GB2050435A - Method for chemical nickelling of metal parts - Google Patents
Method for chemical nickelling of metal parts Download PDFInfo
- Publication number
- GB2050435A GB2050435A GB8016257A GB8016257A GB2050435A GB 2050435 A GB2050435 A GB 2050435A GB 8016257 A GB8016257 A GB 8016257A GB 8016257 A GB8016257 A GB 8016257A GB 2050435 A GB2050435 A GB 2050435A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- nickelling
- work solution
- work
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 30
- 239000002184 metal Substances 0.000 title claims description 14
- 229910052751 metal Inorganic materials 0.000 title claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 9
- 239000008139 complexing agent Substances 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 239000003381 stabilizer Substances 0.000 claims abstract description 8
- 230000001105 regulatory effect Effects 0.000 claims abstract description 5
- 238000009835 boiling Methods 0.000 claims abstract description 4
- 238000011068 loading method Methods 0.000 claims abstract description 4
- 150000002815 nickel Chemical class 0.000 claims abstract description 4
- 239000000080 wetting agent Substances 0.000 claims abstract description 4
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 238000007792 addition Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 4
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 2
- 239000004141 Sodium laurylsulphate Substances 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims description 2
- PILZURBRZMGGDO-UHFFFAOYSA-L lead(2+) oxido hydrogen carbonate Chemical compound [Pb+2].OC(=O)O[O-].OC(=O)O[O-] PILZURBRZMGGDO-UHFFFAOYSA-L 0.000 claims description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 2
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims 2
- 239000001632 sodium acetate Substances 0.000 claims 2
- 235000017281 sodium acetate Nutrition 0.000 claims 2
- 239000004133 Sodium thiosulphate Substances 0.000 claims 1
- 235000011114 ammonium hydroxide Nutrition 0.000 claims 1
- 239000004310 lactic acid Substances 0.000 claims 1
- 235000014655 lactic acid Nutrition 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 claims 1
- 235000019345 sodium thiosulphate Nutrition 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 55
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- AYRVGWHSXIMRAB-UHFFFAOYSA-M sodium acetate trihydrate Chemical compound O.O.O.[Na+].CC([O-])=O AYRVGWHSXIMRAB-UHFFFAOYSA-M 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- -1 hypophosphite ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000011089 mechanical engineering Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1676—Heating of the solution
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
In the electroless deposition of nickel, three concentrated solutions are used, the first containing a nickel salt and an accelerator, the second a reducing agent, a complexing agent, stabiliser and a wetting agent, and the third the same reducing agent as the second solution, a complexing agent and a stabiliser. The work solution is prepared by mixing the said first and second concentrated solutions together with water in a predetermined ratio to give a bath of predetermined chemical composition suitable for effecting chemical nickelling; and the composition of the work solution is regulated in the course of the chemical nickelling by direct addition of equal volumes of the said first and the third solutions, the volumes used being chosen as a function of the area loading of the work solution. The temperature of the work solution is preferably increased linearly in the course of the nickelling, starting from the optimal work temperature and reaching a temperature of 2 DEG C lower than the boiling temperature of the work solution.
Description
SPECIFICATION
Method for chemical nickelling of metal parts
This invention relates to a method for chemical
nickelling of metal parts e.g. parts for use in mechan
ical engineering, instrument making, electrical
engineering and in the production of computers and
control systems.
Methods for chemical nickelling of metal parts
exist, in which the regulation of the composition of
the work solution is effected by direct additions to
the work bath when adjustment is needed depend
ing on the pH of the system. Another method is
known for making up and regulating solutions for
chemical nickelling wherein two concentrated solu
tions and demineralized water are used in the prep
aration of the work solution for chemical nickelling
and regulation is effected through direct addition of
two concentrated solutions depending on the con
centration of both nickel and hypophosphite ions in the bath, the regulation involving complicated
analytical procedures.Still another, more compli
cated method for chemical nickelling is known
wherein the regulation of the work solution is
effected as a function of five of the constituents of
the work solution for chemical nickelling.
A common disadvantage of the above methods consists of the need for complex analytical proce
dures when, irrespective of the continuity of the pro
cess of regulation, the rate of metal deposition for a
prolonged period of time (for example 100 hours) is
decreasing.
An object of this invention is to provide a method for chemical nickelling of metal parts wherein simp
lification of the regulation of the work solution, a
constant rate of deposition, a constant work bath
composition and good properties of the coating can
be achieved.
According to the present invention, there is provided a method for chemical nickelling of metal
parts, which involves immersing the parts to be tre
ated in a bath of a work solution, wherein the
method makes use of three concentrated solutions the first of which contains a nickel salt and an
accelerator, the second of which contains a reducing agent, a complexing agent, stabiliser and a wetting agent, and the third of which contains the same
reducing agent as the second solution, a complexing
agent and a stabiliser; and wherein (a) the work solution is prepared by mixing the said first and second
concentrated solutions together with water in a pre
determined ratio to give a bath of predetermined chemical composition suitable for effecting chemical
nickelling; and (b) the composition of the work solu
tion is regulated in the course of the chemical nickel
ling by direct addition of equal volumes of the said ,first and the third solutions, the volumes used being
chosen as a function of the area loading of the work solution.
Preferably, the regulation of the composition of the work solution during nickelling is effected by the
addition to the work solution of equal volumes of the first and third solutions everyx minutes, wherex equals numerically the starting concentration of nickel (in grams per litre) in the work solution.
The work solution is preferably formed by combining 10-20 parts by volume of the first solution, 10-20
parts by volume of the second solution, and 60-80 parts by volume of demineralised water.
The additions of the first and third solutions are advantageously effected at the working temperature of the work solution.
The temperature of the work solution is preferably brought to the optimum value forthe start-up of chemical nickelling before the metal parts to be treated are immersed in the bath of work solution.
More preferably, the temperature of the work solution is increased linearly throughout the nickelling starting from the said optimal temperature and reaching a temperature which is 2"C lower than the boiling temperature of the work solution at the end ofthe nickelling.
The concentrations of the first, second and third solutions and the start-up composition of the work solution, will be selected to permit the nickelling in the desired manner and to enable the regulation of the composition of the work solution during the course of the nickelling to proceed in the manner specified above, so that operating conditions are controlled as desired.
The advantages of the invention over the known methods for chemical nickelling of metal parts consist of the following: the admission to the work bath of equal quantities of the regulating solutions results in a significant simplification of the process of regulation; the analysis of the components' concentration can be omitted; the requirement of measuring the pH is avoided; and the reliability of the process is increased while obtaining the deposition at a constant rate of a nickel coating of high quality.
The following Example illustrates the method of the inventions with reference to the accompanying drawing.
Example
The drawing is a schematic representation of apparatus for accomplishing the method, the apparatus comprising a work bath 1 filled-up with a work solution 2 wherein the metal parts to be treated are immersed. 4 is a filter-pump, 5 is a temperature controller, 6 is a thermometer, 7 is a device for feeding with an energy supplier, while 8, 9, and 10 are tanks containing the first, second and third concentrated solutions, respectively. 11 is a demineralized water container. 12, 13 and 14 are proportioning devices for the first, second and third concentrated solutions, respectively. 15 is a proportioning device for demineralized water. 16 is a time measuring unit and 17 is a control unit for the proportioning devices 12 to 16.The tank 8 is filled with the first concentrated solution which has been prepared by dissolving in demineralized water the following substances (as the nickel salt and accelerator):
nickelous chloride (heptahydrate) -200 g/l'
ammonium fluoride (anhydrous) -10 gll The tank 9 is filled with the second concentrated solution which has been prepared by dissolving in demineralized water the following substances (as the reducing agent, complexing agent, stabiliser and wetting agents)::
sodium hypophosphite (monohydrate) -245 gll sodium acetate (trihydrate) -120 g/l lactic acid (90%) -195 ml/l
lead hydroxycarbonate (anhydrous) -10 mg/l
sodium laurylsulphate --80 mg/l
The tank 10 is filled with the third concentrated solution which has been prepared by dissolving in demineralized water the following substances (as reducing agent, complexing agent and stabiliser)::
sodium hypophosphite (monohydrate) -200 g/l
lactic acid (90 /O) -50 ml/l
sodium acetate (trihydrate) 40 g/l ammonium hydroxide (25%) -150 ml/l
sodium thiosulphate (pentahydrate) -100 mg/I The working bath 1 is filled with the work solution 2 in the following manner: the proportioning device 15 admits demineralized water in a quantity which constitutes 80% (by volume) of the working volume of the bath. Both proportioning devices 12 and 13 admit 10% (by volume) of the working volume of the bath of first and second concentrated solutions respectively. The work solution thus prepared is of 5 gll nickel content.
Then, the filter-pump 4 is actuated which filters and simultaneously agitates the work solution.
Under the commands given by the unit 16, the temperature controller 5 and the device 7 supply
energy to the work bath 1 for heating the work solu
tion 3. The temperature is measured by the ther
mometer 6 placed in the work solution. When the
temperature of the work solution reaches the opti
mal temperature (in this case 92"C), the unit 16 gives
an orderto a transport device (not shown in the
drawing) to put the metal parts 3 being treated into the work solution 2 thereby starting the process of chemical nickelling. The area loading of the work solution is 0.75 dim2/1.
The time measuring unit 16 actuates the unit 17 which, in turn, at period of 5 min length (this period being numerically equal to the nickel content, expre
ssed in grams/litre, of the work solution) actuates the
proportioning devices 12 and 14 which admit
directly into the bath 1 the adjusting additives which
consist of the first and third concentrated solutions,
respectively, in quantities of 2 ml/l of work solution.
During the active time of the work solution 2, the time measuring unit 16, through the temperature
controller 5, and the energy supply device 7,
increases the temperature of the work solution start
ing from the optimal temperature (of 92"C) and
reaching a temperature 2"C lower than the boiling
temperature of the work solution. Thereby, a coeffi
cient of deposition of metal from the solution over
the parts being treated which is more than 10 is
achieved art a rate of deposition of 22 microns/hour
and a coating of a constant composition and of good
physical and chemical properties such as hardness,
wear resistance, corrosion resistance, etc. is
obtained.
Claims (11)
1. A method for chemical nickelling of metal parts, which involves immersing the parts to be treated in a bath of a work solution, wherein the method makes use of three concentrated solutions the first of which contains a nickel salt and an accelerator, the second of which contains a reducing agent, a complexing agent, a stabiliser and a wetting agent and the third of which contains the same reducing agent as the second solution, a complexing agent and a stabiliser; and wherein (a) the work solution is prepared by mixing the said first and second concentrated solutions together with water in a predetermined ratio to give a bath of predetermined chemical composition suitable for effecting chemical nickelling; and (b) the composition of the work solution is regulated in the course of the chemical nickelling by direct addition of equal volumes of the said first and the third solutions, the volumes used being chosen as a function of the area loading of the work solution.
2. A method according to claim 1, wherein the regulation of the composition of the work solution during nickelling is effected by the addition to the work solution of equal volumes of the first and third solutions everyx minutes, wherex equals numerically the starting concentration of nickel (in grams per litre) in the work solution.
3. A method according to claim 1 or2,wherein the work solution is formed by combining 10-20
parts by volume of the first solution, 10-20 parts by volume of the second solution, and 60-80 parts by volume of demineralised water.
4. A method according to claim 1,2 or 3, wherein the additions of quantities of the first and third solutions during the nickelling process are effected at the working temperature ofthe work solution.
5. A method according to claim 1,2,3,or4, wherein the temperature of the work solution is broughtto the optimum value for the start-up of chemical nickelling before the metal parts to be treated are immersed in the bath of work solution.
6. A method according to claim 5, wherein the temperature of the work solution is increased
linearly throughout the nickelling starting from the said optimal temperature and reaching a temperature which is 2"C lowerthan the boiling temperature of the work solution at the end of the nickelling.
7. A method according to any preceding claim, wherein the reducing agent used is a hypophos
phite.
8. A method according to claim 7, wherein the first solution consists of nickelous chloride and
ammonium fluoride; the second solution consists of
sodium hypophosphite, sodium acetate, lactic acid,
lead hydroxycarbonate and sodium laurylsulphate;
and the third solution consists of sodium hypophos
phite, sodium acetate, ammonium hydroxide and
sodium thiosulphate.
9. A method for chemical nickelling as claimed in
claim 1, and substantially as hereinbefore described.
10. A method for chemical nickelling substan
tially as described in the foregoing Example.
11. Metal parts whenever nickel-coatedby a
method as claimed in any preceding claim.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BG7943647A BG32650A1 (en) | 1979-05-18 | 1979-05-18 | Method for chemical nickelplating of metal parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2050435A true GB2050435A (en) | 1981-01-07 |
| GB2050435B GB2050435B (en) | 1983-02-16 |
Family
ID=3906083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8016257A Expired GB2050435B (en) | 1979-05-18 | 1980-05-16 | Method for chemical nickelling of metal parts |
Country Status (9)
| Country | Link |
|---|---|
| BG (1) | BG32650A1 (en) |
| CS (1) | CS241955B1 (en) |
| DD (1) | DD160945A3 (en) |
| DE (1) | DE3018511C2 (en) |
| FR (1) | FR2456786A1 (en) |
| GB (1) | GB2050435B (en) |
| HU (1) | HU182797B (en) |
| IT (1) | IT8048703A0 (en) |
| RO (1) | RO79638A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150307995A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS |
| US20150307994A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1179734A (en) * | 1957-07-23 | 1959-05-27 | Improved chemical nickel plating process and apparatus | |
| US3709715A (en) * | 1966-05-31 | 1973-01-09 | Dow Chemical Co | Electroless nickel plating of hollow containers |
| DE1621344A1 (en) * | 1967-08-04 | 1971-05-13 | Siemens Ag | Bath and process for chemical nickel plating of a solid body made of metal, plastic or ceramic |
| US3934054A (en) * | 1969-08-25 | 1976-01-20 | Electro Chemical Engineering Gmbh | Electroless metal plating |
-
1979
- 1979-05-18 BG BG7943647A patent/BG32650A1/en unknown
-
1980
- 1980-05-07 CS CS803263A patent/CS241955B1/en unknown
- 1980-05-14 DE DE3018511A patent/DE3018511C2/en not_active Expired
- 1980-05-14 FR FR8010945A patent/FR2456786A1/en active Granted
- 1980-05-14 DD DD80221246A patent/DD160945A3/en not_active IP Right Cessation
- 1980-05-16 IT IT8048703A patent/IT8048703A0/en unknown
- 1980-05-16 GB GB8016257A patent/GB2050435B/en not_active Expired
- 1980-05-16 HU HU801220A patent/HU182797B/en unknown
- 1980-05-17 RO RO80101164A patent/RO79638A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150307995A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS |
| US20150307994A1 (en) * | 2014-04-29 | 2015-10-29 | Lam Research Corporation | ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS |
Also Published As
| Publication number | Publication date |
|---|---|
| RO79638A (en) | 1982-08-17 |
| IT8048703A0 (en) | 1980-05-16 |
| FR2456786A1 (en) | 1980-12-12 |
| BG32650A1 (en) | 1982-09-15 |
| GB2050435B (en) | 1983-02-16 |
| CS241955B1 (en) | 1986-04-17 |
| FR2456786B1 (en) | 1984-12-07 |
| HU182797B (en) | 1984-03-28 |
| DE3018511C2 (en) | 1983-12-15 |
| DD160945A3 (en) | 1984-07-04 |
| DE3018511A1 (en) | 1980-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4042729A (en) | Process for the activation of resinous bodies for adherent metallization | |
| US3532518A (en) | Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions | |
| JPH0343346B2 (en) | ||
| US4182638A (en) | Coating process with voltammetric sensing of the coating solution | |
| EP1420891B1 (en) | Electroless nickel plating solution and process for its use | |
| CN106894005B (en) | A kind of chemical bronze plating liquid, preparation method and a kind of method of Chemical Plating of Non metal Material | |
| GB2050435A (en) | Method for chemical nickelling of metal parts | |
| US3178311A (en) | Electroless plating process | |
| US3597267A (en) | Bath and process for chemical metal plating | |
| US3698939A (en) | Method and composition of platinum plating | |
| US2909455A (en) | Method of coating a succession of aluminum surfaces | |
| USRE26130E (en) | Solution and method for brightening cadmium | |
| GB2080338A (en) | Coating Fibrous Glass With Amorphous Ni-P | |
| US3348969A (en) | Electroless nickel plating | |
| EP0180265A1 (en) | Method of autocatalytically tin-plating articles of copper or a copper alloy | |
| US4086103A (en) | Accelerator for phosphating solutions | |
| US3416955A (en) | Electroless cobalt plating bath | |
| US5944879A (en) | Nickel hypophosphite solutions containing increased nickel concentration | |
| US3338741A (en) | Electroless nickel plating | |
| US5200047A (en) | Plating solution automatic control | |
| JPH0565661A (en) | Production of electroless nickel plating film | |
| EP0192310B1 (en) | Method of continuously regenerating an electroless-plating bath and device for carrying out the method | |
| US2872354A (en) | Processes of continuous chemical nickel plating | |
| GB2257715A (en) | Plating substrates using a microwave heating source | |
| US4340451A (en) | Method of replenishing gold/in plating baths |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |