GB2107928A - Solar cell assembly - Google Patents
Solar cell assembly Download PDFInfo
- Publication number
- GB2107928A GB2107928A GB08228985A GB8228985A GB2107928A GB 2107928 A GB2107928 A GB 2107928A GB 08228985 A GB08228985 A GB 08228985A GB 8228985 A GB8228985 A GB 8228985A GB 2107928 A GB2107928 A GB 2107928A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solar cell
- solder
- bus bars
- bus bar
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000004027 cell Anatomy 0.000 claims abstract description 119
- 229910000679 solder Inorganic materials 0.000 claims abstract description 55
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- 238000007598 dipping method Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 42
- 229910052759 nickel Inorganic materials 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001562081 Ikeda Species 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Bus bars (30) are applied to a solar cell (12) by one single solder dipping operation. The bus bars (30) are first temporarily spot attached to the pre-metallised surface of a solar cell by means of a high temperature adhesive (36). The solar cell and bus bars are then solder dipped allowing the solder to flow between the bus bars and solar cell surface by capillary action, adjacent the adhesive. <IMAGE>
Description
SPECIFICATION
Solar cell assembly
The present invention relates to solar cells and in particular, though not exclusively, to solar cells having a conductive electrode pattern and bus bar interconnect which is applied to the solar cell in a single solder dipping procedure.
Photovoltaic devices such as silicon solar cells promise a viable alternative to non-replenishable fossil fuel energy generation. Light energy (photons) incident on a solar cell's surface must enter and be absorbed within the cell to be converted to an electrical current. The electrical current is carried by electrodes to bus bars which are attached to inter-connectors which join many cells together to form a solar panel. In the prior art, bus bars are sometimes directly attached to the solar cell by induction heating or other soldering means. Leads to the bus connections are also sometimes soldered directly upon the solar cell.
This has the disadvantage of subjecting the solar cell to an additional heating step, and additional thermal stress. This can damage the solar cell. In contrast, in a preferred way of performing the present invention, the bus bars are attached by a solder dipping process and means for interconnecting cells without further subjecting cells to heat which can damage the solar cell is provided. Possible cracking of the solar cell is prevented or greatly reduced. In one embodiment of the present invention the bus bars extend beyond the solar cell periphery and thus serve as inter-connectors to electrically connect the solar cells together, thus eliminating direct soldering upon the solar cell. In addition, the present invention can be put into effect so as to provide a means of attaching the bus bars and making a premetallised grid conductive in a single solder dipping procedure.
The U.S. patents to J. Lebrun and J. Ikeda, U.S.
Patent Nos. 3,553,030 issued: January 5, 1971; and 4,312,692 issued: January 26, 1982, respectively, each teach the use of adhesives to secure electrical components to substrates to prior to soldering. These patents generally teach overcoating the adhered component with solder.
Large substrate surfaces are adhesively coated, which prevents the solder from running under the component by capillary action. Usually only the periphery of the component is directly secured to the substrate. This type of adherence does not provide strong mechanical and electrical connection.
By contrast, embodiments of the present invention utilise a high temperature, pressuresensitive, double-stick adhesive, which is spot applied between bus bar and solar cell surface.
This spot application provides a clearance, whereby solder will flow by capillary action between the underside of the bus bar and the solar cell surface. Practically the entire underside of the bus bar is mechanically and electrically connected to the solar cell surface, making for a very strong connection. The pressure-sensitive adhesive also has the added advantage that it does not require a separate curing step to secure it in place as taught by Ikeda.
The high temperature adhesive is resistant to attack by the molten solder bath, and the doublestick application provides an ease of attachment not taught in the related art.
The invention from one aspect provides a solar cell assembly comprising a solar cell having a conductive surface thereon, a bus bar, adhesive material locating said bus bar separated from said solar cell, and conductive material beneath said bus bar adjacent said adhesive material, said material electrically connecting said bus bar to said conductive surface.
A second aspect of the invention is a solar cell assembly comprising a solar cell having a conductive grid disposed thereon and at least one bus bar attached to said solar cell by means of an adhesive and solder combination, said combination comprising spot applications of adhesive between said bus bar and said solar cell and solder disposed between, and electrically interconnecting, said bus bar and said grid adjacent said adhesive portions.
According to another aspect there is provided a solar cell assembly comprising spaced-apart bus bars attached and in electrical contact with a solar cell by means of solder dipped portions, said solder being disposed beneath said bus bars for substantially an entire portion of said bus bars where said bus bars are in electrical contact with said solar cell.
From a fourth aspect the invention provides a method of attaching a bus bar to a solar cell, comprising the steps of spot attaching said bus bar to a pre-metallised solar cell, and solder dipping said pre-metallised solar cell with said attached bus bar, whereby said solder will flow between said bus bar and said pre-metallised solar cell by capillary action.
The invention from another aspect provides a method of attaching bus bars to a surface of a premetallised solar cell, comprising the step of applying adhesive to portions of said bus bars, which bus bars are then fixed upon said premetallised solar cell by solder.
According to the invention from a still further aspect, there is provided a method of fabricating a solar cell assembly comprising the step of fixing bus bars to surfaces of a solar cell by solder dipping said solar cell in a solder bath with said bus bars temporarily attached thereto, each of said bus bars extending beyond said solar cell in order to interconnect with other solar cells.
Yet another aspect of the invention provides a method of affixing a grid pattern and at least one bus bar to a solar cell surface by means of a single solder dipping, comprising the step of solder dipping a solar cell having a pre-metallised grid and bus bars temporarily attached thereto.
Various ways of performing the invention provide a method for applying bus bars to a solar cell surface including the steps of: spot attaching the bus bars to the solar cell, and solder dipping the solar cell with the attached bus bars, wherein the solder will flow between the bus bars and solar cell by capillary action. The spot attachment provides a clearance between the bus bars and solar cell surface for allowing the molten solder to flow therebetween. The bus bars are caused to have a stronger mechanical and electrical bond to the conductive surface of the solar cell by means of the solder bond between the bus bars and the solar cell surface.
On an upper surface of the cell, the conductive surface may comprise a grid. A pre-metallised grid pattern is made conductive by application of the solder, which also serves to simultaneously attach the bus bars to the solar cell. The bus bars can be spot attached to the solar cell by means of a double-stick adhesive material, in the preferred embodiment.
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:~
Figure 1 shows a top view of one form of a solar cell with attached bus bars.
Figure 2 and 3 illustrate enlarged cross sectional views of the solar cell during successive steps in the fabrication technique.
Figure 4 shows an enlarged sectional side view of an alternative embodiment of a solar cell with attached bus bars.
Figure 5 shows an enlarged sectional view taken along lines 5-5 of Figure 1.
Figure 6 shows an enlarged sectional side view of two solar cells interconnected together.
The following description discloses a solar cell with a unique electrode pattern and bus bar arrangement and a method of attaching the electrode pattern and bus bars to the solar cell in one step operation enabling the interconnection of solar cells without reflowing the electrically conducting material (e.g. solder) that attaches the bus bars to the cell and forms the electrode of the cell.
Figure 1 shows the top view of a solar cell whose electrode pattern and bus bars have been formed in the manner to be described in detail below. Figures 2 and 3 show how the electrode pattern is formed. Figure 4 and 5 show the bus bar arrangement. Figure 6 shows the interconnection of two solar cells.
In Figure 2, a silicon wafer 8 having a first type conductivity region 10, which may comprise Ptype or N-type silicon, has diffused onto it an opposite type semiconductor material to form a region 12 of conductivity type opposite to that of region 10, forming a semiconductor junction otherwise termed a P-N (or N-P) junction in the region of the interface between regions 1 0 and
12. The diffusion and junction forming processes are well known in the art. Furthermore, the method of the present invention is operable for either N on P or P on N type cells.
Referring to Figure 1, in the finished solar cell
assembly electrodes 20 are shown (six are schematically depicted) running at right angles to the bus bars 30. The entire area that will be occupied by electrodes and bus bars is first made
conductive and solderable by deposition of a suitable metal layer such as nickel, or other suitable solderable materials including silver and
copper. Methods for deposition of such metal
layers, which provide the primary electrical contact to the silicon, are well-known in the prior art.
As an example, a thin electrolessly deposited
layer 18 of nickel is deposited on region 12. This
layer is in the form of an electrode pattern, for example produced by using a screening mask 16
as shown in Figure 2. A similar nickel layer 22 is deposited on the underside surface 11 of the solar cell but because layer 22 is not exposed to sunlight, it can be continuous as shown. Layers 1 8, 22 may be insufficiently conductive to serve as a suitable current carrying electrode for most solar cell applications. Accordingly, second conduction supportive electrode layers 20 and 21 comprising a relatively high electroconductivity
metal may be formed by solder dipping, electroplating or the like.In a preferred embodiment, the surface areas of the cell comprising at least the nickel electrode 1 8 is contacted with a solder flux agent and then with
molten solder to form layers 20, 22 comprising solder after the bus bars are fixed to the upper nickel surface.
Figure 5 shows a cross section view of the bus bar arrangement. Prior to the application of solder 20 to the cell as described above, the bus bars 30 are mechanically fixed to a portion 32 of the nickel plated electrode pattern. In this fixed position, the bus bars 30 and the nickel plated pattern 32 beneath the bus bars are colinear with a gap therebetween. The bus bar 30 is fixed to the nickel pattern 32 by a means that has a high temperature resistance. The reason for high temperature resistance is the requirement that the bus bar be fixed to the nickel electrode pattern with an electrical connection at the same time that the electrode layer 20 is formed. The electrically conducting material is usually applied or formed at elevated temperatures.For example, if the electrically conductive material is solder 34 as in the preferred embodiment, the means for fixing the bus bars 30 to the nickel electrode pattern 32 must operate at about 2000 C. The bus bars 30 may be of any suitable solderable material, although, preferred materials are copper or copper cladded invar.
A preferred method of fixing the bus bars 30 to the nickel electrode pattern 32 is to tape the bars to the nickel with double faced pressure sensitive tape 36 capable of operating within the temperature range of 1 800C to 2200 C. A tape of this type would include acrylic polymer adhesive tape. The tape 36 is applied with firm application pressure intermittently along the length of the bus bars 30. The bus bars 30 are then fixed to the nickel electrode pattern 32 by the tape 36. The cell may then be solder dipped so that solder 34 fills the space between the bus bars 30 and the nickel electrode pattern 32 in addition to covering the remaining electrode pattern so that the solder 20 and 34 form an electrically continuous conductor. The space between the bus bars and nickel allows for capillary action for solder to fill the space.An example of a suitable acrylic tape is 3M brand A~101SOTAC Type Y-9469 acrylic adhesive tape. The tape covers only a small area of the bus bar surface and remains with the cell as it is completed. The tape requires no curing and provides an elastic cushion which relieves internal stresses between bonded materials with different thermal expansion properties. A further consequence of using an acrylic adhesive is its added features of being a low out-gassing, practically inert, corrosive free polymer material inherently possessing long life stability and durability.
An ohmic electrode 21 (in Figure 3), and bus bars 40 (in Figure 5), are formed on the lower surface concurrent to the formation of layers 18 and 20 and bus bars 30. However, in the Figure 3 embodiment since the lower surface is not exposed to the incident sunlight, the nickel layer 22 may be a continuous layer totally covering the lower surface of region 10. In Figure 5, the bus bars 40 are fixed to the nickel layer 22 similarly to those on the top of the cell. That is, the bus bars 40 are fixed to the nickel layer 22 by double faced acrylic polymer pressure tape 26 placed intermittently along its length. The surface of the nickel layer 22 is coated with an electrically conducting material 21 such as solder, and the space between the bus bars 40 and the nickel layer 22 is filled with similar material 24 so that the conducting material 21 and 24 forms an electrically continuous layer.
Figure 4 shows an alternative embodiment of the bus bars 30 (only the upper bus bars are shown). Here the bars can be deformed around the tape to reduce the thickness of the solder 34 deposit which flows by capillary action between the bus bars 30 and the nickel electrode pattern 32. This reduced solder thickness will still provide a strong mechanical and electrical bond.
The bus bars 30 on the upper surface and bus bars 40 on the lower surface of the cell 8 extend beyond the edge of cell 8 a distance sufficient to serve as solar cell interconnects. These extensions 28 for the bus bar 30 and 42 for bus bar 40 serve as interconnects to electrically join one solar cell 8 to adjacent solar cells (see Figure 6) if more than one cell is used to form an array.
Therefore end 28 of bus bar 30 may be joined to end 42 of bus bar 42 without causing a reflow of solder on the cell 8.
As described, the bus bars are held in position on the solar cell by adhesive prior to the solder dipping stage, and the adhesive forms part of the finished solar cell assembly. However, other temporary locating means can be adopted than adhesive and such locating means can in some instances be removed from the solar cell assembly after the bus bars have been electrically connected with the solar cell by the solder or other electrically conductive material which may have been used.
Claims (11)
1. A solar cell assembly comprising a solar cell having a conductive surface thereon, a bus bar, adhesive material locating said bus bar separated from said solar cell, and conductive material beneath said bus bar adjacent said adhesive material, said material electrically connecting said bus bar to said conductive surface.
2. A solar cell assembly according to claim 1, wherein said conductive material is solder.
3. A solar cell assembly according to claim 1 or claim 2, wherein there are a plurality of spot adhesive portions spaced along said solar cell, and said conductive material is disposed between said adhesive portions and also between said bus bar and said conductive surface.
4. A solar cell assembly comprising a solar cell having a conductive grid disposed thereon and at least one bus bar attached to said solar cell by means of an adhesive and solder combination, said combination comprising spot applications of adhesive between said bus bar and said solar cell and solder disposed between and electrically interconnecting, said bus bar and said grid adjacent said adhesive portions.
5. A solar cell assembly comprising spacedapart bus bars attached and in electrical contact with a solar cell by means of solder dipped portions, said solder being disposed beneath said bus bars for substantially an entire portion of said bus bars where said bus bars are in electrical contact with said solar cell.
6. A solar cell assembly according to claim 5, wherein said bus bars are additionally attached to said solar cell by spot adhesives.
7. A method of attaching a bus bar to a solar cell, comprising the steps of spot attaching said bus bar to a pre-metallised solar cell, and solder dipping said pre-metallised solar cell with said attached bus bar, whereby said solder will flow between said bus bar and said pre-metallised solar cell by capillary action.
8. A method according to claim 7, wherein adhesive is used to spot attach said bus bar to said solar cell.
9. A method of attaching bus bars to a surface of a pre-metallised solar cell, comprising the step of applying adhesive to portions of said bus bars, which bus bars are then fixed upon said pre
metallised solar cell by solder.
10. A method of fabricating a solar cell assembly comprising the step of fixing bus bars to surfaces of a solar cell by solder dipping said solar cell in a solder bath with said bus bars temporarily attached thereto, each of said bus bars extending beyond said solar cell in order to interconnect with other solar cells.
11. A method of affixing a grid pattern and at least one bus bar to a solar cell surface by means of a single solder dipping, comprising the step of solder dipping a solar cell having a pre-metallised grid and bus bars temporarily attached thereto.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31032981A | 1981-10-09 | 1981-10-09 | |
| US06/383,221 US4542258A (en) | 1982-05-28 | 1982-05-28 | Bus bar interconnect for a solar cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2107928A true GB2107928A (en) | 1983-05-05 |
| GB2107928B GB2107928B (en) | 1986-04-30 |
Family
ID=26977344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08228985A Expired GB2107928B (en) | 1981-10-09 | 1982-10-11 | Solar cell assembly |
Country Status (6)
| Country | Link |
|---|---|
| AU (1) | AU8921882A (en) |
| DE (1) | DE3237391A1 (en) |
| ES (1) | ES281700Y (en) |
| FR (1) | FR2514565B1 (en) |
| GB (1) | GB2107928B (en) |
| IT (1) | IT1209468B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0115803A2 (en) * | 1983-02-05 | 1984-08-15 | TELEFUNKEN electronic GmbH | Disc-shaped photovoltaic cell |
| FR2651924A1 (en) * | 1989-09-08 | 1991-03-15 | Solarex Corp | SOLAR PANEL AND METHOD FOR ASSEMBLING SUCH A PANEL WITH ITS CELLS AND INTERCONNECTING ELEMENTS. |
| FR2725310A1 (en) * | 1994-09-30 | 1996-04-05 | Siemens Solar Gmbh | SOLAR CELL WITH NEW TYPE CONTACTS |
| WO2010063540A2 (en) * | 2008-12-04 | 2010-06-10 | Q-Cells Se | Solar cell system, solar cell module, and method for producing a solar cell system |
| EP1968120A3 (en) * | 2007-03-01 | 2010-07-14 | Sanyo Electric Co., Ltd. | Solar cell unit and solar cell module |
| EP1758175A4 (en) * | 2004-05-21 | 2010-07-28 | Neomax Materials Co Ltd | Electrode wire for solar battery |
| EP2234166A1 (en) * | 2009-03-27 | 2010-09-29 | KIOTO Photovoltaics GmbH | Method for manufacturing solar cell and solar cell |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3242791A1 (en) * | 1982-11-19 | 1984-05-24 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING ELECTRICAL CONTACTS FORMING FINGER ELECTRODE STRUCTURES ON AMORPHOUS SILICON SOLAR CELLS |
| DE19529306C2 (en) * | 1995-08-09 | 1997-07-17 | Siemens Solar Gmbh | Process for the production of wiring for solar cells |
| DE19617220A1 (en) * | 1996-04-30 | 1997-11-06 | Julian Dipl Ing Schueren | Solar generator |
| DE19804877A1 (en) * | 1998-02-09 | 1999-08-12 | Sunware Gmbh & Co Kg | Contacting system for plate-shaped solar cells |
| DE10136442A1 (en) * | 2001-07-26 | 2003-02-13 | Ralf Adelhelm | Solar cell contact grid, collector and connector contact surfaces manufacture positions connector contact surfaces to allow maximum packing density of solar cells |
| DE102011001673A1 (en) | 2011-03-30 | 2012-10-04 | Solarwatt Ag | Solar cell used in solar panel, has front soldered surface whose alignment line is not congruently arranged with respect to alignment line of front soldered surface |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1552078A (en) * | 1967-11-15 | 1969-01-03 | ||
| US4154998A (en) * | 1977-07-12 | 1979-05-15 | Trw Inc. | Solar array fabrication method and apparatus utilizing induction heating |
| JPS55127098A (en) * | 1979-03-09 | 1980-10-01 | Matsushita Electric Ind Co Ltd | Method of mounting electronic part |
-
1982
- 1982-10-08 ES ES1982281700U patent/ES281700Y/en not_active Expired
- 1982-10-08 FR FR8216886A patent/FR2514565B1/en not_active Expired
- 1982-10-08 AU AU89218/82A patent/AU8921882A/en not_active Abandoned
- 1982-10-08 IT IT8223677A patent/IT1209468B/en active
- 1982-10-08 DE DE19823237391 patent/DE3237391A1/en not_active Withdrawn
- 1982-10-11 GB GB08228985A patent/GB2107928B/en not_active Expired
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0115803A2 (en) * | 1983-02-05 | 1984-08-15 | TELEFUNKEN electronic GmbH | Disc-shaped photovoltaic cell |
| EP0115803A3 (en) * | 1983-02-05 | 1986-08-20 | TELEFUNKEN electronic GmbH | Disc-shaped photovoltaic cell |
| FR2651924A1 (en) * | 1989-09-08 | 1991-03-15 | Solarex Corp | SOLAR PANEL AND METHOD FOR ASSEMBLING SUCH A PANEL WITH ITS CELLS AND INTERCONNECTING ELEMENTS. |
| FR2725310A1 (en) * | 1994-09-30 | 1996-04-05 | Siemens Solar Gmbh | SOLAR CELL WITH NEW TYPE CONTACTS |
| EP1758175A4 (en) * | 2004-05-21 | 2010-07-28 | Neomax Materials Co Ltd | Electrode wire for solar battery |
| EP1758175B1 (en) | 2004-05-21 | 2016-05-04 | Hitachi Metals, Ltd. | Electrode wire for solar battery |
| EP3012872A3 (en) * | 2004-05-21 | 2016-08-17 | Hitachi Metals, Ltd. | Solar cell |
| EP3012872B1 (en) | 2004-05-21 | 2017-07-12 | Hitachi Metals, Ltd. | Solar cell |
| EP1968120A3 (en) * | 2007-03-01 | 2010-07-14 | Sanyo Electric Co., Ltd. | Solar cell unit and solar cell module |
| WO2010063540A2 (en) * | 2008-12-04 | 2010-06-10 | Q-Cells Se | Solar cell system, solar cell module, and method for producing a solar cell system |
| WO2010063540A3 (en) * | 2008-12-04 | 2011-04-07 | Q-Cells Se | Solar cell system, solar cell module, and method for producing a solar cell system |
| EP2234166A1 (en) * | 2009-03-27 | 2010-09-29 | KIOTO Photovoltaics GmbH | Method for manufacturing solar cell and solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| AU8921882A (en) | 1983-04-14 |
| GB2107928B (en) | 1986-04-30 |
| IT8223677A0 (en) | 1982-10-08 |
| IT1209468B (en) | 1989-08-30 |
| FR2514565B1 (en) | 1985-11-29 |
| FR2514565A1 (en) | 1983-04-15 |
| ES281700U (en) | 1985-03-01 |
| DE3237391A1 (en) | 1983-04-28 |
| ES281700Y (en) | 1985-10-16 |
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