FR2302321A1 - CURING MIXTURES BASED ON EPOXIDIC RESINS - Google Patents
CURING MIXTURES BASED ON EPOXIDIC RESINSInfo
- Publication number
- FR2302321A1 FR2302321A1 FR7605550A FR7605550A FR2302321A1 FR 2302321 A1 FR2302321 A1 FR 2302321A1 FR 7605550 A FR7605550 A FR 7605550A FR 7605550 A FR7605550 A FR 7605550A FR 2302321 A1 FR2302321 A1 FR 2302321A1
- Authority
- FR
- France
- Prior art keywords
- mixtures based
- curing mixtures
- epoxidic resins
- epoxidic
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH256375 | 1975-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2302321A1 true FR2302321A1 (en) | 1976-09-24 |
FR2302321B1 FR2302321B1 (en) | 1979-06-22 |
Family
ID=4236614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7605550A Granted FR2302321A1 (en) | 1975-02-28 | 1976-02-27 | CURING MIXTURES BASED ON EPOXIDIC RESINS |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS51111299A (en) |
DE (1) | DE2607663A1 (en) |
FR (1) | FR2302321A1 (en) |
GB (1) | GB1520161A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS587423A (en) * | 1981-06-30 | 1983-01-17 | チバ−ガイギ−・アクチエンゲゼルシヤフト | Curing composition and method |
JPS59129252A (en) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | Epoxy resin molding material |
US6196730B1 (en) | 1998-06-22 | 2001-03-06 | 3M Innovative Properties Company | Fiber optic connector containing a curable adhesive composition |
JP5298913B2 (en) * | 2009-02-12 | 2013-09-25 | 信越化学工業株式会社 | Adhesive composition and protective sheet for semiconductor wafer using the same |
-
1976
- 1976-02-25 DE DE19762607663 patent/DE2607663A1/en active Pending
- 1976-02-25 GB GB748076A patent/GB1520161A/en not_active Expired
- 1976-02-27 FR FR7605550A patent/FR2302321A1/en active Granted
- 1976-02-28 JP JP2174876A patent/JPS51111299A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2302321B1 (en) | 1979-06-22 |
JPS51111299A (en) | 1976-10-01 |
GB1520161A (en) | 1978-08-02 |
DE2607663A1 (en) | 1976-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |