GB2174108B - Method for forming a polycrystalline silicon thin film - Google Patents
Method for forming a polycrystalline silicon thin filmInfo
- Publication number
- GB2174108B GB2174108B GB8608218A GB8608218A GB2174108B GB 2174108 B GB2174108 B GB 2174108B GB 8608218 A GB8608218 A GB 8608218A GB 8608218 A GB8608218 A GB 8608218A GB 2174108 B GB2174108 B GB 2174108B
- Authority
- GB
- United Kingdom
- Prior art keywords
- forming
- thin film
- polycrystalline silicon
- silicon thin
- polycrystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7320085A JPS61230317A (ja) | 1985-04-04 | 1985-04-04 | 多結晶質薄膜の形成方法 |
JP29496285A JPS62149115A (ja) | 1985-12-23 | 1985-12-23 | 多結晶シリコン薄膜の形成方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8608218D0 GB8608218D0 (en) | 1986-05-08 |
GB2174108A GB2174108A (en) | 1986-10-29 |
GB2174108B true GB2174108B (en) | 1989-07-19 |
Family
ID=26414350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8608218A Expired GB2174108B (en) | 1985-04-04 | 1986-04-04 | Method for forming a polycrystalline silicon thin film |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2579911B1 (enrdf_load_stackoverflow) |
GB (1) | GB2174108B (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19955287A1 (de) * | 1999-11-17 | 2001-08-02 | Bosch Gmbh Robert | Verfahren zum Herstellen von dotiertem polykristallinem Silicium für piezoresistive Anordnungen |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB992677A (en) * | 1961-11-06 | 1965-05-19 | Berghaus Elektrophysik Anst | Method of increasing the efficiency of nuclear reactors |
GB1234312A (enrdf_load_stackoverflow) * | 1968-06-28 | 1971-06-03 | ||
GB1427674A (en) * | 1973-03-05 | 1976-03-10 | Suwa Seikosha Kk | Process for coating a material onto a timepiece part |
US4091138A (en) * | 1975-02-12 | 1978-05-23 | Sumitomo Bakelite Company Limited | Insulating film, sheet, or plate material with metallic coating and method for manufacturing same |
GB1532759A (en) * | 1976-09-30 | 1978-11-22 | Siemens Ag | Production of monocrystalline layers on substrates |
EP0029747A1 (en) * | 1979-11-27 | 1981-06-03 | Konica Corporation | An apparatus for vacuum deposition and a method for forming a thin film by the use thereof |
GB1598814A (en) * | 1978-05-15 | 1981-09-23 | Atomic Energy Authority Uk | Cemented carbide cutting tools |
GB2090291A (en) * | 1980-12-22 | 1982-07-07 | Secr Defence | Sputter ion plating of refractory metal/metal compounds |
EP0075368A2 (fr) * | 1981-09-18 | 1983-03-30 | Laboratoires D'electronique Et De Physique Appliquee L.E.P. | Procédé de fabrication d'un dispositif semi-conducteur en GaAs par implantations ioniques, ainsi que substrat et dispositif ainsi obtenus |
EP0193021A1 (en) * | 1985-02-27 | 1986-09-03 | International Business Machines Corporation | A method of forming an ion implanted gallium arsenide device |
EP0195867A2 (en) * | 1985-03-27 | 1986-10-01 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device including an implantation step |
GB2185624A (en) * | 1986-01-21 | 1987-07-22 | Motorola Inc | Stabilizing polycrystalline semiconductor surfaces |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2631881C2 (de) * | 1975-07-18 | 1982-11-25 | Futaba Denshi Kogyo K.K., Mobara, Chiba | Verfahren zur Herstellung eines Halbleiterbauelementes |
JPS5617083A (en) * | 1979-07-20 | 1981-02-18 | Hitachi Ltd | Semiconductor device and its manufacture |
-
1986
- 1986-04-04 GB GB8608218A patent/GB2174108B/en not_active Expired
- 1986-04-04 FR FR8604894A patent/FR2579911B1/fr not_active Expired
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB992677A (en) * | 1961-11-06 | 1965-05-19 | Berghaus Elektrophysik Anst | Method of increasing the efficiency of nuclear reactors |
GB1234312A (enrdf_load_stackoverflow) * | 1968-06-28 | 1971-06-03 | ||
GB1427674A (en) * | 1973-03-05 | 1976-03-10 | Suwa Seikosha Kk | Process for coating a material onto a timepiece part |
US4091138A (en) * | 1975-02-12 | 1978-05-23 | Sumitomo Bakelite Company Limited | Insulating film, sheet, or plate material with metallic coating and method for manufacturing same |
GB1532759A (en) * | 1976-09-30 | 1978-11-22 | Siemens Ag | Production of monocrystalline layers on substrates |
GB1598814A (en) * | 1978-05-15 | 1981-09-23 | Atomic Energy Authority Uk | Cemented carbide cutting tools |
EP0029747A1 (en) * | 1979-11-27 | 1981-06-03 | Konica Corporation | An apparatus for vacuum deposition and a method for forming a thin film by the use thereof |
GB2090291A (en) * | 1980-12-22 | 1982-07-07 | Secr Defence | Sputter ion plating of refractory metal/metal compounds |
EP0075368A2 (fr) * | 1981-09-18 | 1983-03-30 | Laboratoires D'electronique Et De Physique Appliquee L.E.P. | Procédé de fabrication d'un dispositif semi-conducteur en GaAs par implantations ioniques, ainsi que substrat et dispositif ainsi obtenus |
EP0193021A1 (en) * | 1985-02-27 | 1986-09-03 | International Business Machines Corporation | A method of forming an ion implanted gallium arsenide device |
EP0195867A2 (en) * | 1985-03-27 | 1986-10-01 | Kabushiki Kaisha Toshiba | Method of manufacturing a semiconductor device including an implantation step |
GB2185624A (en) * | 1986-01-21 | 1987-07-22 | Motorola Inc | Stabilizing polycrystalline semiconductor surfaces |
Also Published As
Publication number | Publication date |
---|---|
FR2579911A1 (enrdf_load_stackoverflow) | 1986-10-10 |
GB8608218D0 (en) | 1986-05-08 |
FR2579911B1 (enrdf_load_stackoverflow) | 1991-03-29 |
GB2174108A (en) | 1986-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19990404 |