GB2037075A - Semiconductor device comprising two semiconductor elements - Google Patents

Semiconductor device comprising two semiconductor elements

Info

Publication number
GB2037075A
GB2037075A GB7940346A GB7940346A GB2037075A GB 2037075 A GB2037075 A GB 2037075A GB 7940346 A GB7940346 A GB 7940346A GB 7940346 A GB7940346 A GB 7940346A GB 2037075 A GB2037075 A GB 2037075A
Authority
GB
United Kingdom
Prior art keywords
semiconductor
plate
washers
metal
connection terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7940346A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri France SA filed Critical BBC Brown Boveri France SA
Publication of GB2037075A publication Critical patent/GB2037075A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Abstract

The semiconductor device comprises two circular semiconductor plates (10, 11) arranged one on the top of the other with, in between, a metal washer (12). Other me washers (13, 14) are placed respectively above t top plate (11) and below the bottom plate (10). On the metal washers (12, 13, 14), connection terminals (23, 24) are fixed said connection terminals coming out of the casing (20) on a same side. The stack of semiconductor plates (10, 11) and metal washers (12, 13, 14) is mounted, through a ceramic disc (16), on a base (26) provided with a threaded bolt (18). To ensure a good thermal conduction from the top semiconductor plate (11) to the base (26), the bottom semiconductor plate (10) has a bigger diameter. The top metal washer (13) presents a recess or an aperture allowing a control terminal (25) to come into contact with the top semiconductor plate (11).
GB7940346A 1978-03-23 1979-01-27 Semiconductor device comprising two semiconductor elements Withdrawn GB2037075A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782812700 DE2812700A1 (en) 1978-03-23 1978-03-23 SEMICONDUCTOR ARRANGEMENT WITH TWO SEMICONDUCTOR ELEMENTS

Publications (1)

Publication Number Publication Date
GB2037075A true GB2037075A (en) 1980-07-02

Family

ID=6035259

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7940346A Withdrawn GB2037075A (en) 1978-03-23 1979-01-27 Semiconductor device comprising two semiconductor elements

Country Status (5)

Country Link
EP (1) EP0018363A1 (en)
DE (1) DE2812700A1 (en)
GB (1) GB2037075A (en)
NL (1) NL7902281A (en)
WO (1) WO1979000814A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055148A (en) * 1997-07-19 2000-04-25 U.S. Philips Corporation Semiconductor device assemblies and circuits

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3245762A1 (en) * 1982-03-13 1983-09-22 Brown, Boveri & Cie Ag, 6800 Mannheim Modular semiconductor device
DE3406537A1 (en) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim ARRANGEMENT OF A PERFORMANCE SEMICONDUCTOR COMPONENT ON AN INSULATING AND PROVIDED SUBSTRATE
DE10258035A1 (en) * 2002-12-12 2004-06-24 Robert Bosch Gmbh Single-phase power converter module, e.g. automobile rectifier, has auxiliary element for inhibiting connector tilt about connecting vane longitudinal axis that can be separated after module assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280641A (en) * 1961-07-07
BE624012A (en) * 1961-10-27
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
DE7103749U (en) * 1970-02-02 1971-10-28 Gec SEMICONDUCTOR COMPONENT
US3626259A (en) * 1970-07-15 1971-12-07 Trw Inc High-frequency semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055148A (en) * 1997-07-19 2000-04-25 U.S. Philips Corporation Semiconductor device assemblies and circuits

Also Published As

Publication number Publication date
WO1979000814A1 (en) 1979-10-18
NL7902281A (en) 1979-09-25
DE2812700A1 (en) 1979-12-06
EP0018363A1 (en) 1980-11-12

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)