GB2125220B - An arrangement for connecting an electrical component to a support - Google Patents
An arrangement for connecting an electrical component to a supportInfo
- Publication number
- GB2125220B GB2125220B GB08318917A GB8318917A GB2125220B GB 2125220 B GB2125220 B GB 2125220B GB 08318917 A GB08318917 A GB 08318917A GB 8318917 A GB8318917 A GB 8318917A GB 2125220 B GB2125220 B GB 2125220B
- Authority
- GB
- United Kingdom
- Prior art keywords
- arrangement
- support
- electrical component
- electrical
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10462—Flat component oriented parallel to the PCB surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Thyristors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19823226222 DE3226222A1 (de) | 1982-07-14 | 1982-07-14 | Einrichtung zur verbindung einer elektrode mit einem traeger |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8318917D0 GB8318917D0 (en) | 1983-08-17 |
| GB2125220A GB2125220A (en) | 1984-02-29 |
| GB2125220B true GB2125220B (en) | 1986-01-22 |
Family
ID=6168350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08318917A Expired GB2125220B (en) | 1982-07-14 | 1983-07-13 | An arrangement for connecting an electrical component to a support |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4467401A (enExample) |
| DE (1) | DE3226222A1 (enExample) |
| FR (1) | FR2530372B1 (enExample) |
| GB (1) | GB2125220B (enExample) |
| IT (2) | IT1163767B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4603373A (en) * | 1983-07-13 | 1986-07-29 | Electronic Concepts, Inc. | Outer wrapping for a metallized wound capacitor |
| GB2147148A (en) * | 1983-09-27 | 1985-05-01 | John Patrick Burke | Electronic circuit assembly |
| DE3437287A1 (de) * | 1984-10-11 | 1986-04-24 | Diehl GmbH & Co, 8500 Nürnberg | Anordnung und verfahren zum einbau einer elektronischen anzeige |
| DE3608166C1 (en) * | 1986-03-12 | 1987-11-05 | Diehl Gmbh & Co | Projectile having an oscillator circuit |
| JPH088131B2 (ja) * | 1989-08-25 | 1996-01-29 | 矢崎総業株式会社 | 可撓端子付フィルタコネクタ |
| DE10234948A1 (de) * | 2002-07-31 | 2003-10-30 | Siemens Ag | Verfahren zum Umhüllen eines elektronischen Bauelementes sowie nach diesem Verfahren hergestelltes elektronisches Bauelement |
| US9614522B2 (en) * | 2011-09-22 | 2017-04-04 | Behr-Hella Thermocontrol Gmbh | Operating device for a vehicle component with a front wall associated with a capacitative proximity sensor |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE7839001U1 (de) * | 1982-06-09 | Ero Tantal Kondensatoren Gmbh, 8300 Landshut | Elektrisches Bauelement | |
| GB564971A (en) * | 1943-09-28 | 1944-10-20 | Dubilier Condenser Co 1925 Ltd | Improvements in or relating to casings for electrical condensers or other electricaldevices |
| GB704365A (en) * | 1951-02-28 | 1954-02-17 | Standard Coil Prod Co Inc | Improvements in printed circuits |
| US2751665A (en) * | 1951-04-16 | 1956-06-26 | Int Standard Electric Corp | Method of mounting an electric condenser or other electric components in a metal case |
| US2894316A (en) * | 1955-01-21 | 1959-07-14 | Chicago Condenser Corp | Method of spacing capacitor leads |
| US3060356A (en) * | 1956-05-14 | 1962-10-23 | Cornell Dubilier Electric | Tubular capacitor and method of making same |
| DE1127475B (de) * | 1958-11-05 | 1962-04-12 | Ducati Elettrotecnica Spa | Elektrolytkondensator |
| DE1138478B (de) * | 1961-03-22 | 1962-10-25 | Ducati Elettrotecnica Spa | Elektrolyt-Kondensator mit Massekontakt |
| GB1373812A (en) * | 1971-03-02 | 1974-11-13 | Plessey Co Ltd | Woundfilm dry capacitors |
| US3828227A (en) * | 1973-04-09 | 1974-08-06 | Sprague Electric Co | Solid tantalum capacitor with end cap terminals |
| DE2426541A1 (de) * | 1973-09-07 | 1975-03-20 | Siemens Ag | Elektrolytkondensator und verfahren zu seiner herstellung |
| IN140573B (enExample) * | 1973-09-28 | 1976-12-04 | Rca Corp | |
| DE2727823A1 (de) * | 1977-06-21 | 1979-01-11 | Licentia Gmbh | Becher zur aufnahme eines elektrischen bauelements |
| JPS5915376B2 (ja) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | 電子回路部品 |
| JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
| DE2825935C2 (de) * | 1978-06-14 | 1983-07-07 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Wickelkondensator-Anordnung |
-
1982
- 1982-07-14 DE DE19823226222 patent/DE3226222A1/de active Granted
-
1983
- 1983-07-12 US US06/513,000 patent/US4467401A/en not_active Expired - Fee Related
- 1983-07-13 GB GB08318917A patent/GB2125220B/en not_active Expired
- 1983-07-13 IT IT22035/83A patent/IT1163767B/it active
- 1983-07-13 FR FR8311678A patent/FR2530372B1/fr not_active Expired
- 1983-07-13 IT IT8322343U patent/IT8322343V0/it unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US4467401A (en) | 1984-08-21 |
| GB2125220A (en) | 1984-02-29 |
| IT8322035A0 (it) | 1983-07-13 |
| GB8318917D0 (en) | 1983-08-17 |
| FR2530372B1 (fr) | 1985-06-28 |
| DE3226222C2 (enExample) | 1988-06-23 |
| FR2530372A1 (fr) | 1984-01-20 |
| IT1163767B (it) | 1987-04-08 |
| IT8322343V0 (it) | 1983-07-13 |
| DE3226222A1 (de) | 1984-01-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |