GB1488943A - Method of the distribution of a dopant in a doped semiconductor body - Google Patents

Method of the distribution of a dopant in a doped semiconductor body

Info

Publication number
GB1488943A
GB1488943A GB924/75A GB92475A GB1488943A GB 1488943 A GB1488943 A GB 1488943A GB 924/75 A GB924/75 A GB 924/75A GB 92475 A GB92475 A GB 92475A GB 1488943 A GB1488943 A GB 1488943A
Authority
GB
United Kingdom
Prior art keywords
dopant
semi
particles
conductor
dopants
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB924/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of GB1488943A publication Critical patent/GB1488943A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/208—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically inactive species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/225—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of a molecular ion, e.g. decaborane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W15/00—Highly-doped buried regions of integrated devices
    • H10W15/01—Manufacture or treatment

Landscapes

  • Bipolar Transistors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
GB924/75A 1974-01-10 1975-01-09 Method of the distribution of a dopant in a doped semiconductor body Expired GB1488943A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7400774A FR2257998B1 (enExample) 1974-01-10 1974-01-10

Publications (1)

Publication Number Publication Date
GB1488943A true GB1488943A (en) 1977-10-19

Family

ID=9133300

Family Applications (1)

Application Number Title Priority Date Filing Date
GB924/75A Expired GB1488943A (en) 1974-01-10 1975-01-09 Method of the distribution of a dopant in a doped semiconductor body

Country Status (7)

Country Link
US (1) US4004950A (enExample)
JP (1) JPS50141271A (enExample)
DE (1) DE2500728A1 (enExample)
FR (1) FR2257998B1 (enExample)
GB (1) GB1488943A (enExample)
IT (1) IT1027260B (enExample)
NL (1) NL7500155A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1542868A (en) * 1975-11-14 1979-03-28 Siemens Ag Production of phosphorus-doped monocrystalline silicon rods
US4043836A (en) * 1976-05-03 1977-08-23 General Electric Company Method of manufacturing semiconductor devices
US4111720A (en) * 1977-03-31 1978-09-05 International Business Machines Corporation Method for forming a non-epitaxial bipolar integrated circuit
US4168990A (en) * 1977-04-04 1979-09-25 International Rectifier Corporation Hot implantation at 1100°-1300° C. for forming non-gaussian impurity profile
US4128439A (en) * 1977-08-01 1978-12-05 International Business Machines Corporation Method for forming self-aligned field effect device by ion implantation and outdiffusion
DE2756861C2 (de) * 1977-12-20 1983-11-24 Max Planck Gesellschaft zur Förderung der Wissenschaften e.V., 3400 Göttingen Verfahren zum Ändern de Lage des Fermi-Niveaus von amorphem Silicium durch Dotieren mittels Ionenimplantation
NL8003336A (nl) * 1979-06-12 1980-12-16 Dearnaley G Werkwijze voor de vervaardiging van een halfgeleider- inrichting.
US4249962A (en) * 1979-09-11 1981-02-10 Western Electric Company, Inc. Method of removing contaminating impurities from device areas in a semiconductor wafer
NL8103649A (nl) * 1981-08-03 1983-03-01 Philips Nv Halfgeleiderinrichting en werkwijze voor het vervaardigen van de halfgeleiderinrichting.
US4506436A (en) * 1981-12-21 1985-03-26 International Business Machines Corporation Method for increasing the radiation resistance of charge storage semiconductor devices
US4596605A (en) * 1982-12-14 1986-06-24 Junichi Nishizawa Fabrication process of static induction transistor and solid-state image sensor device
DE3839210A1 (de) * 1988-11-19 1990-05-23 Asea Brown Boveri Verfahren zum axialen einstellen der traegerlebensdauer
DE102006002903A1 (de) * 2006-01-20 2007-08-02 Infineon Technologies Austria Ag Verfahren zur Behandlung eines Sauerstoff enthaltenden Halbleiterwafers und Halbleiterbauelement
DE502007003501D1 (de) * 2006-01-20 2010-06-02 Infineon Technologies Austria Nden halbleiterwafers und halbleiterbauelement
US8211784B2 (en) * 2009-10-26 2012-07-03 Advanced Ion Beam Technology, Inc. Method for manufacturing a semiconductor device with less leakage current induced by carbon implant
WO2012081664A1 (ja) 2010-12-17 2012-06-21 富士電機株式会社 半導体装置およびその製造方法
WO2015191561A1 (en) * 2014-06-09 2015-12-17 Mears Technologies, Inc. Semiconductor devices with enhanced deterministic doping and related methods
DE102015109661A1 (de) * 2015-06-17 2016-12-22 Infineon Technologies Ag Verfahren zum Bilden eines Halbleiterbauelements und Halbleiterbauelement
DE102015119648B4 (de) * 2015-11-13 2022-11-10 Infineon Technologies Ag Verfahren zum herstellen einer halbleitervorrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383567A (en) * 1965-09-15 1968-05-14 Ion Physics Corp Solid state translating device comprising irradiation implanted conductivity ions
US3515956A (en) * 1967-10-16 1970-06-02 Ion Physics Corp High-voltage semiconductor device having a guard ring containing substitutionally active ions in interstitial positions
US3513035A (en) * 1967-11-01 1970-05-19 Fairchild Camera Instr Co Semiconductor device process for reducing surface recombination velocity
US3622382A (en) * 1969-05-05 1971-11-23 Ibm Semiconductor isolation structure and method of producing
US3718502A (en) * 1969-10-15 1973-02-27 J Gibbons Enhancement of diffusion of atoms into a heated substrate by bombardment
GB1307546A (en) * 1970-05-22 1973-02-21 Mullard Ltd Methods of manufacturing semiconductor devices
US3756862A (en) * 1971-12-21 1973-09-04 Ibm Proton enhanced diffusion methods

Also Published As

Publication number Publication date
FR2257998A1 (enExample) 1975-08-08
FR2257998B1 (enExample) 1976-11-26
JPS50141271A (enExample) 1975-11-13
DE2500728A1 (de) 1975-07-17
IT1027260B (it) 1978-11-20
NL7500155A (nl) 1975-07-14
US4004950A (en) 1977-01-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee