GB2066590A - Test pin - Google Patents
Test pin Download PDFInfo
- Publication number
- GB2066590A GB2066590A GB8035306A GB8035306A GB2066590A GB 2066590 A GB2066590 A GB 2066590A GB 8035306 A GB8035306 A GB 8035306A GB 8035306 A GB8035306 A GB 8035306A GB 2066590 A GB2066590 A GB 2066590A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plunger
- spring
- test pin
- housing
- insert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Springs (AREA)
Abstract
A test pin (10) has a spring- loaded plunger (24) which is offset to one side to ensure electrical contact between it and a conductive housing (18). The means for providing the offset may comprise an upper portion (30) of a spring (28) bent to one side. <IMAGE>
Description
SPECIFICATION
Test pin
This invention relates to test pins useful, for example, in testing the electrical characteristics of printed circuit boards (PCB's).
Spring-loaded test pins are known in the art.
U.S. Patent 4,105,970 discloses a test pin assembly having a cylindrical plunger with a PCBcontacting crown, the plunger being slidably mounted within a tubular housing and spring biased. A problem that has been noted with such a construction is that occasionally there will be insufficient contact force between the lower portion of the plunger and the housing, resulting in lack of electrical contact between the PCB and the analyzing instrument.
It has been discovered that improved electrical contact can be provided for a test pin assembly by including means to bias the plunger, thereby improving electrical contact between the plunger and housing. In a preferred embodiment the upper portion of the spring that engages the plunger is tilted at an angie prior to its connection to the plunger in the assembly of the test pin and is offcenter.
Presently preferred embodiments of the invention will now be more particularly described by way of example and with reference to the accompanying drawings in which:
Fig. 1 is a vertical sectional view, partially broken away, of a portion of a test pin assembly of the invention; and
Fig. 2 is a side elevation view of the spring of one of the preferred embodiment.
There is shown in Fig. 1 portion 10 of an upper assembly of a test pin similar to that disclosed in
U.S. Patent 4105970. Tubular housing 12 has dimple 14 for frictionally engaging insert 1 6, which has edge 1 8 of narrow diameter. Plunger 20 has pointed crown 22 on its upper end, iarge diameter portion 24 and tapered portion 26, which is biased against upper edge 1 8 by spring 28. Housing 12, insert 16, and plunger 20 are all made of hardened beryllium copper, plated with nickel and then gold. Spring 28 is made of stainless steel 5/1000 of an inch in diameter with a total of 31 turns. Spring 28 has two windings 30 at its upper end which are of a smaller diameter and frictionally engage stud 32 of plunger 20. Fig.
1 is diagrammatic in that the left-hand side of insert 1 6 is not shown forced against the inner surface of the left-hand wall of housing 12, but in reality it is so forced by dimple 14. Although not evident in Fig. 1, the upper end windings 30 are offset 450 to the right with respect to the rest of the spring (Fig. 2), thereby forcing portion 24 of plunger 20 against the inner surface of the righthand wall of insert 18.
Operation of test pins is well known in the art.
With the test pin of the present invention, accidental, occasional undesired open circuits to the test pin crown are prevented.
Improved contact results not only from the forcing of plunger portion 24 against insert 18, but as well because of an electrical path through stud 32, the spring turns gripping it, and the top largerdiameter spring turn diagrammatically shown touching insert 1 6.
In another embodiment, the spring is symmetrical about a single straight line axis, but the stud axis is not coaxial therewith.
1. A test pin comprising: a tubular shaped housing, a plunger with a contacting end that is slidably mounted within said housing, a spring carried in said housing for resiliently biasing said plunger away from said spring, and means to offset said plunger to one side, whereby electrical contact between said plunger and said housing is improved.
2. The test pin of claim 1 in which said offset means is an upper smaller diameter portion of said spring bent to one side, said upper portion engaging said plunger.
3. A test pin substantially as hereinbefore described with reference to the accompanying drawings.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (3)
1. A test pin comprising: a tubular shaped housing, a plunger with a contacting end that is slidably mounted within said housing, a spring carried in said housing for resiliently biasing said plunger away from said spring, and means to offset said plunger to one side, whereby electrical contact between said plunger and said housing is improved.
2. The test pin of claim 1 in which said offset means is an upper smaller diameter portion of said spring bent to one side, said upper portion engaging said plunger.
3. A test pin substantially as hereinbefore described with reference to the accompanying drawings.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10702779A | 1979-12-26 | 1979-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2066590A true GB2066590A (en) | 1981-07-08 |
GB2066590B GB2066590B (en) | 1984-02-15 |
Family
ID=22314479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8035306A Expired GB2066590B (en) | 1979-12-26 | 1980-11-03 | Test pin |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5953507B2 (en) |
CA (1) | CA1162243A (en) |
DE (1) | DE3038937A1 (en) |
FR (1) | FR2472773B1 (en) |
GB (1) | GB2066590B (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2166913A (en) * | 1984-11-13 | 1986-05-14 | Tektronix Inc | Impedance matched test probe |
US4740746A (en) * | 1984-11-13 | 1988-04-26 | Tektronix, Inc. | Controlled impedance microcircuit probe |
FR2614105A1 (en) * | 1987-04-16 | 1988-10-21 | Teradyne Inc | APPARATUS AND PROBE FOR TESTING PRINTED CIRCUIT BOARDS |
FR2621701A1 (en) * | 1987-10-09 | 1989-04-14 | Feinmetall Gmbh | Contact device for test equipment |
US5189364A (en) * | 1990-07-30 | 1993-02-23 | Nhk Spring Co., Ltd. | Contact probe |
US5200695A (en) * | 1990-07-30 | 1993-04-06 | Nhk Spring Co., Ltd. | Contact probe |
US5254939A (en) * | 1992-03-20 | 1993-10-19 | Xandex, Inc. | Probe card system |
US5528158A (en) * | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
GB2346446A (en) * | 1999-02-03 | 2000-08-09 | Ando Electric | Electro-optic probe |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
US20160041055A1 (en) * | 2014-08-05 | 2016-02-11 | Cory Z. Bousquet | Small form factor pressure sensor |
US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
US10488289B2 (en) | 2016-04-11 | 2019-11-26 | Sensata Technologies, Inc. | Pressure sensors with plugs for cold weather protection and methods for manufacturing the plugs |
US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
US10871413B2 (en) | 2016-04-20 | 2020-12-22 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3225907A1 (en) * | 1982-07-10 | 1984-01-12 | Feinmetall Gmbh, 7033 Herrenberg | Elastic contact module for measuring and testing purposes |
DE3410093A1 (en) * | 1984-03-20 | 1985-10-03 | Feinmetall Gmbh, 7033 Herrenberg | Spring contact pin and a method for its production |
DE3424210A1 (en) * | 1984-06-30 | 1986-01-09 | Feinmetall Gmbh, 7033 Herrenberg | Contact element for a test adaptor |
JPS6179273U (en) * | 1984-10-29 | 1986-05-27 | ||
DE3441480A1 (en) * | 1984-11-13 | 1986-05-15 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH, 6384 Schmitten | CONTACT PEN |
DE3500227A1 (en) * | 1985-01-05 | 1986-07-10 | Riba-Prüftechnik GmbH, 7801 Schallstadt | Probe needle |
EP0292590A1 (en) * | 1987-05-26 | 1988-11-30 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Contact device for testing equipment |
DE3920850A1 (en) * | 1989-06-24 | 1991-01-10 | Feinmetall Gmbh | SPRING CONTACT PIN |
JPH0531656U (en) * | 1991-10-14 | 1993-04-27 | フランスベツド株式会社 | Bed device |
DE19511565A1 (en) * | 1995-03-29 | 1996-10-02 | Atg Test Systems Gmbh | Test adapter |
US5801544A (en) * | 1997-01-16 | 1998-09-01 | Delaware Capital Formation, Inc. | Spring probe and method for biasing |
US5781023A (en) * | 1997-01-31 | 1998-07-14 | Delware Capital Formation, Inc. | Hollow plunger test probe |
DE19811795C1 (en) * | 1998-03-18 | 1999-09-02 | Atg Test Systems Gmbh | Needle for test adapter for populated or unpopulated circuit boards |
JP5486760B2 (en) * | 2006-07-04 | 2014-05-07 | 株式会社エンプラス | Contact pin and socket for electrical parts |
DE102012101929B4 (en) * | 2012-03-07 | 2015-02-19 | Federnfabrik Dietz Gmbh | Spring sleeve, spring pin and method and apparatus for producing a spring sleeve and a spring pin |
JP6201138B2 (en) * | 2013-07-18 | 2017-09-27 | 株式会社トキワ | Cosmetic container |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3435168A (en) * | 1968-03-28 | 1969-03-25 | Pylon Co Inc | Electrical contact |
DE1765461B2 (en) * | 1968-05-22 | 1976-12-16 | Bossert, Anneliese, 7530 Pforzheim | SPRING CONTACT |
CH589947A5 (en) * | 1974-02-13 | 1977-07-29 | Ingun Ag | Test pin for printed circuit boards - with spring loaded shank in barrel and test end with conical hollow for boards test point |
US4050762A (en) * | 1976-11-10 | 1977-09-27 | Everett/Charles, Inc. | Telescoping spring probe having separate wiper contact member |
US4105970A (en) * | 1976-12-27 | 1978-08-08 | Teradyne, Inc. | Test pin |
-
1980
- 1980-08-25 CA CA000358924A patent/CA1162243A/en not_active Expired
- 1980-10-15 DE DE19803038937 patent/DE3038937A1/en not_active Withdrawn
- 1980-10-23 JP JP55148860A patent/JPS5953507B2/en not_active Expired
- 1980-11-03 GB GB8035306A patent/GB2066590B/en not_active Expired
- 1980-12-04 FR FR8025776A patent/FR2472773B1/en not_active Expired
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4740746A (en) * | 1984-11-13 | 1988-04-26 | Tektronix, Inc. | Controlled impedance microcircuit probe |
GB2166913A (en) * | 1984-11-13 | 1986-05-14 | Tektronix Inc | Impedance matched test probe |
FR2614105A1 (en) * | 1987-04-16 | 1988-10-21 | Teradyne Inc | APPARATUS AND PROBE FOR TESTING PRINTED CIRCUIT BOARDS |
FR2621701A1 (en) * | 1987-10-09 | 1989-04-14 | Feinmetall Gmbh | Contact device for test equipment |
US5189364A (en) * | 1990-07-30 | 1993-02-23 | Nhk Spring Co., Ltd. | Contact probe |
US5200695A (en) * | 1990-07-30 | 1993-04-06 | Nhk Spring Co., Ltd. | Contact probe |
US5254939A (en) * | 1992-03-20 | 1993-10-19 | Xandex, Inc. | Probe card system |
US5506498A (en) * | 1992-03-20 | 1996-04-09 | Xandex, Inc. | Probe card system and method |
US6107813A (en) * | 1994-04-11 | 2000-08-22 | Xandex, Inc. | Probe card changer system and method |
US5528158A (en) * | 1994-04-11 | 1996-06-18 | Xandex, Inc. | Probe card changer system and method |
US6288531B1 (en) | 1999-02-03 | 2001-09-11 | Ando Electric Co., Ltd. | Probe for electro-optic sampling oscilloscope |
GB2346446B (en) * | 1999-02-03 | 2001-06-27 | Ando Electric | Probe for electro-optic sampling oscilloscope |
GB2346446A (en) * | 1999-02-03 | 2000-08-09 | Ando Electric | Electro-optic probe |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
US20160041055A1 (en) * | 2014-08-05 | 2016-02-11 | Cory Z. Bousquet | Small form factor pressure sensor |
US9568388B2 (en) * | 2014-08-05 | 2017-02-14 | Sensata Technologies, Inc. | Small form factor pressure sensor |
US10488289B2 (en) | 2016-04-11 | 2019-11-26 | Sensata Technologies, Inc. | Pressure sensors with plugs for cold weather protection and methods for manufacturing the plugs |
US10871413B2 (en) | 2016-04-20 | 2020-12-22 | Sensata Technologies, Inc. | Method of manufacturing a pressure sensor |
US10545064B2 (en) | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
US11105698B2 (en) | 2017-05-04 | 2021-08-31 | Sensata Technologies, Inc. | Method of assembling a sensing device having a double clinch seal |
US10323998B2 (en) | 2017-06-30 | 2019-06-18 | Sensata Technologies, Inc. | Fluid pressure sensor |
US10969288B2 (en) | 2017-06-30 | 2021-04-06 | Sensata Technologies, Inc. | Fluid pressure sensor |
US10724907B2 (en) | 2017-07-12 | 2020-07-28 | Sensata Technologies, Inc. | Pressure sensor element with glass barrier material configured for increased capacitive response |
US10557770B2 (en) | 2017-09-14 | 2020-02-11 | Sensata Technologies, Inc. | Pressure sensor with improved strain gauge |
Also Published As
Publication number | Publication date |
---|---|
DE3038937A1 (en) | 1981-07-02 |
CA1162243A (en) | 1984-02-14 |
JPS5953507B2 (en) | 1984-12-25 |
GB2066590B (en) | 1984-02-15 |
FR2472773A1 (en) | 1981-07-03 |
JPS5694272A (en) | 1981-07-30 |
FR2472773B1 (en) | 1985-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |