GB0920488D0 - Synchronous method for assessing solder pastes - Google Patents
Synchronous method for assessing solder pastesInfo
- Publication number
- GB0920488D0 GB0920488D0 GBGB0920488.4A GB0920488A GB0920488D0 GB 0920488 D0 GB0920488 D0 GB 0920488D0 GB 0920488 A GB0920488 A GB 0920488A GB 0920488 D0 GB0920488 D0 GB 0920488D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- assessing
- synchronous method
- solder pastes
- pastes
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N13/02—Investigating surface tension of liquids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/06—Indicating or recording means; Sensing means
- G01N2203/067—Parameter measured for estimating the property
- G01N2203/0676—Force, weight, load, energy, speed or acceleration
Landscapes
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0920488.4A GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
| GBGB1009682.4A GB201009682D0 (en) | 2009-11-21 | 2010-06-10 | Synchronous test method for assessing soldering pastes |
| GBGB1017170.0A GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
| GB1018958A GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0920488.4A GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB0920488D0 true GB0920488D0 (en) | 2010-01-06 |
Family
ID=41565723
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GBGB0920488.4A Ceased GB0920488D0 (en) | 2009-11-21 | 2009-11-21 | Synchronous method for assessing solder pastes |
| GBGB1009682.4A Ceased GB201009682D0 (en) | 2009-11-21 | 2010-06-10 | Synchronous test method for assessing soldering pastes |
| GBGB1017170.0A Ceased GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
| GB1018958A Withdrawn GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GBGB1009682.4A Ceased GB201009682D0 (en) | 2009-11-21 | 2010-06-10 | Synchronous test method for assessing soldering pastes |
| GBGB1017170.0A Ceased GB201017170D0 (en) | 2009-11-21 | 2010-09-22 | Synchronous test method for assessing solder pastes |
| GB1018958A Withdrawn GB2475600A (en) | 2009-11-21 | 2010-11-10 | Synchronous testing of the solderability of components and solder paste usability |
Country Status (1)
| Country | Link |
|---|---|
| GB (4) | GB0920488D0 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108827835A (en) * | 2018-07-03 | 2018-11-16 | 重庆知遨科技有限公司 | Pulling escape liquid surface tension coefficient measuring device |
| CN114682948B (en) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | Solderability testing methods, devices and systems for chip components |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3498100B2 (en) * | 1993-06-24 | 2004-02-16 | ソニー株式会社 | Solderability test method and apparatus and micro crucible for test |
| DE4404656C1 (en) * | 1994-02-14 | 1995-06-08 | Siemens Nixdorf Inf Syst | Solder paste moistening property determination |
| JPH09145589A (en) * | 1995-09-20 | 1997-06-06 | Sony Corp | Method and apparatus for testing solderability of electronic components |
| JPH10305364A (en) * | 1997-05-06 | 1998-11-17 | Sony Corp | Method and apparatus for testing solderability of electronic components |
| JP3882362B2 (en) * | 1998-04-10 | 2007-02-14 | ソニー株式会社 | Test piece for solderability evaluation and printed wiring board having the same |
| JP4284873B2 (en) * | 2001-02-27 | 2009-06-24 | ソニー株式会社 | Solderability test apparatus and solderability test method |
| JP2005033149A (en) * | 2003-07-11 | 2005-02-03 | Resuka:Kk | Method and apparatus for evaluating solder wettability of mounted components |
-
2009
- 2009-11-21 GB GBGB0920488.4A patent/GB0920488D0/en not_active Ceased
-
2010
- 2010-06-10 GB GBGB1009682.4A patent/GB201009682D0/en not_active Ceased
- 2010-09-22 GB GBGB1017170.0A patent/GB201017170D0/en not_active Ceased
- 2010-11-10 GB GB1018958A patent/GB2475600A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB201009682D0 (en) | 2010-07-21 |
| GB2475600A (en) | 2011-05-25 |
| GB201018958D0 (en) | 2010-12-22 |
| GB201017170D0 (en) | 2010-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AT | Applications terminated before publication under section 16(1) |