GB2048272A - Process for the Hardening of Reactive Resins - Google Patents
Process for the Hardening of Reactive Resins Download PDFInfo
- Publication number
- GB2048272A GB2048272A GB8013730A GB8013730A GB2048272A GB 2048272 A GB2048272 A GB 2048272A GB 8013730 A GB8013730 A GB 8013730A GB 8013730 A GB8013730 A GB 8013730A GB 2048272 A GB2048272 A GB 2048272A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hardening
- reaction
- parts
- adhesive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011347 resin Substances 0.000 title claims abstract description 38
- 229920005989 resin Polymers 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 238000005266 casting Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 9
- 239000003822 epoxy resin Substances 0.000 claims abstract description 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000206 moulding compound Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- 238000004904 shortening Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/747—Lightning equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Abstract
Resins e.g. epoxy resins used as adhesives and casting resins are hardened by capacitive heating in a high frequency field such as is produced by, for example, a HF preheater or a microwave apparatus. The process is particularly advantageous in the glueing of headlamp parts, particularly for the glueing of diffusing lenses and reflectors for motor vehicle headlamps, thus avoiding excessive heating and thus possible distortion of the optically effective reflector.
Description
SPECIFICATION
Process for the Hardening of Reaction Resins
This invention relates to the hardening of reaction resins.
Reaction resins, such as are used in, for example, the form of reaction adhesives or casting resins, are hardened by heating them to, for example, approximately 1 400C in a corresponding oven. In the case of reaction adhesives, this has the disadvantage that the parts to be joined together are also heated to this temperature, so that inherent stresses can occur in the said parts after they have been cooled and lead to damage to the glued joint. Owing to the poor thermal conductivity of casting resin, a relatively long period of heating is necessary in the case of large parts made from casting resins in order to ensure that the part has actually hardened through. This can involve the disadvantage that the necessarily long period of heating can cause damage to components which are to be cast by means of casting resin.
According to the present invention there is provided a process for hardening a reaction resin which hardens at elevated temperatures wherein the hardening is effected by dielectric heating in a high frequency field, for example a high frequency field of from 10 to 5.103 MHz.
The reaction resin may be a reaction adhesive or a casting resin.
The invention includes a process for the glueing of headlamp parts wherein a reaction resin with which the parts are glued is hardened by dielectric heating in a high frequency field. The parts glued are preferably diffusing lenses and reflectors.
The process in accordance ith the invention, has the advantage that, in the case of reaction adhesives, the parts to be joined together are only heated by heat conduction from the adhesive, this temperature remaining low, particularly in the case of rapidly reacting adhesives, so that virtually no inherent stresses can occur in the parts to be joined,.and thus virtually no damage to the joint can occur. For the same reason, the adhesive can be brought to higher temperatures, so that the hardening process is effected far more rapidly, whereby the dwell times can be shortened by 50 to 70%, thus leading to reduced spatial requirements during manufacture. Furthermore, owing to the fact that virtually only the reaction adhesive is heated, the energy requirement is small and is only a third to a quarter of the energy requirement during conventional oven hardening.
The hardening time can be shortened to a considerable extent during the hardening of casting resin, since their entire volume is uniformly heated by the process in accordance with the invention, so that the casting resin can be uniformly hardened throughout.
The process in accordance with the invention has proved to be particularly successful for the glueing of headlamp parts, particularly for the glueing of motor vehicle headlamp diffusing lenses and reflectors which, nowadays, are predominantly supplied in a rigidly interconnected form. In this instance, in addition to shortening the hardening time and thus increasing the throughput, the low temperature of the reflector and of the diffusing lens during the hardening of the adhesive is particularly advantageous, so that, in contrast to conventional cooling in the case of oven hardening, glued joints which are more free from stress ensue after hardening, this being particularly advantageous in the case of optical parts.
The use of high frequency for dielectrical heating is known per se for the welding and preheating of hardenable moulding compounds.
However, the use of high frequency for the hardening of reaction resins has not yet been described.
Examples
In order to glue a headlamp diffusing lens made from glass or plastics material to a headlamp reflector made from metal or fibrereinforced plastics material, a reaction adhesive comprising 100 parts by weight of epoxide resin based on bisphenol A, 100 parts by weight of an amine hardener, and 0--800 parts by weight of silicic anhydride serving as a filler, is first mixed.
This reaction compound has a pot like of approximately 1 to 2 hours, so that it can be processed in a convenient manner. The reaction adhesive is applied to one or both of the surfaces; the parts are joined together and are then exposed to a HF field. Suitable generators for the high frequency are HF preheaters (27, 12 MHz) or preferably microwave apparatus (2450 MHz).
When using microwave apparatus, a dwell time of from 5 to 10 minutes is sufficient in the case of standard headlamps. Work can be carried out either intermittently (batch-wise), or, preferably, continuously according to the lay-out of the manufacturing plant.
By virtue of the process in accordance with the invention, the heat is produced directly in the reaction substance itself. Compared with conventional processes, this energy is introduced into the substance in a concentrated form in a very short time. Higher temperatures then occur in the adhesive, thus resulting in more rapid hardening.
The adhesive strengths obtained are comparable with those obtained by oven hardening.
Claims
1. A process for the hardening of a reaction resin which hardens at elevated temperatures, wherein hardening is effected by dielectric heating in a high frequency field.
2. A process as claimed in claim 1, in which hardening is effected in a high frequency field of from 10 to 5.103 MHz.
3. A process as claimed in claim 1 or 2 in which the reaction resin is a reaction adhesive or a casting resin.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (6)
1. A process for the hardening of a reaction resin which hardens at elevated temperatures, wherein hardening is effected by dielectric heating in a high frequency field.
2. A process as claimed in claim 1, in which hardening is effected in a high frequency field of from 10 to 5.103 MHz.
3. A process as claimed in claim 1 or 2 in which the reaction resin is a reaction adhesive or a casting resin.
4. A process as claimed in claim 1 and substantially as hereinbefore described with reference to the Examples.
5. A process for the glueing of headlamp parts wherein a reaction resin with which the parts are glued is hardened by the process claimed in any one of claims 1 to 4.
6. A process as claimed in claim 5, in which the parts glued are diffusing lenses and reflectors.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792916929 DE2916929A1 (en) | 1979-04-26 | 1979-04-26 | METHOD FOR CURING REACTION RESIN |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2048272A true GB2048272A (en) | 1980-12-10 |
Family
ID=6069337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8013730A Withdrawn GB2048272A (en) | 1979-04-26 | 1980-04-25 | Process for the Hardening of Reactive Resins |
Country Status (5)
| Country | Link |
|---|---|
| DE (1) | DE2916929A1 (en) |
| ES (1) | ES490909A0 (en) |
| FR (1) | FR2455062A1 (en) |
| GB (1) | GB2048272A (en) |
| IT (1) | IT1141299B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0048119A2 (en) * | 1980-09-12 | 1982-03-24 | I M L Corporation | Methods of preparing polyimides and artifacts composed thereof |
| EP0049194A1 (en) * | 1980-09-23 | 1982-04-07 | STRATIFORME Société Anonyme | Process for polycondensating thermohardening resin compositions |
| FR2515659A1 (en) * | 1981-11-02 | 1983-05-06 | Grace W R Ltd | DURABLE EPOXY THERMOPLASTIC COMPOUND CONTAINING URETHANE, THERMOSETTING COMPOSITION CONTAINING THE SAME, AND METHOD FOR ADHERING TWO SUBSTRATES |
| FR2529215A1 (en) * | 1982-06-28 | 1983-12-30 | Electricite De France | PROCESS FOR THE PREPARATION OF POLYMERIC NETWORKS OF HOMOGENEOUS INTERPENETRATED STRUCTURE |
| GB2126235A (en) * | 1982-08-16 | 1984-03-21 | Grace W R & Co | Phosphine compounds as curing accelerators in epoxy resin systems |
| FR2536753A2 (en) * | 1981-11-02 | 1984-06-01 | Grace W R Ltd | Thermoplastic, urethane-containing, compound with a pendent epoxy group, heat-curable composition containing it and process for adhesively bonding two substrates. |
| FR2555189A1 (en) * | 1983-11-18 | 1985-05-24 | Electricite De France | Process for the manufacture of a composite material comprising a crosslinked polymeric matrix and finely divided fillers which are transparent to microwaves |
| FR2555188A1 (en) * | 1983-11-18 | 1985-05-24 | Electricite De France | Microwave crosslinking of thermosetting resin compsn. |
| EP0512678A1 (en) * | 1991-05-06 | 1992-11-11 | Ford Motor Company Limited | Fringe field dielectric heating |
| WO1997038441A1 (en) * | 1996-04-08 | 1997-10-16 | Lambda Technologies, Inc. | Curing liquid resin encapsulants of microelectronics components with microwave energy |
| WO2015107215A1 (en) * | 2014-01-20 | 2015-07-23 | Bielomatik Leuze Gmbh + Co. Kg | Method for controlling the degree of curing or the reaction intensity in an adhesive |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4941937A (en) * | 1988-04-28 | 1990-07-17 | The Budd Company | Method for bonding reinforcement members to FRP panels |
| DE4137248A1 (en) * | 1991-11-13 | 1992-05-27 | Theo Haefner | Cellulose material-joining method - compresses components coated with fusible glue between electrodes generating high-frequency field |
| DE9407177U1 (en) * | 1994-04-29 | 1994-10-13 | Kiefel Gmbh Paul | Device for laminating and bending parts of the cladding |
| DE19530224B4 (en) * | 1995-08-17 | 2006-01-05 | Friatec Ag | Sealing arrangement for a butterfly valve or a butterfly valve |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2822575A (en) * | 1954-07-29 | 1958-02-11 | Imbert Rene | Process and machine for the continuous production of sections from synthetic resins |
| FR1201587A (en) * | 1958-07-03 | 1960-01-04 | Process for the polymerization or condensation of chemicals | |
| FR1300107A (en) * | 1960-07-13 | 1962-08-03 | Emil Vogel Gmbh | Process for manufacturing foams of synthetic materials and sandwich elements by high frequency treatment, as well as products conforming to those obtained |
| US3209056A (en) * | 1962-10-30 | 1965-09-28 | Gen Motors Corp | Method of insulating refrigerator cabinets and other insulation spaces |
-
1979
- 1979-04-26 DE DE19792916929 patent/DE2916929A1/en not_active Ceased
-
1980
- 1980-04-23 IT IT8021580A patent/IT1141299B/en active
- 1980-04-25 ES ES490909A patent/ES490909A0/en active Granted
- 1980-04-25 FR FR8009433A patent/FR2455062A1/en active Granted
- 1980-04-25 GB GB8013730A patent/GB2048272A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0048119A3 (en) * | 1980-09-12 | 1982-08-11 | I M L Corporation | Methods of preparing polyimides and artifacts composed thereof |
| EP0048119A2 (en) * | 1980-09-12 | 1982-03-24 | I M L Corporation | Methods of preparing polyimides and artifacts composed thereof |
| EP0049194A1 (en) * | 1980-09-23 | 1982-04-07 | STRATIFORME Société Anonyme | Process for polycondensating thermohardening resin compositions |
| FR2536753A2 (en) * | 1981-11-02 | 1984-06-01 | Grace W R Ltd | Thermoplastic, urethane-containing, compound with a pendent epoxy group, heat-curable composition containing it and process for adhesively bonding two substrates. |
| FR2515659A1 (en) * | 1981-11-02 | 1983-05-06 | Grace W R Ltd | DURABLE EPOXY THERMOPLASTIC COMPOUND CONTAINING URETHANE, THERMOSETTING COMPOSITION CONTAINING THE SAME, AND METHOD FOR ADHERING TWO SUBSTRATES |
| FR2529215A1 (en) * | 1982-06-28 | 1983-12-30 | Electricite De France | PROCESS FOR THE PREPARATION OF POLYMERIC NETWORKS OF HOMOGENEOUS INTERPENETRATED STRUCTURE |
| EP0101654A1 (en) * | 1982-06-28 | 1984-02-29 | Electricite De France | Process for preparing homogeneous interpenetrating polymeric networks |
| GB2126235A (en) * | 1982-08-16 | 1984-03-21 | Grace W R & Co | Phosphine compounds as curing accelerators in epoxy resin systems |
| FR2555189A1 (en) * | 1983-11-18 | 1985-05-24 | Electricite De France | Process for the manufacture of a composite material comprising a crosslinked polymeric matrix and finely divided fillers which are transparent to microwaves |
| FR2555188A1 (en) * | 1983-11-18 | 1985-05-24 | Electricite De France | Microwave crosslinking of thermosetting resin compsn. |
| EP0512678A1 (en) * | 1991-05-06 | 1992-11-11 | Ford Motor Company Limited | Fringe field dielectric heating |
| WO1997038441A1 (en) * | 1996-04-08 | 1997-10-16 | Lambda Technologies, Inc. | Curing liquid resin encapsulants of microelectronics components with microwave energy |
| WO2015107215A1 (en) * | 2014-01-20 | 2015-07-23 | Bielomatik Leuze Gmbh + Co. Kg | Method for controlling the degree of curing or the reaction intensity in an adhesive |
Also Published As
| Publication number | Publication date |
|---|---|
| ES8101095A1 (en) | 1980-12-01 |
| IT8021580A0 (en) | 1980-04-23 |
| FR2455062A1 (en) | 1980-11-21 |
| IT1141299B (en) | 1986-10-01 |
| ES490909A0 (en) | 1980-12-01 |
| DE2916929A1 (en) | 1980-11-06 |
| FR2455062B3 (en) | 1982-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |