GB2176063A - A probe card - Google Patents

A probe card Download PDF

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Publication number
GB2176063A
GB2176063A GB08611735A GB8611735A GB2176063A GB 2176063 A GB2176063 A GB 2176063A GB 08611735 A GB08611735 A GB 08611735A GB 8611735 A GB8611735 A GB 8611735A GB 2176063 A GB2176063 A GB 2176063A
Authority
GB
United Kingdom
Prior art keywords
card
probe
probes
probe card
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08611735A
Other versions
GB8611735D0 (en
Inventor
Michael Frederick Horgan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB8611735D0 publication Critical patent/GB8611735D0/en
Publication of GB2176063A publication Critical patent/GB2176063A/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A probe card adapted to test integrated circuit patterns and other microelectronic circuits or components comprises a metal, e.g. steel, substrate 7 forming the structural basis of the card, an electrically insulating coating 6, e.g. of ceramic or ceramic-glass, on the metal substrate and which is capable of receiving thick film printing, an opening in the metal substrate to provide access to the circuit pattern or component to be tested, a plurality of probes fixed to the insulating coating, e.g. by an adhesive or by soldering, and extending into the opening for engaging respective contacts on the circuit pattern or component to be tested, and electrical conductors on the insulating coating and connected to the probes, the electrical conductors being formed by thick film printing. <IMAGE>

Description

SPECIFICATION Probe cards The invention relates to probe cards of the kind adapted to test integrated circuit patterns and other microelectronic circuits or components. Such probe cards normally comprise a printed circuit board which forms the card, an opening being provided in the card to provide access to the circuit pattern or component to be tested, and a number of probes fixed to the card and extending into the opening to engage respective contacts on the. integrated circuit pattern being tested. The probes can be fixed to the card in various ways. For example U.S. patent specification No. 4,382,228 of Wentworth Laboratories Inc. describes a probe card in which a ring of conductive pads surround the opening in the card and rigid blade-like elements are secured, e.g. by soldering, to the conductive pads.The rigid blade-like elements in turn hold deflectable needles which are arranged to engage respective contacts in the pattern.
An alternative method of fixing the probes to the card comprises bedding the needles in an epoxy resin. It is also known to mount the needles on a ceramic ring.
It will be appreciated that the probes must be positioned on the card very accurately, and it is a disadvantage of known probe cards that conventional printed circuit boards do not provide an ideal structural member for supporting the probes at the probe densities now required, especially when the testing takes place at temperatures which are high or low as compared to normal room temperature.
It is an object of the invention to provide a probe card with improved stability at room temperature.
It is a further object of the invention to provide a probe card which may be used at elevated temperatures or for cryogenic testing. It is another object of the invention to provide a probe card capable of accepting additional circuitry, e.g. micro-circuitry or heavy components directly on the card.
According to the invention there is provided a probe card in which the conventional printed circuit board is replaced by an insulant coated metal substrate on which conductors for connecting to the probes are formed by thick film printing. The probes, which may take any desired form, can be fixed to the card with solder or with an adhesive such as an epoxy resin. The metal substrate may be of any suitable metal or alloy and is preferably of steel. As is well known, thick film printing comprises selecting suitable conductor inks and printing and firing the ink patterns on the insulating coating which is preferably of ceramic or ceramicglass.
The invention provides probe cards of improved stability compared with conventional printed circuit boards, which, unlike ceramic substrates, are capable of use as structural members, which are easily worked to any required shape, and which are capable of accepting thick film micro-circuitry and/or heavy electrical components directly on the card.
The invention is diagrammatically illustrated, by way of example, in the accompanying drawings, in which Figure 1 is a perspective view of a probe card, and Figure 2 is a section through the probe card of Figure 1.
In the drawings there is shown a probe card of the kind described in general in United States Patent Specification No. 4,382,228 of Wentworth Laboratories Inc. In the present case however the printed circuit board referenced 12 in US 4,382,228 is replaced by a steel substrate 7 coated at least on its upper surface with an insulating layer 6. Preferably the undersurface of the metal substrate 7 coated at least on its upper surface with an insulating layer 6. Preferably the undersurface of the metal substrate is also coated with an insulating layer 8.The insulating layer is of ceramic or of glass-ceramic e.g. that sold by Wade (Advanced Ceramics) Ltd. under the trade-name KERALLOY and is adapted to receive a deposit of thick film conductive track 1 which communicates between an edge connector 10 and.a probe needle 4 soldered to the thick film conductive track 1.
This technique not only provides a stable structural support for the probe needles but also permits micro-components 3 to be mounted directly on the card.
If desired (and provided that an insulating layer 8 is provided) micro-components 9 may be mounted on the undersurface of the card, in which case the conductive tracks 1 may communicate with the components 9 via through-holes 5 provided in the substrate 7. In this connection it will be noted that the insulating layer extends through the throughholes.
The invention thus provides a probe card for testing integrated circuit patterns of improved stability as compared with probe cards based on conventional printed circuit boards.
1. A probe card adapted to test integrated circuit patterns and other microelectronic circuits or components comprising a metal substrate forming the structural basis of the card, an electrically insulating coating on the metal substrate and which is capable of receiving thick film printing, an opening in the metal substrate to provide access to the circuit pattern or component to be tested, a plurality of probes fixed to the insulating coating and extending into the opening for engaging respective contacts on the circuit pattern or component to be tested, and electrical conductors on the insulating coating and connected to the probes, the electrical conductors being formed by thick film printing.
2. A probe card according to claim 1, wherein the probes are fixed to the insulating coating by soldering or by means of an adhesive.
3. A probe card according to claim 1 or claim 2, wherein the metal substrate is of steel.
4. A probe card according to any one of claims 1 to 3, wherein the insulating coating is of ceramic
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (6)

**WARNING** start of CLMS field may overlap end of DESC **. SPECIFICATION Probe cards The invention relates to probe cards of the kind adapted to test integrated circuit patterns and other microelectronic circuits or components. Such probe cards normally comprise a printed circuit board which forms the card, an opening being provided in the card to provide access to the circuit pattern or component to be tested, and a number of probes fixed to the card and extending into the opening to engage respective contacts on the. integrated circuit pattern being tested. The probes can be fixed to the card in various ways. For example U.S. patent specification No. 4,382,228 of Wentworth Laboratories Inc. describes a probe card in which a ring of conductive pads surround the opening in the card and rigid blade-like elements are secured, e.g. by soldering, to the conductive pads.The rigid blade-like elements in turn hold deflectable needles which are arranged to engage respective contacts in the pattern. An alternative method of fixing the probes to the card comprises bedding the needles in an epoxy resin. It is also known to mount the needles on a ceramic ring. It will be appreciated that the probes must be positioned on the card very accurately, and it is a disadvantage of known probe cards that conventional printed circuit boards do not provide an ideal structural member for supporting the probes at the probe densities now required, especially when the testing takes place at temperatures which are high or low as compared to normal room temperature. It is an object of the invention to provide a probe card with improved stability at room temperature. It is a further object of the invention to provide a probe card which may be used at elevated temperatures or for cryogenic testing. It is another object of the invention to provide a probe card capable of accepting additional circuitry, e.g. micro-circuitry or heavy components directly on the card. According to the invention there is provided a probe card in which the conventional printed circuit board is replaced by an insulant coated metal substrate on which conductors for connecting to the probes are formed by thick film printing. The probes, which may take any desired form, can be fixed to the card with solder or with an adhesive such as an epoxy resin. The metal substrate may be of any suitable metal or alloy and is preferably of steel. As is well known, thick film printing comprises selecting suitable conductor inks and printing and firing the ink patterns on the insulating coating which is preferably of ceramic or ceramicglass. The invention provides probe cards of improved stability compared with conventional printed circuit boards, which, unlike ceramic substrates, are capable of use as structural members, which are easily worked to any required shape, and which are capable of accepting thick film micro-circuitry and/or heavy electrical components directly on the card. The invention is diagrammatically illustrated, by way of example, in the accompanying drawings, in which Figure 1 is a perspective view of a probe card, and Figure 2 is a section through the probe card of Figure 1. In the drawings there is shown a probe card of the kind described in general in United States Patent Specification No. 4,382,228 of Wentworth Laboratories Inc. In the present case however the printed circuit board referenced 12 in US 4,382,228 is replaced by a steel substrate 7 coated at least on its upper surface with an insulating layer 6. Preferably the undersurface of the metal substrate 7 coated at least on its upper surface with an insulating layer 6. Preferably the undersurface of the metal substrate is also coated with an insulating layer 8.The insulating layer is of ceramic or of glass-ceramic e.g. that sold by Wade (Advanced Ceramics) Ltd. under the trade-name KERALLOY and is adapted to receive a deposit of thick film conductive track 1 which communicates between an edge connector 10 and.a probe needle 4 soldered to the thick film conductive track 1. This technique not only provides a stable structural support for the probe needles but also permits micro-components 3 to be mounted directly on the card. If desired (and provided that an insulating layer 8 is provided) micro-components 9 may be mounted on the undersurface of the card, in which case the conductive tracks 1 may communicate with the components 9 via through-holes 5 provided in the substrate 7. In this connection it will be noted that the insulating layer extends through the throughholes. The invention thus provides a probe card for testing integrated circuit patterns of improved stability as compared with probe cards based on conventional printed circuit boards. CLAIMS
1. A probe card adapted to test integrated circuit patterns and other microelectronic circuits or components comprising a metal substrate forming the structural basis of the card, an electrically insulating coating on the metal substrate and which is capable of receiving thick film printing, an opening in the metal substrate to provide access to the circuit pattern or component to be tested, a plurality of probes fixed to the insulating coating and extending into the opening for engaging respective contacts on the circuit pattern or component to be tested, and electrical conductors on the insulating coating and connected to the probes, the electrical conductors being formed by thick film printing.
2. A probe card according to claim 1, wherein the probes are fixed to the insulating coating by soldering or by means of an adhesive.
3. A probe card according to claim 1 or claim 2, wherein the metal substrate is of steel.
4. A probe card according to any one of claims 1 to 3, wherein the insulating coating is of ceramic or ceramic-glass.
5. A probe card according to any preceding claim, comprising thick film micro-circuitry and/or heavy electrical components on the insulating coating.
6. A probe card substantially as hereinbefore described with reference to, and as illustrated in, the accompanying drawings.
GB08611735A 1985-05-22 1986-05-14 A probe card Withdrawn GB2176063A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858512916A GB8512916D0 (en) 1985-05-22 1985-05-22 Probe cards

Publications (2)

Publication Number Publication Date
GB8611735D0 GB8611735D0 (en) 1986-06-25
GB2176063A true GB2176063A (en) 1986-12-10

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
GB858512916A Pending GB8512916D0 (en) 1985-05-22 1985-05-22 Probe cards
GB08611735A Withdrawn GB2176063A (en) 1985-05-22 1986-05-14 A probe card

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB858512916A Pending GB8512916D0 (en) 1985-05-22 1985-05-22 Probe cards

Country Status (1)

Country Link
GB (2) GB8512916D0 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928062A (en) * 1988-01-20 1990-05-22 Texas Instruments Incorporated Loading and accurate measurement of integrated dynamic parameters at point of contact in automatic device handlers
EP0708338A2 (en) * 1994-10-17 1996-04-24 Nihon Denshizairyo Kabushiki Kaisha Probe card for high temperature application

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB990023A (en) * 1961-03-13 1965-04-22 Ass Elect Ind Improvements relating to printed electrical circults
GB1254677A (en) * 1969-05-29 1971-11-24 Ibm Electrical contact device
GB1521614A (en) * 1977-02-17 1978-08-16 Int Computers Ltd Apparatus for testing circuit elements
GB2007152A (en) * 1977-08-30 1979-05-16 Kollmorgen Tech Corp Method of production of electrically contuctive panels and insulating base materials
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2144922A (en) * 1983-08-06 1985-03-13 Plessey Co Plc Substrate for thick-film electrical circuits

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB990023A (en) * 1961-03-13 1965-04-22 Ass Elect Ind Improvements relating to printed electrical circults
GB1254677A (en) * 1969-05-29 1971-11-24 Ibm Electrical contact device
GB1521614A (en) * 1977-02-17 1978-08-16 Int Computers Ltd Apparatus for testing circuit elements
GB2007152A (en) * 1977-08-30 1979-05-16 Kollmorgen Tech Corp Method of production of electrically contuctive panels and insulating base materials
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
GB2133934A (en) * 1983-01-17 1984-08-01 Plessey Co Plc Improvements relating to thick film circuits
GB2144922A (en) * 1983-08-06 1985-03-13 Plessey Co Plc Substrate for thick-film electrical circuits

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4928062A (en) * 1988-01-20 1990-05-22 Texas Instruments Incorporated Loading and accurate measurement of integrated dynamic parameters at point of contact in automatic device handlers
EP0708338A2 (en) * 1994-10-17 1996-04-24 Nihon Denshizairyo Kabushiki Kaisha Probe card for high temperature application
EP0708338A3 (en) * 1994-10-17 1996-07-31 Nihon Denshizairyo Kk Probe card for high temperature application

Also Published As

Publication number Publication date
GB8611735D0 (en) 1986-06-25
GB8512916D0 (en) 1985-06-26

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)