GB2008784B - Heat resistant photoresist composition and process for preparing the same - Google Patents

Heat resistant photoresist composition and process for preparing the same

Info

Publication number
GB2008784B
GB2008784B GB7844576A GB7844576A GB2008784B GB 2008784 B GB2008784 B GB 2008784B GB 7844576 A GB7844576 A GB 7844576A GB 7844576 A GB7844576 A GB 7844576A GB 2008784 B GB2008784 B GB 2008784B
Authority
GB
United Kingdom
Prior art keywords
preparing
same
heat resistant
photoresist composition
resistant photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7844576A
Other languages
English (en)
Other versions
GB2008784A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13725677A external-priority patent/JPS6054666B2/ja
Priority claimed from JP15561077A external-priority patent/JPS5950049B2/ja
Priority claimed from JP15668777A external-priority patent/JPS6023341B2/ja
Priority claimed from JP15748177A external-priority patent/JPS5950050B2/ja
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of GB2008784A publication Critical patent/GB2008784A/en
Application granted granted Critical
Publication of GB2008784B publication Critical patent/GB2008784B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
GB7844576A 1977-11-17 1978-11-15 Heat resistant photoresist composition and process for preparing the same Expired GB2008784B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP13725677A JPS6054666B2 (ja) 1977-11-17 1977-11-17 耐熱性フオトレジスト組成物およびその製造法
JP15561077A JPS5950049B2 (ja) 1977-12-26 1977-12-26 耐熱性フオトレジスト組成物
JP15668777A JPS6023341B2 (ja) 1977-12-27 1977-12-27 耐熱性フオトレジスト組成物およびその製造方法
JP15748177A JPS5950050B2 (ja) 1977-12-28 1977-12-28 耐熱性フオトレジスト組成物およびその製造法

Publications (2)

Publication Number Publication Date
GB2008784A GB2008784A (en) 1979-06-06
GB2008784B true GB2008784B (en) 1982-04-15

Family

ID=27472052

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7844576A Expired GB2008784B (en) 1977-11-17 1978-11-15 Heat resistant photoresist composition and process for preparing the same

Country Status (3)

Country Link
DE (1) DE2849981A1 (de)
FR (1) FR2409535A1 (de)
GB (1) GB2008784B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1144060B (it) * 1979-05-11 1986-10-29 Minnesota Mining & Mfg Procedimento per la maturazione di acidi poliammici o loro sali mediante irradiazione ultravioletta ad esempio per la formazione di immagini in substrati e prodotto ottenuto
JPS5614554A (en) * 1979-07-13 1981-02-12 Kanegafuchi Chem Ind Co Ltd Heat resistant resin composition
DE3407201A1 (de) * 1984-02-28 1985-08-29 Bayer Ag, 5090 Leverkusen Verfahren zur phenolfreien herstellung von aliphatisch-aromatischen polyamidimiden
US8771924B2 (en) * 2006-12-26 2014-07-08 Fujifilm Corporation Polymerizable composition, lithographic printing plate precursor and lithographic printing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1181446A (en) * 1966-07-22 1970-02-18 Hitachi Chemical Co Ltd Process for producing Amide-Imide Resins
ZA716460B (en) * 1970-11-19 1972-07-26 Gen Electric Improved polyamideimides
DE2112141A1 (de) * 1971-03-13 1972-10-05 Agfa Gevaert Ag Photographisches Material
US4079041A (en) * 1975-06-18 1978-03-14 Ciba-Geigy Corporation Crosslinkable polymeric compounds

Also Published As

Publication number Publication date
FR2409535A1 (fr) 1979-06-15
FR2409535B1 (de) 1983-01-21
DE2849981A1 (de) 1979-05-23
DE2849981C2 (de) 1987-07-16
GB2008784A (en) 1979-06-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19951115