GB2051877B - Magnetically enhanced sputtering device and method - Google Patents

Magnetically enhanced sputtering device and method

Info

Publication number
GB2051877B
GB2051877B GB8010244A GB8010244A GB2051877B GB 2051877 B GB2051877 B GB 2051877B GB 8010244 A GB8010244 A GB 8010244A GB 8010244 A GB8010244 A GB 8010244A GB 2051877 B GB2051877 B GB 2051877B
Authority
GB
United Kingdom
Prior art keywords
sputtering device
magnetically enhanced
enhanced sputtering
magnetically
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8010244A
Other languages
English (en)
Other versions
GB2051877A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vac Tec Systems Inc
Original Assignee
Vac Tec Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vac Tec Systems Inc filed Critical Vac Tec Systems Inc
Publication of GB2051877A publication Critical patent/GB2051877A/en
Application granted granted Critical
Publication of GB2051877B publication Critical patent/GB2051877B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
GB8010244A 1979-04-09 1980-03-27 Magnetically enhanced sputtering device and method Expired GB2051877B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2843479A 1979-04-09 1979-04-09

Publications (2)

Publication Number Publication Date
GB2051877A GB2051877A (en) 1981-01-21
GB2051877B true GB2051877B (en) 1983-03-02

Family

ID=21843423

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8010244A Expired GB2051877B (en) 1979-04-09 1980-03-27 Magnetically enhanced sputtering device and method

Country Status (5)

Country Link
JP (1) JPS593546B2 (ja)
CA (1) CA1153733A (ja)
DE (1) DE3012935C2 (ja)
FR (1) FR2454178A1 (ja)
GB (1) GB2051877B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4457825A (en) * 1980-05-16 1984-07-03 Varian Associates, Inc. Sputter target for use in a sputter coating source
CH649578A5 (de) * 1981-03-27 1985-05-31 Ulvac Corp Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung.
GB2096177B (en) * 1981-04-07 1985-07-17 Fournier Paul R Improved integrated sputtering apparatus and method
GB2110719B (en) * 1981-11-30 1985-10-30 Anelva Corp Sputtering apparatus
JPS58130277A (ja) * 1982-01-27 1983-08-03 Clarion Co Ltd マグネトロンスパツタ装置
US4391697A (en) * 1982-08-16 1983-07-05 Vac-Tec Systems, Inc. High rate magnetron sputtering of high permeability materials
JPS5989769A (ja) * 1982-11-15 1984-05-24 Hitachi Ltd プレ−ナマグネトロン型スパツタ電極
US4581118A (en) * 1983-01-26 1986-04-08 Materials Research Corporation Shaped field magnetron electrode
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
DE3429988A1 (de) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
JPH0633454B2 (ja) * 1984-11-20 1994-05-02 松下電器産業株式会社 スパツタリング装置
US4657619A (en) * 1985-11-29 1987-04-14 Donnell Kevin P O Diverter magnet arrangement for plasma processing system
JPS62153365U (ja) * 1987-02-12 1987-09-29
GB2209769A (en) * 1987-09-16 1989-05-24 Ion Tech Ltd Sputter coating
JPH0219462A (ja) * 1988-07-06 1990-01-23 Ube Ind Ltd マグネトロンスパッタリング方法及びその装置
KR20160008660A (ko) * 2011-04-26 2016-01-22 가부시키가이샤 아루박 캐소드 유닛

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
CH611938A5 (ja) * 1976-05-19 1979-06-29 Battelle Memorial Institute
NL7607473A (nl) * 1976-07-07 1978-01-10 Philips Nv Verstuifinrichting en werkwijze voor het ver- stuiven met een dergelijke inrichting.
US4094761A (en) * 1977-07-25 1978-06-13 Motorola, Inc. Magnetion sputtering of ferromagnetic material

Also Published As

Publication number Publication date
DE3012935C2 (de) 1983-04-14
CA1153733A (en) 1983-09-13
JPS55148770A (en) 1980-11-19
DE3012935A1 (de) 1980-10-23
JPS593546B2 (ja) 1984-01-24
FR2454178A1 (fr) 1980-11-07
GB2051877A (en) 1981-01-21
FR2454178B1 (ja) 1983-11-25

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950327