GB1548017A - Productions of structures consisting of positive photolacquer layers on a carrier - Google Patents
Productions of structures consisting of positive photolacquer layers on a carrierInfo
- Publication number
- GB1548017A GB1548017A GB27153/76A GB2715376A GB1548017A GB 1548017 A GB1548017 A GB 1548017A GB 27153/76 A GB27153/76 A GB 27153/76A GB 2715376 A GB2715376 A GB 2715376A GB 1548017 A GB1548017 A GB 1548017A
- Authority
- GB
- United Kingdom
- Prior art keywords
- productions
- carrier
- structures consisting
- layers
- positive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2534795A DE2534795C3 (en) | 1975-08-04 | 1975-08-04 | Process for the production of structures from positive photoresist layers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1548017A true GB1548017A (en) | 1979-07-04 |
Family
ID=5953192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB27153/76A Expired GB1548017A (en) | 1975-08-04 | 1976-06-30 | Productions of structures consisting of positive photolacquer layers on a carrier |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5219531A (en) |
BE (1) | BE844743A (en) |
DE (1) | DE2534795C3 (en) |
FR (1) | FR2320584A1 (en) |
GB (1) | GB1548017A (en) |
IT (1) | IT1067163B (en) |
NL (1) | NL7608635A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0601887A1 (en) * | 1992-12-10 | 1994-06-15 | Samsung Electronics Co., Ltd. | Method for forming pattern |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5329135B2 (en) * | 1973-12-12 | 1978-08-18 | ||
AU544060B2 (en) * | 1980-07-28 | 1985-05-16 | Polychrome Corp. | Accelerated diazo sensitised |
DE3216268A1 (en) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Method of reducing line width variations in the production of patterns composed of photoresist layers on substrates provided for integrated semiconductor circuits by optical projection exposure |
DE3310962A1 (en) * | 1983-03-25 | 1984-09-27 | Siemens AG, 1000 Berlin und 8000 München | Method of reducing line-width variations in the production of photoresist patterns |
JPS6155649A (en) * | 1984-08-27 | 1986-03-20 | Nippon Telegr & Teleph Corp <Ntt> | Formation of pattern |
CA1285418C (en) * | 1985-07-18 | 1991-07-02 | Robert A. Owens | Pre-exposure method for increased sensitivity in high contrast resist development |
FR2618230A1 (en) * | 1987-07-17 | 1989-01-20 | Thomson Semiconducteurs | Photolithograpy process |
KR930008139B1 (en) * | 1990-08-30 | 1993-08-26 | Samsung Electronics Co Ltd | Method for preparation of pattern |
-
1975
- 1975-08-04 DE DE2534795A patent/DE2534795C3/en not_active Expired
-
1976
- 1976-06-30 GB GB27153/76A patent/GB1548017A/en not_active Expired
- 1976-07-26 FR FR7622726A patent/FR2320584A1/en active Granted
- 1976-07-27 IT IT25720/76A patent/IT1067163B/en active
- 1976-07-30 BE BE169435A patent/BE844743A/en unknown
- 1976-07-30 JP JP51091228A patent/JPS5219531A/en active Pending
- 1976-08-03 NL NL7608635A patent/NL7608635A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0601887A1 (en) * | 1992-12-10 | 1994-06-15 | Samsung Electronics Co., Ltd. | Method for forming pattern |
Also Published As
Publication number | Publication date |
---|---|
IT1067163B (en) | 1985-03-12 |
DE2534795A1 (en) | 1977-02-10 |
FR2320584A1 (en) | 1977-03-04 |
DE2534795B2 (en) | 1977-09-29 |
DE2534795C3 (en) | 1978-05-24 |
FR2320584B1 (en) | 1979-09-28 |
NL7608635A (en) | 1977-02-08 |
BE844743A (en) | 1976-11-16 |
JPS5219531A (en) | 1977-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |