GB2126802B - High density packaging for electronic circuits - Google Patents
High density packaging for electronic circuitsInfo
- Publication number
- GB2126802B GB2126802B GB08225182A GB8225182A GB2126802B GB 2126802 B GB2126802 B GB 2126802B GB 08225182 A GB08225182 A GB 08225182A GB 8225182 A GB8225182 A GB 8225182A GB 2126802 B GB2126802 B GB 2126802B
- Authority
- GB
- United Kingdom
- Prior art keywords
- high density
- electronic circuits
- density packaging
- packaging
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/046—Planar parts of folded PCBs making an angle relative to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08225182A GB2126802B (en) | 1982-09-03 | 1982-09-03 | High density packaging for electronic circuits |
DE19833330466 DE3330466A1 (en) | 1982-09-03 | 1983-08-24 | HIGH PACKING DENSITY ARRANGEMENT OF INTEGRATED CIRCUITS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08225182A GB2126802B (en) | 1982-09-03 | 1982-09-03 | High density packaging for electronic circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2126802A GB2126802A (en) | 1984-03-28 |
GB2126802B true GB2126802B (en) | 1985-06-05 |
Family
ID=10532681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08225182A Expired GB2126802B (en) | 1982-09-03 | 1982-09-03 | High density packaging for electronic circuits |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE3330466A1 (en) |
GB (1) | GB2126802B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228192A (en) * | 1990-10-29 | 1993-07-20 | Harris Corporation | Method of manufacturing a multi-layered ic packaging assembly |
IT1293021B1 (en) * | 1997-07-10 | 1999-02-11 | Sme Elettronica Spa | SEMICONDUCTOR POWER MODULE. |
RU2119276C1 (en) * | 1997-11-03 | 1998-09-20 | Закрытое акционерное общество "Техно-ТМ" | Three-dimensional flexible electronic module |
EP1430758B1 (en) * | 2001-09-27 | 2006-08-09 | Siemens Aktiengesellschaft | Electrical circuit arrangement comprised of a number of electrically interconnected circuit components |
EP2054934B1 (en) * | 2006-08-14 | 2013-04-24 | Koninklijke Philips Electronics N.V. | Deformable integrated circuit device |
EP2365740B1 (en) * | 2010-03-12 | 2018-08-22 | Omron Corporation | Illuminating device |
DE102013106305A1 (en) * | 2012-06-20 | 2013-12-24 | Samsung Electro-Mechanics Co., Ltd. | Portable terminal |
-
1982
- 1982-09-03 GB GB08225182A patent/GB2126802B/en not_active Expired
-
1983
- 1983-08-24 DE DE19833330466 patent/DE3330466A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE3330466A1 (en) | 1984-03-08 |
GB2126802A (en) | 1984-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |