GB201009682D0 - Synchronous test method for assessing soldering pastes - Google Patents
Synchronous test method for assessing soldering pastesInfo
- Publication number
- GB201009682D0 GB201009682D0 GBGB1009682.4A GB201009682A GB201009682D0 GB 201009682 D0 GB201009682 D0 GB 201009682D0 GB 201009682 A GB201009682 A GB 201009682A GB 201009682 D0 GB201009682 D0 GB 201009682D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- assessing
- test method
- synchronous test
- soldering pastes
- pastes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005476 soldering Methods 0.000 title 1
- 230000001360 synchronised effect Effects 0.000 title 1
- 238000010998 test method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N13/02—Investigating surface tension of liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
Landscapes
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB1017170.0A GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
GB1018958A GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0920488.4A GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
Publications (1)
Publication Number | Publication Date |
---|---|
GB201009682D0 true GB201009682D0 (en) | 2010-07-21 |
Family
ID=41565723
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0920488.4A Ceased GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
GBGB1009682.4A Ceased GB201009682D0 (en) | 2009-11-21 | 2010-06-10 | Synchronous test method for assessing soldering pastes |
GBGB1017170.0A Ceased GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
GB1018958A Withdrawn GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0920488.4A Ceased GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB1017170.0A Ceased GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
GB1018958A Withdrawn GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Country Status (1)
Country | Link |
---|---|
GB (4) | GB0920488D0 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108827835A (en) * | 2018-07-03 | 2018-11-16 | 重庆知遨科技有限公司 | Pulling escape liquid surface tension coefficient measuring device |
CN114682948B (en) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | Method, device and system for testing weldability of chip component |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3498100B2 (en) * | 1993-06-24 | 2004-02-16 | ソニー株式会社 | Solderability test method and apparatus and micro crucible for test |
DE4404656C1 (en) * | 1994-02-14 | 1995-06-08 | Siemens Nixdorf Inf Syst | Solder paste moistening property determination |
JPH09145589A (en) * | 1995-09-20 | 1997-06-06 | Sony Corp | Method and apparatus for testing of solderability of electronic component |
JPH10305364A (en) * | 1997-05-06 | 1998-11-17 | Sony Corp | Soldering test for electronic parts and device therefor |
JP3882362B2 (en) * | 1998-04-10 | 2007-02-14 | ソニー株式会社 | Test piece for solderability evaluation and printed wiring board having the same |
JP4284873B2 (en) * | 2001-02-27 | 2009-06-24 | ソニー株式会社 | Solderability test apparatus and solderability test method |
JP2005033149A (en) * | 2003-07-11 | 2005-02-03 | Resuka:Kk | Method and apparatus for evaluation test of solder wettability of mounting component |
-
2009
- 2009-11-21 GB GBGB0920488.4A patent/GB0920488D0/en not_active Ceased
-
2010
- 2010-06-10 GB GBGB1009682.4A patent/GB201009682D0/en not_active Ceased
- 2010-09-22 GB GBGB1017170.0A patent/GB201017170D0/en not_active Ceased
- 2010-11-10 GB GB1018958A patent/GB2475600A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB201018958D0 (en) | 2010-12-22 |
GB2475600A (en) | 2011-05-25 |
GB201017170D0 (en) | 2010-11-24 |
GB0920488D0 (en) | 2010-01-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AT | Applications terminated before publication under section 16(1) |