GB1522294A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1522294A GB1522294A GB25028/77A GB2502877A GB1522294A GB 1522294 A GB1522294 A GB 1522294A GB 25028/77 A GB25028/77 A GB 25028/77A GB 2502877 A GB2502877 A GB 2502877A GB 1522294 A GB1522294 A GB 1522294A
- Authority
- GB
- United Kingdom
- Prior art keywords
- fet
- depletion
- polycrystalline silicon
- electrode
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 238000003860 storage Methods 0.000 abstract 2
- 238000003486 chemical etching Methods 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 230000005669 field effect Effects 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 238000002955 isolation Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
1522294 Complementary field effect transistors INTERNATIONAL BUSINESS MACHINES CORP 15 June 1977 [2 July 1976] 25028/77 Heading H1K A method of fabricating an enhancementmode FET and a depletion-mode FET in a semiconductor substrate involves five lithographic masking steps which delineate in order (1) field isolation regions 3; (2) an enhancementmode FET gate electrode 13 from a first doped polycrystalline silicon layer; (3) a depletionmode FET gate electrode 22 from a second and subsequently formed polycrystalline silicon layer; (4) contact holes to FET source and drain regions and to the depletion-mode FET gate (Fig. 2D, not shown) and (5) a relatively high electrical conductivity inter-connecting pattern 34. The self-aligned enhancement mode FET gate electrode 13 is used as n-type ion-implantation mask during the formation of doped, lower electrode 15 of a storage capacitor and the channel region 14 of the depletion-mode FET. The polycrystalline silicon gate pattern 22 and an upper electrode pattern 23 of the storage capacitor are formed simultaneously by chemical etching using a photo-resist mask, and the electrode patterns are subsequently used as a mask during the formation of source and drain regions 24-27.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/702,247 US4085498A (en) | 1976-02-09 | 1976-07-02 | Fabrication of integrated circuits containing enhancement-mode FETs and depletion-mode FETs with two layers of polycrystalline silicon utilizing five basic pattern delineating steps |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1522294A true GB1522294A (en) | 1978-08-23 |
Family
ID=24820425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB25028/77A Expired GB1522294A (en) | 1976-07-02 | 1977-06-15 | Semiconductor devices |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS535978A (en) |
CA (1) | CA1088676A (en) |
DE (1) | DE2723254A1 (en) |
GB (1) | GB1522294A (en) |
IT (1) | IT1113770B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2199694A (en) * | 1986-12-23 | 1988-07-13 | Philips Electronic Associated | A method of manufacturing a semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4240092A (en) * | 1976-09-13 | 1980-12-16 | Texas Instruments Incorporated | Random access memory cell with different capacitor and transistor oxide thickness |
-
1977
- 1977-05-24 DE DE19772723254 patent/DE2723254A1/en active Granted
- 1977-06-15 GB GB25028/77A patent/GB1522294A/en not_active Expired
- 1977-06-23 IT IT24970/77A patent/IT1113770B/en active
- 1977-06-27 JP JP7565077A patent/JPS535978A/en active Granted
- 1977-06-30 CA CA281,849A patent/CA1088676A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2199694A (en) * | 1986-12-23 | 1988-07-13 | Philips Electronic Associated | A method of manufacturing a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5525515B2 (en) | 1980-07-07 |
DE2723254A1 (en) | 1978-01-12 |
DE2723254C2 (en) | 1987-10-08 |
IT1113770B (en) | 1986-01-20 |
CA1088676A (en) | 1980-10-28 |
JPS535978A (en) | 1978-01-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |