GB2064864B - Fine-line solid state devices - Google Patents

Fine-line solid state devices

Info

Publication number
GB2064864B
GB2064864B GB8037893A GB8037893A GB2064864B GB 2064864 B GB2064864 B GB 2064864B GB 8037893 A GB8037893 A GB 8037893A GB 8037893 A GB8037893 A GB 8037893A GB 2064864 B GB2064864 B GB 2064864B
Authority
GB
United Kingdom
Prior art keywords
fine
solid state
state devices
line solid
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8037893A
Other languages
English (en)
Other versions
GB2064864A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB2064864A publication Critical patent/GB2064864A/en
Application granted granted Critical
Publication of GB2064864B publication Critical patent/GB2064864B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/412—Deposition of metallic or metal-silicide materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/064—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying
GB8037893A 1979-11-30 1980-11-26 Fine-line solid state devices Expired GB2064864B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9897979A 1979-11-30 1979-11-30

Publications (2)

Publication Number Publication Date
GB2064864A GB2064864A (en) 1981-06-17
GB2064864B true GB2064864B (en) 1984-05-23

Family

ID=22271822

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8037893A Expired GB2064864B (en) 1979-11-30 1980-11-26 Fine-line solid state devices

Country Status (6)

Country Link
EP (1) EP0040629B1 (enExample)
JP (1) JPS57500669A (enExample)
CA (1) CA1149082A (enExample)
DE (1) DE3071878D1 (enExample)
GB (1) GB2064864B (enExample)
WO (1) WO1981001629A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4923526A (en) * 1985-02-20 1990-05-08 Mitsubishi Denki Kabushiki Kaisha Homogeneous fine grained metal film on substrate and manufacturing method thereof
EP0223698A3 (en) * 1985-11-14 1987-11-19 Thomson Components-Mostek Corporation Hillock immunization mask
JP2680468B2 (ja) * 1989-07-01 1997-11-19 株式会社東芝 半導体装置および半導体装置の製造方法
US4976809A (en) * 1989-12-18 1990-12-11 North American Philips Corp, Signetics Division Method of forming an aluminum conductor with highly oriented grain structure
US5709958A (en) * 1992-08-27 1998-01-20 Kabushiki Kaisha Toshiba Electronic parts
EP0594286B1 (en) * 1992-08-27 1998-11-25 Kabushiki Kaisha Toshiba Electronic parts with metal wiring and manufacturing method thereof
US6001461A (en) * 1992-08-27 1999-12-14 Kabushiki Kaisha Toshiba Electronic parts and manufacturing method thereof
US5488013A (en) * 1993-12-20 1996-01-30 International Business Machines Corporation Method of forming transverse diffusion barrier interconnect structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879840A (en) * 1969-01-15 1975-04-29 Ibm Copper doped aluminum conductive stripes and method therefor
US3833842A (en) * 1970-03-09 1974-09-03 Texas Instruments Inc Modified tungsten metallization for semiconductor devices
US3754168A (en) * 1970-03-09 1973-08-21 Texas Instruments Inc Metal contact and interconnection system for nonhermetic enclosed semiconductor devices
US3830657A (en) * 1971-06-30 1974-08-20 Ibm Method for making integrated circuit contact structure
US3743894A (en) * 1972-06-01 1973-07-03 Motorola Inc Electromigration resistant semiconductor contacts and the method of producing same
DE2419157C3 (de) * 1974-04-20 1979-06-28 W.C. Heraeus Gmbh, 6450 Hanau Metallischer Träger für Halbleiterbauelemente und Verfahren zu seiner Herstellung
US4017890A (en) * 1975-10-24 1977-04-12 International Business Machines Corporation Intermetallic compound layer in thin films for improved electromigration resistance
US4062720A (en) * 1976-08-23 1977-12-13 International Business Machines Corporation Process for forming a ledge-free aluminum-copper-silicon conductor structure
US4166279A (en) * 1977-12-30 1979-08-28 International Business Machines Corporation Electromigration resistance in gold thin film conductors

Also Published As

Publication number Publication date
JPS57500669A (enExample) 1982-04-15
WO1981001629A1 (en) 1981-06-11
EP0040629A1 (en) 1981-12-02
EP0040629B1 (en) 1986-12-30
CA1149082A (en) 1983-06-28
DE3071878D1 (en) 1987-02-05
EP0040629A4 (en) 1984-04-27
GB2064864A (en) 1981-06-17

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee