GB2110475A - Substrate for hybrid and printed circuits - Google Patents

Substrate for hybrid and printed circuits Download PDF

Info

Publication number
GB2110475A
GB2110475A GB08133262A GB8133262A GB2110475A GB 2110475 A GB2110475 A GB 2110475A GB 08133262 A GB08133262 A GB 08133262A GB 8133262 A GB8133262 A GB 8133262A GB 2110475 A GB2110475 A GB 2110475A
Authority
GB
United Kingdom
Prior art keywords
substrate
alloy
hybrid
components
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08133262A
Other languages
English (en)
Inventor
Christopher John Ransom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Priority to GB08133262A priority Critical patent/GB2110475A/en
Priority to GB08227748A priority patent/GB2111312A/en
Priority to CA000414414A priority patent/CA1193752A/en
Priority to DE8282201370T priority patent/DE3279793D1/de
Priority to EP82201370A priority patent/EP0078582B1/en
Priority to AU90125/82A priority patent/AU565240B2/en
Priority to JP57193902A priority patent/JPS58100481A/ja
Publication of GB2110475A publication Critical patent/GB2110475A/en
Priority to US07/233,924 priority patent/US4912284A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB08133262A 1981-11-04 1981-11-04 Substrate for hybrid and printed circuits Withdrawn GB2110475A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB08133262A GB2110475A (en) 1981-11-04 1981-11-04 Substrate for hybrid and printed circuits
GB08227748A GB2111312A (en) 1981-11-04 1982-09-29 Substrates for electrical circuits
CA000414414A CA1193752A (en) 1981-11-04 1982-10-28 Electrical circuits
DE8282201370T DE3279793D1 (en) 1981-11-04 1982-11-01 Electrical circuits
EP82201370A EP0078582B1 (en) 1981-11-04 1982-11-01 Electrical circuits
AU90125/82A AU565240B2 (en) 1981-11-04 1982-11-03 Electrical circuits formed on a substrate
JP57193902A JPS58100481A (ja) 1981-11-04 1982-11-04 電気回路
US07/233,924 US4912284A (en) 1981-11-04 1988-08-16 Electrical circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08133262A GB2110475A (en) 1981-11-04 1981-11-04 Substrate for hybrid and printed circuits

Publications (1)

Publication Number Publication Date
GB2110475A true GB2110475A (en) 1983-06-15

Family

ID=10525627

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08133262A Withdrawn GB2110475A (en) 1981-11-04 1981-11-04 Substrate for hybrid and printed circuits

Country Status (3)

Country Link
JP (1) JPS58100481A (enExample)
CA (1) CA1193752A (enExample)
GB (1) GB2110475A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3447520A1 (de) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol Verbundleiterplatte, verfahren zur herstellung einer verbundleiterplatte und verwendung von aluminiumoxyd als isolierende schicht einer verbundleiterplatte

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917879A (ja) * 1982-07-19 1984-01-30 Mitsubishi Electric Corp 交流エレベ−タの制御装置
JPS6149827A (ja) * 1984-08-17 1986-03-11 Mitsubishi Electric Corp 対向液圧成形法
JPS6149831A (ja) * 1985-06-10 1986-03-11 Shiro Ono チユ−ブ状包装袋の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3447520A1 (de) * 1984-12-27 1986-08-14 Metallwerk Plansee GmbH, Reutte, Tirol Verbundleiterplatte, verfahren zur herstellung einer verbundleiterplatte und verwendung von aluminiumoxyd als isolierende schicht einer verbundleiterplatte

Also Published As

Publication number Publication date
JPS58100481A (ja) 1983-06-15
JPH0334676B2 (enExample) 1991-05-23
CA1193752A (en) 1985-09-17

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)