GB2004127A - A device for interconnecting microcircuits - Google Patents
A device for interconnecting microcircuitsInfo
- Publication number
- GB2004127A GB2004127A GB7836298A GB7836298A GB2004127A GB 2004127 A GB2004127 A GB 2004127A GB 7836298 A GB7836298 A GB 7836298A GB 7836298 A GB7836298 A GB 7836298A GB 2004127 A GB2004127 A GB 2004127A
- Authority
- GB
- United Kingdom
- Prior art keywords
- microcircuits
- conductors
- interconnecting
- film
- apertures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Led Device Packages (AREA)
Abstract
A device for interconnecting microcircuits, such as integrated circuits, resistors, LEDs and photo-diodes, comprises a network of conductors 107, on a dielectric film 101, having apertures 105, 106 for receiving the microcircuits 110, 111,to which ends of conductors 107 are welded. External connections are made to portions of conductors 107 bridging apertures 103, 104 in film 101. Further conductors may be formed on the remote side of film 101, via holes being provided. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7727469A FR2402995A1 (en) | 1977-09-12 | 1977-09-12 | MICRO-CIRCUIT INTERCONNECTION DEVICE |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2004127A true GB2004127A (en) | 1979-03-21 |
GB2004127B GB2004127B (en) | 1982-07-14 |
Family
ID=9195259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7836298A Expired GB2004127B (en) | 1977-09-12 | 1978-09-11 | Device for interconnecting microcircuits |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5450871A (en) |
DE (1) | DE2839215A1 (en) |
FR (1) | FR2402995A1 (en) |
GB (1) | GB2004127B (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593639A1 (en) * | 1985-10-25 | 1987-07-31 | Sharp Kk | PROCESS FOR REPLACING SEMICONDUCTOR DEVICES IN A MULTI-CHIP MODULE |
WO1987006766A1 (en) * | 1986-05-01 | 1987-11-05 | Honeywell Inc. | Multiple integrated circuit interconnection arrangement |
WO1988002210A1 (en) * | 1986-09-15 | 1988-03-24 | Baysage Pty. Ltd. | Electrical isolation device |
GB2204184A (en) * | 1987-04-29 | 1988-11-02 | Stanley Bracey | Mounting electronic components on substrates |
EP0370438A1 (en) * | 1988-11-21 | 1990-05-30 | Hewlett-Packard Company | Method for preparing a flexible electrical connector |
US4933810A (en) * | 1987-04-30 | 1990-06-12 | Honeywell Inc. | Integrated circuit interconnector |
EP0375908A2 (en) * | 1988-12-29 | 1990-07-04 | International Business Machines Corporation | Method and structure for implementing dynamic chip burn-in |
WO1991000618A1 (en) * | 1989-07-03 | 1991-01-10 | General Electric Company | Electronic systems disposed in a high force environment |
EP0409290A2 (en) * | 1984-02-21 | 1991-01-23 | Environmental Research Institute of Michigan | Wafer scale package system and header and method of manufacture thereof |
US5164888A (en) * | 1988-12-29 | 1992-11-17 | International Business Machines | Method and structure for implementing dynamic chip burn-in |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3061383D1 (en) * | 1979-02-19 | 1983-01-27 | Fujitsu Ltd | Semiconductor device and method for manufacturing the same |
JP3985016B2 (en) * | 1997-10-31 | 2007-10-03 | 沖電気工業株式会社 | Semiconductor device |
-
1977
- 1977-09-12 FR FR7727469A patent/FR2402995A1/en active Granted
-
1978
- 1978-09-08 DE DE19782839215 patent/DE2839215A1/en not_active Withdrawn
- 1978-09-11 GB GB7836298A patent/GB2004127B/en not_active Expired
- 1978-09-12 JP JP11212878A patent/JPS5450871A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0409290A2 (en) * | 1984-02-21 | 1991-01-23 | Environmental Research Institute of Michigan | Wafer scale package system and header and method of manufacture thereof |
EP0409290A3 (en) * | 1984-02-21 | 1991-12-18 | Mosaic Systems, Inc. | Wafer scale package system and header and method of manufacture thereof |
FR2593639A1 (en) * | 1985-10-25 | 1987-07-31 | Sharp Kk | PROCESS FOR REPLACING SEMICONDUCTOR DEVICES IN A MULTI-CHIP MODULE |
WO1987006766A1 (en) * | 1986-05-01 | 1987-11-05 | Honeywell Inc. | Multiple integrated circuit interconnection arrangement |
US5126920A (en) * | 1986-05-01 | 1992-06-30 | Honeywell Inc. | Multiple integrated circuit interconnection arrangement |
WO1988002210A1 (en) * | 1986-09-15 | 1988-03-24 | Baysage Pty. Ltd. | Electrical isolation device |
GB2204184A (en) * | 1987-04-29 | 1988-11-02 | Stanley Bracey | Mounting electronic components on substrates |
US4933810A (en) * | 1987-04-30 | 1990-06-12 | Honeywell Inc. | Integrated circuit interconnector |
US4989317A (en) * | 1988-11-21 | 1991-02-05 | Hewlett-Packard Company | Method for making tab circuit electrical connector supporting multiple components thereon |
EP0370438A1 (en) * | 1988-11-21 | 1990-05-30 | Hewlett-Packard Company | Method for preparing a flexible electrical connector |
EP0375908A3 (en) * | 1988-12-29 | 1991-04-03 | International Business Machines Corporation | Method and structure for implementing dynamic chip burn-in |
EP0375908A2 (en) * | 1988-12-29 | 1990-07-04 | International Business Machines Corporation | Method and structure for implementing dynamic chip burn-in |
US5164888A (en) * | 1988-12-29 | 1992-11-17 | International Business Machines | Method and structure for implementing dynamic chip burn-in |
WO1991000618A1 (en) * | 1989-07-03 | 1991-01-10 | General Electric Company | Electronic systems disposed in a high force environment |
Also Published As
Publication number | Publication date |
---|---|
JPS5450871A (en) | 1979-04-21 |
FR2402995B1 (en) | 1980-12-26 |
FR2402995A1 (en) | 1979-04-06 |
GB2004127B (en) | 1982-07-14 |
DE2839215A1 (en) | 1979-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |