuit device and method of manufacturing the same
EP0489179A4 (en) Method of manufacturing semiconductor integrated circuit and equipment for the manufacture
JPS55146944A (en) Method of fabricating monolithic integrated microelectronic semiconductor circuit
EP0083405A3 (en) Chip carrier for large scale integrated circuits and a method for the fabrication of the carrier
DE3068823D1 (en) A method of fabricating a semiconductor integrated circuit device
DE69030129T2 (en) Manufacturing process of a semiconductor integrated circuit
EP0416809A3 (en) Reduced size etching method for integrated circuits
GB9105973D0 (en) Method of forming a fine pattern on a semiconductor having a step therein
GB2159326B (en) A semiconductor integrated circuit device and method of production thereof
JPS558097A (en) Method of manufacturing semiconductor ic
GB2228619B (en) Method of fabricating semiconductor integrated circuits
EP0179196A3 (en) A method of forming a semiconductor device using a mask a method of forming a semiconductor device using a mask
DE3270064D1 (en) Electron beam pattern transfer device and method for aligning mask and semiconductor wafer
FR2531812B1 (en) &#34;BI-CMOS-IC&#34; TYPE INTEGRATED SEMICONDUCTOR CIRCUIT DEVICE AND ITS MANUFACTURING PROCESS
GB2212944B (en) Improved process in the manufacture of integrated circuits
JPS5585052A (en) Semiconductor integrated circuit and method of fabricating same
JPS5664464A (en) Method of manufacturing semiconductor integrated circuit
EP0485303A3 (en) Process for fabricating an integrated circuit by a repetition of exposure of a semiconductor pattern
GB2157495B (en) A method of producing a semiconductor integrated circuit device
JPS57204033A (en) Formation of fine pattern

Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19981130