GB2156862B - Cathode sputtering unit - Google Patents
Cathode sputtering unitInfo
- Publication number
- GB2156862B GB2156862B GB08508836A GB8508836A GB2156862B GB 2156862 B GB2156862 B GB 2156862B GB 08508836 A GB08508836 A GB 08508836A GB 8508836 A GB8508836 A GB 8508836A GB 2156862 B GB2156862 B GB 2156862B
- Authority
- GB
- United Kingdom
- Prior art keywords
- cathode sputtering
- sputtering unit
- unit
- cathode
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843413001 DE3413001A1 (de) | 1984-04-06 | 1984-04-06 | Katodenzerstaeubungsanlage mit nebeneinander angeordneten stationen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8508836D0 GB8508836D0 (en) | 1985-05-09 |
| GB2156862A GB2156862A (en) | 1985-10-16 |
| GB2156862B true GB2156862B (en) | 1986-10-22 |
Family
ID=6232865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08508836A Expired GB2156862B (en) | 1984-04-06 | 1985-04-04 | Cathode sputtering unit |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4595483A (enExample) |
| JP (1) | JPS60230980A (enExample) |
| DE (1) | DE3413001A1 (enExample) |
| FR (1) | FR2562560B1 (enExample) |
| GB (1) | GB2156862B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4701251A (en) * | 1986-02-03 | 1987-10-20 | Bvt Limited | Apparatus for sputter coating discs |
| US5019233A (en) * | 1988-10-31 | 1991-05-28 | Eaton Corporation | Sputtering system |
| DE3912297C2 (de) * | 1989-04-14 | 1996-07-18 | Leybold Ag | Katodenzerstäubungsanlage |
| DE3912296C2 (de) * | 1989-04-14 | 1996-07-18 | Leybold Ag | Vorrichtung zur Aufnahme und Halterung von Substraten |
| DE3912295C2 (de) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Katodenzerstäubungsanlage |
| JP3466607B2 (ja) * | 1989-09-13 | 2003-11-17 | ソニー株式会社 | スパッタリング装置 |
| US5322606A (en) * | 1991-12-26 | 1994-06-21 | Xerox Corporation | Use of rotary solenoid as a shutter actuator on a rotating arm |
| US5482607A (en) * | 1992-09-21 | 1996-01-09 | Nissin Electric Co., Ltd. | Film forming apparatus |
| DE4312014A1 (de) * | 1993-04-13 | 1994-10-20 | Leybold Ag | Vorrichtung zum Beschichten und/oder Ätzen von Substraten in einer Vakuumkammer |
| US8679307B2 (en) * | 2002-08-02 | 2014-03-25 | E.A. Fischione Instruments, Inc. | Method and apparatus for preparing specimens for microscopy |
| EP3091561B1 (en) * | 2015-05-06 | 2019-09-04 | safematic GmbH | Sputter unit |
| AT519107B1 (de) * | 2017-01-23 | 2018-04-15 | Miba Gleitlager Austria Gmbh | Verfahren zur Herstellung eines Mehrschichtgleitlagerelementes |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5130764B2 (enExample) * | 1971-11-02 | 1976-09-02 | ||
| DE2330710A1 (de) * | 1973-06-16 | 1975-01-09 | Leybold Heraeus Gmbh & Co Kg | Vakuumaufdampfvorrichtung mit mehreren kammern |
| US3981791A (en) * | 1975-03-10 | 1976-09-21 | Signetics Corporation | Vacuum sputtering apparatus |
| JPS53124968A (en) * | 1977-04-08 | 1978-10-31 | Hitachi Ltd | Continuous vapor deposition apparatus |
| DE2932483A1 (de) * | 1979-08-10 | 1981-04-02 | Leybold-Heraeus GmbH, 5000 Köln | Testglashalter mit einer drehbaren platine und mehreren ausnehmungen fuer testglaeser |
| DE2932438C3 (de) * | 1979-08-10 | 1982-03-11 | Aeg-Elotherm Gmbh, 5630 Remscheid | Halbschaleninduktor zur induktiven Oberflächenerwärmung von wellenförmig ausgebildeten Werkstücken |
| JPS5643158U (enExample) * | 1979-09-11 | 1981-04-20 | ||
| JPS5730341A (en) * | 1980-07-30 | 1982-02-18 | Anelva Corp | Substrate processing device |
| US4433951A (en) * | 1981-02-13 | 1984-02-28 | Lam Research Corporation | Modular loadlock |
| US4450062A (en) * | 1981-12-22 | 1984-05-22 | Raytheon Company | Sputtering apparatus and methods |
| US4444643A (en) * | 1982-09-03 | 1984-04-24 | Gartek Systems, Inc. | Planar magnetron sputtering device |
| JPH0666298B2 (ja) * | 1983-02-03 | 1994-08-24 | 日電アネルバ株式会社 | ドライエッチング装置 |
| DE3306870A1 (de) * | 1983-02-26 | 1984-08-30 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum herstellen von schichten mit rotationssymmetrischem dickenprofil durch katodenzerstaeubung |
| US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
| US4547247A (en) * | 1984-03-09 | 1985-10-15 | Tegal Corporation | Plasma reactor chuck assembly |
| US4548699A (en) * | 1984-05-17 | 1985-10-22 | Varian Associates, Inc. | Transfer plate rotation system |
-
1984
- 1984-04-06 DE DE19843413001 patent/DE3413001A1/de active Granted
-
1985
- 1985-03-28 US US06/716,854 patent/US4595483A/en not_active Expired - Fee Related
- 1985-04-02 FR FR8504972A patent/FR2562560B1/fr not_active Expired
- 1985-04-04 GB GB08508836A patent/GB2156862B/en not_active Expired
- 1985-04-05 JP JP60071289A patent/JPS60230980A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2562560A1 (fr) | 1985-10-11 |
| US4595483A (en) | 1986-06-17 |
| FR2562560B1 (fr) | 1989-07-28 |
| JPS60230980A (ja) | 1985-11-16 |
| DE3413001A1 (de) | 1985-10-17 |
| GB8508836D0 (en) | 1985-05-09 |
| DE3413001C2 (enExample) | 1991-08-29 |
| GB2156862A (en) | 1985-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19940404 |