GB2110475A - Substrate for hybrid and printed circuits - Google Patents
Substrate for hybrid and printed circuits Download PDFInfo
- Publication number
- GB2110475A GB2110475A GB8133262A GB8133262A GB2110475A GB 2110475 A GB2110475 A GB 2110475A GB 8133262 A GB8133262 A GB 8133262A GB 8133262 A GB8133262 A GB 8133262A GB 2110475 A GB2110475 A GB 2110475A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- alloy
- hybrid
- components
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 5
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 238000005555 metalworking Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- -1 iron-chromium- aluminium Chemical compound 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8133262A GB2110475A (en) | 1981-11-04 | 1981-11-04 | Substrate for hybrid and printed circuits |
| GB08227748A GB2111312A (en) | 1981-11-04 | 1982-09-29 | Substrates for electrical circuits |
| CA000414414A CA1193752A (en) | 1981-11-04 | 1982-10-28 | Electrical circuits |
| DE8282201370T DE3279793D1 (en) | 1981-11-04 | 1982-11-01 | Electrical circuits |
| EP82201370A EP0078582B1 (en) | 1981-11-04 | 1982-11-01 | Electrical circuits |
| AU90125/82A AU565240B2 (en) | 1981-11-04 | 1982-11-03 | Electrical circuits formed on a substrate |
| JP19390282A JPS58100481A (ja) | 1981-11-04 | 1982-11-04 | 電気回路 |
| US07/233,924 US4912284A (en) | 1981-11-04 | 1988-08-16 | Electrical circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8133262A GB2110475A (en) | 1981-11-04 | 1981-11-04 | Substrate for hybrid and printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2110475A true GB2110475A (en) | 1983-06-15 |
Family
ID=10525627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8133262A Withdrawn GB2110475A (en) | 1981-11-04 | 1981-11-04 | Substrate for hybrid and printed circuits |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS58100481A (enrdf_load_stackoverflow) |
| CA (1) | CA1193752A (enrdf_load_stackoverflow) |
| GB (1) | GB2110475A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2162694A (en) * | 1984-08-04 | 1986-02-05 | British Aerospace | Printed circuits |
| DE3447520A1 (de) * | 1984-12-27 | 1986-08-14 | Metallwerk Plansee GmbH, Reutte, Tirol | Verbundleiterplatte, verfahren zur herstellung einer verbundleiterplatte und verwendung von aluminiumoxyd als isolierende schicht einer verbundleiterplatte |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917879A (ja) * | 1982-07-19 | 1984-01-30 | Mitsubishi Electric Corp | 交流エレベ−タの制御装置 |
| JPS6149827A (ja) * | 1984-08-17 | 1986-03-11 | Mitsubishi Electric Corp | 対向液圧成形法 |
| JPS6149831A (ja) * | 1985-06-10 | 1986-03-11 | Shiro Ono | チユ−ブ状包装袋の製造方法 |
-
1981
- 1981-11-04 GB GB8133262A patent/GB2110475A/en not_active Withdrawn
-
1982
- 1982-10-28 CA CA000414414A patent/CA1193752A/en not_active Expired
- 1982-11-04 JP JP19390282A patent/JPS58100481A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2162694A (en) * | 1984-08-04 | 1986-02-05 | British Aerospace | Printed circuits |
| DE3447520A1 (de) * | 1984-12-27 | 1986-08-14 | Metallwerk Plansee GmbH, Reutte, Tirol | Verbundleiterplatte, verfahren zur herstellung einer verbundleiterplatte und verwendung von aluminiumoxyd als isolierende schicht einer verbundleiterplatte |
Also Published As
| Publication number | Publication date |
|---|---|
| CA1193752A (en) | 1985-09-17 |
| JPS58100481A (ja) | 1983-06-15 |
| JPH0334676B2 (enrdf_load_stackoverflow) | 1991-05-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |