GB1170105A - Epoxy Resin having High Dielectric Loss Factor - Google Patents

Epoxy Resin having High Dielectric Loss Factor

Info

Publication number
GB1170105A
GB1170105A GB5229/67A GB522967A GB1170105A GB 1170105 A GB1170105 A GB 1170105A GB 5229/67 A GB5229/67 A GB 5229/67A GB 522967 A GB522967 A GB 522967A GB 1170105 A GB1170105 A GB 1170105A
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
adduct
polyglycol
diglycidyl ether
high dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5229/67A
Inventor
Christian Albert Weber
Dale Duane Rogers
Paul Carl Woodland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Chemical Co
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL6701600A priority Critical patent/NL6701600A/xx
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Priority to GB5229/67A priority patent/GB1170105A/en
Priority claimed from CH162367A external-priority patent/CH482762A/en
Publication of GB1170105A publication Critical patent/GB1170105A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)

Abstract

1,170,105. Epoxy resin. DOW CHEMICAL CO. 3 Feb., 1967, No. 5229/67. Heading C3B. An epoxy resin composition which thermosets to give a product having a high dielectric loss factor comprises an equimolar mixture of a diglycidyl ether of a thiobisphenol containing 1 or 2 sulphur atoms and a hardening agent which is an adduct of an aliphatic polyamine and a diglycidyl ether and which has the formula in which R<SP>1</SP> may be a C 1-6 alkylene or secondary amino group and R<SP>2</SP> may be an alkylene, arylene, polyoxyalkylene or bisphenol group. A portion of the latter curing agent may be replaced by the diamine of a polyglycol, i.e. a compound obtained by replacing the terminal OH groups of the polyglycol with amino group; the molar ratio of the adduct to the polyglycol diamine being 4 : 0 to 1 : 3. The adduct may be prepared from the diglycidyl ether of bisphenol A and diethylene triamine. The composition may also contain up to 20 parts by weight of a phenolic accelerator.
GB5229/67A 1967-02-02 1967-02-03 Epoxy Resin having High Dielectric Loss Factor Expired GB1170105A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NL6701600A NL6701600A (en) 1967-02-02 1967-02-02
GB5229/67A GB1170105A (en) 1967-02-02 1967-02-03 Epoxy Resin having High Dielectric Loss Factor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL6701600A NL6701600A (en) 1967-02-02 1967-02-02
CH162367A CH482762A (en) 1967-02-02 1967-02-03 Thermosetting epoxy resin curing agent mixture with high dielectric loss factor
GB5229/67A GB1170105A (en) 1967-02-02 1967-02-03 Epoxy Resin having High Dielectric Loss Factor

Publications (1)

Publication Number Publication Date
GB1170105A true GB1170105A (en) 1969-11-12

Family

ID=27173125

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5229/67A Expired GB1170105A (en) 1967-02-02 1967-02-03 Epoxy Resin having High Dielectric Loss Factor

Country Status (2)

Country Link
GB (1) GB1170105A (en)
NL (1) NL6701600A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346809A2 (en) * 1988-06-14 1989-12-20 Ciba-Geigy Ag Kneading mixture
EP0478918A2 (en) * 1990-08-03 1992-04-08 The Dow Chemical Company Adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
US5264502A (en) * 1990-08-03 1993-11-23 The Dow Chemical Company Diamino-alpha-alkylstilbene curing agents for epoxy resins
US5268434A (en) * 1990-08-03 1993-12-07 The Dow Chemical Company Diamino-alpha-alkylstilbenes as epoxy resin curing agents
EP0598302A1 (en) * 1992-11-10 1994-05-25 Sumitomo Chemical Company, Limited Epoxy resin compositions and resin-encapsulated semiconductor devices
US5414125A (en) * 1990-08-03 1995-05-09 The Dow Chemical Company Diamino-alpha-alkylstilbenes

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0346809A2 (en) * 1988-06-14 1989-12-20 Ciba-Geigy Ag Kneading mixture
EP0346809A3 (en) * 1988-06-14 1990-09-19 Ciba-Geigy Ag Kneading mixture
EP0478918A2 (en) * 1990-08-03 1992-04-08 The Dow Chemical Company Adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
EP0478918A3 (en) * 1990-08-03 1992-08-26 The Dow Chemical Company Adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
US5264502A (en) * 1990-08-03 1993-11-23 The Dow Chemical Company Diamino-alpha-alkylstilbene curing agents for epoxy resins
US5268434A (en) * 1990-08-03 1993-12-07 The Dow Chemical Company Diamino-alpha-alkylstilbenes as epoxy resin curing agents
US5276184A (en) * 1990-08-03 1994-01-04 The Dow Chemical Company Sulfonamide compounds containing mesogenic moieties
US5414125A (en) * 1990-08-03 1995-05-09 The Dow Chemical Company Diamino-alpha-alkylstilbenes
US5602211A (en) * 1990-08-03 1997-02-11 The Dow Chemical Company Adducts of epoxy resins and active hydrogen containing compounds containing mesogenic moieties
EP0598302A1 (en) * 1992-11-10 1994-05-25 Sumitomo Chemical Company, Limited Epoxy resin compositions and resin-encapsulated semiconductor devices

Also Published As

Publication number Publication date
NL6701600A (en) 1967-04-25

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