GB1469008A - Electrical relay devices - Google Patents

Electrical relay devices

Info

Publication number
GB1469008A
GB1469008A GB5557774A GB5557774A GB1469008A GB 1469008 A GB1469008 A GB 1469008A GB 5557774 A GB5557774 A GB 5557774A GB 5557774 A GB5557774 A GB 5557774A GB 1469008 A GB1469008 A GB 1469008A
Authority
GB
United Kingdom
Prior art keywords
heater
film
semi
sensing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5557774A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Multi State Devices Ltd
Original Assignee
Multi State Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Multi State Devices Ltd filed Critical Multi State Devices Ltd
Publication of GB1469008A publication Critical patent/GB1469008A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
    • H01C7/043—Oxides or oxidic compounds
    • H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
  • Thermistors And Varistors (AREA)
  • Thermally Actuated Switches (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Resistance Heating (AREA)
GB5557774A 1974-01-07 1974-12-23 Electrical relay devices Expired GB1469008A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US431428A US3872418A (en) 1974-01-07 1974-01-07 Electrical relay device

Publications (1)

Publication Number Publication Date
GB1469008A true GB1469008A (en) 1977-03-30

Family

ID=23711900

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5557774A Expired GB1469008A (en) 1974-01-07 1974-12-23 Electrical relay devices

Country Status (10)

Country Link
US (1) US3872418A (en, 2012)
JP (1) JPS50116945A (en, 2012)
AU (1) AU7596574A (en, 2012)
BE (1) BE824173A (en, 2012)
CA (1) CA997480A (en, 2012)
DE (1) DE2459906A1 (en, 2012)
FR (1) FR2257152B3 (en, 2012)
GB (1) GB1469008A (en, 2012)
NL (1) NL7415921A (en, 2012)
SE (1) SE7500085L (en, 2012)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237474A (en) * 1978-10-18 1980-12-02 Rca Corporation Electroluminescent diode and optical fiber assembly
US4450496A (en) * 1979-08-16 1984-05-22 Raychem Corporation Protection of certain electrical systems by use of PTC device
US4739382A (en) * 1985-05-31 1988-04-19 Tektronix, Inc. Package for a charge-coupled device with temperature dependent cooling
EP0208970B1 (de) * 1985-07-09 1990-05-23 Siemens Aktiengesellschaft MOSFET mit Temperaturschutz
US4757528A (en) * 1986-09-05 1988-07-12 Harris Corporation Thermally coupled information transmission across electrical isolation boundaries
US5008736A (en) * 1989-11-20 1991-04-16 Motorola, Inc. Thermal protection method for a power device
US5374123A (en) * 1992-05-20 1994-12-20 Goldstar Co., Ltd. Thermal comfort sensing device
US6300859B1 (en) * 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
US9632630B2 (en) * 2011-11-17 2017-04-25 Tera Xtal Technology Corp. Touch panel structure
JP6945129B2 (ja) * 2016-09-01 2021-10-06 パナソニックＩｐマネジメント株式会社 温度センサ
CN113506849B (zh) * 2018-12-14 2022-07-08 新唐科技日本株式会社 半导体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3503030A (en) * 1966-11-11 1970-03-24 Fujitsu Ltd Indirectly-heated thermistor
US3621446A (en) * 1969-02-17 1971-11-16 Bell Telephone Labor Inc Thermal relay
US3614345A (en) * 1969-11-17 1971-10-19 Zyrotron Ind Inc Thermal sensing device

Also Published As

Publication number Publication date
SE7500085L (en, 2012) 1975-07-08
FR2257152A1 (en, 2012) 1975-08-01
JPS50116945A (en, 2012) 1975-09-12
NL7415921A (nl) 1975-07-09
CA997480A (en) 1976-09-21
FR2257152B3 (en, 2012) 1977-09-30
US3872418A (en) 1975-03-18
BE824173A (fr) 1975-05-02
AU7596574A (en) 1976-06-03
DE2459906A1 (de) 1975-07-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLE Entries relating assignments, transmissions, licences in the register of patents
PCNP Patent ceased through non-payment of renewal fee