GB201009682D0 - Synchronous test method for assessing soldering pastes - Google Patents

Synchronous test method for assessing soldering pastes

Info

Publication number
GB201009682D0
GB201009682D0 GBGB1009682.4A GB201009682A GB201009682D0 GB 201009682 D0 GB201009682 D0 GB 201009682D0 GB 201009682 A GB201009682 A GB 201009682A GB 201009682 D0 GB201009682 D0 GB 201009682D0
Authority
GB
United Kingdom
Prior art keywords
assessing
test method
synchronous test
soldering pastes
pastes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1009682.4A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAISBITT GRAHAM
Original Assignee
NAISBITT GRAHAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAISBITT GRAHAM filed Critical NAISBITT GRAHAM
Publication of GB201009682D0 publication Critical patent/GB201009682D0/en
Priority to GBGB1017170.0A priority Critical patent/GB201017170D0/en
Priority to GB1018958A priority patent/GB2475600A/en
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02Investigating surface tension of liquids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/06Indicating or recording means; Sensing means
    • G01N2203/067Parameter measured for estimating the property
    • G01N2203/0676Force, weight, load, energy, speed or acceleration

Landscapes

  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GBGB1009682.4A 2009-11-21 2010-06-10 Synchronous test method for assessing soldering pastes Ceased GB201009682D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB1017170.0A GB201017170D0 (en) 2009-11-21 2010-09-22 Synchronous test method for assessing solder pastes
GB1018958A GB2475600A (en) 2009-11-21 2010-11-10 Synchronous testing of the solderability of components and solder paste usability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0920488.4A GB0920488D0 (en) 2009-11-21 2009-11-21 Synchronous method for assessing solder pastes

Publications (1)

Publication Number Publication Date
GB201009682D0 true GB201009682D0 (en) 2010-07-21

Family

ID=41565723

Family Applications (4)

Application Number Title Priority Date Filing Date
GBGB0920488.4A Ceased GB0920488D0 (en) 2009-11-21 2009-11-21 Synchronous method for assessing solder pastes
GBGB1009682.4A Ceased GB201009682D0 (en) 2009-11-21 2010-06-10 Synchronous test method for assessing soldering pastes
GBGB1017170.0A Ceased GB201017170D0 (en) 2009-11-21 2010-09-22 Synchronous test method for assessing solder pastes
GB1018958A Withdrawn GB2475600A (en) 2009-11-21 2010-11-10 Synchronous testing of the solderability of components and solder paste usability

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB0920488.4A Ceased GB0920488D0 (en) 2009-11-21 2009-11-21 Synchronous method for assessing solder pastes

Family Applications After (2)

Application Number Title Priority Date Filing Date
GBGB1017170.0A Ceased GB201017170D0 (en) 2009-11-21 2010-09-22 Synchronous test method for assessing solder pastes
GB1018958A Withdrawn GB2475600A (en) 2009-11-21 2010-11-10 Synchronous testing of the solderability of components and solder paste usability

Country Status (1)

Country Link
GB (4) GB0920488D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108827835A (en) * 2018-07-03 2018-11-16 重庆知遨科技有限公司 Pulling escape liquid surface tension coefficient measuring device
CN114682948B (en) * 2022-03-04 2023-10-31 广东风华高新科技股份有限公司 Method, device and system for testing weldability of chip component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498100B2 (en) * 1993-06-24 2004-02-16 ソニー株式会社 Solderability test method and apparatus and micro crucible for test
DE4404656C1 (en) * 1994-02-14 1995-06-08 Siemens Nixdorf Inf Syst Solder paste moistening property determination
JPH09145589A (en) * 1995-09-20 1997-06-06 Sony Corp Method and apparatus for testing of solderability of electronic component
JPH10305364A (en) * 1997-05-06 1998-11-17 Sony Corp Soldering test for electronic parts and device therefor
JP3882362B2 (en) * 1998-04-10 2007-02-14 ソニー株式会社 Test piece for solderability evaluation and printed wiring board having the same
JP4284873B2 (en) * 2001-02-27 2009-06-24 ソニー株式会社 Solderability test apparatus and solderability test method
JP2005033149A (en) * 2003-07-11 2005-02-03 Resuka:Kk Method and apparatus for evaluation test of solder wettability of mounting component

Also Published As

Publication number Publication date
GB201018958D0 (en) 2010-12-22
GB2475600A (en) 2011-05-25
GB201017170D0 (en) 2010-11-24
GB0920488D0 (en) 2010-01-06

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)