GB1520161A - Epoxide resin mixtures - Google Patents
Epoxide resin mixturesInfo
- Publication number
- GB1520161A GB1520161A GB748076A GB748076A GB1520161A GB 1520161 A GB1520161 A GB 1520161A GB 748076 A GB748076 A GB 748076A GB 748076 A GB748076 A GB 748076A GB 1520161 A GB1520161 A GB 1520161A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mixtures
- dipropyl
- feb
- iii
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
1520161 Curable epoxy resin mixtures; organopolysiloxanes CIBA GEIGY AG 25 Feb 1976 [28 Feb 1975] 7480/76 Headings C3B and C3S Curable mixtures comprise: (I) a polyglycidyl compound; (II) as curing agent, a polysiloxane in which R1 is methyl, propyl or phenyl so as to form, respectively, dimethyl, dipropyl or diphenyl siloxane units, said dimethyl siloxane units alternating with the dipropyl- or diphenylsiloxane units, R3 is C2-3 alkylene and n=1-30; and (III) as curing catalyst, from 0À5-10% by weight (based on I+II) of a tertiary amine. The mixtures contain 0À2-1À1 equivalents of active amino hydrogen atoms of II per epoxide equivalent of I. I may be a diglycidyl ether of bisphenol A. In Examples II is prepared by reacting 1 mole of a linear poly(methyl phenylsiloxane) (M.W. 875) having methoxy end groups with 2 moles of (a) ethanolamine and (b) 1-amino-2-propanol. III may be N,N-dimethylaminopropylamine. Curing may take place at 50-100‹ C.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH256375 | 1975-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1520161A true GB1520161A (en) | 1978-08-02 |
Family
ID=4236614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB748076A Expired GB1520161A (en) | 1975-02-28 | 1976-02-25 | Epoxide resin mixtures |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS51111299A (en) |
| DE (1) | DE2607663A1 (en) |
| FR (1) | FR2302321A1 (en) |
| GB (1) | GB1520161A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999067316A1 (en) * | 1998-06-22 | 1999-12-29 | Minnesota Mining And Manufacturing Company | Adhesive compositions |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4394492A (en) * | 1981-06-30 | 1983-07-19 | Ciba-Geigy Corporation | Curing epoxide resins in an aquatic environment |
| JPS59129252A (en) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | Epoxy resin molding material |
| JP5298913B2 (en) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | Adhesive composition and protective sheet for semiconductor wafer using the same |
-
1976
- 1976-02-25 GB GB748076A patent/GB1520161A/en not_active Expired
- 1976-02-25 DE DE19762607663 patent/DE2607663A1/en active Pending
- 1976-02-27 FR FR7605550A patent/FR2302321A1/en active Granted
- 1976-02-28 JP JP2174876A patent/JPS51111299A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999067316A1 (en) * | 1998-06-22 | 1999-12-29 | Minnesota Mining And Manufacturing Company | Adhesive compositions |
| US6196730B1 (en) | 1998-06-22 | 2001-03-06 | 3M Innovative Properties Company | Fiber optic connector containing a curable adhesive composition |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2607663A1 (en) | 1976-09-02 |
| FR2302321A1 (en) | 1976-09-24 |
| FR2302321B1 (en) | 1979-06-22 |
| JPS51111299A (en) | 1976-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |