DE2459906A1 - Elektrisches relais - Google Patents
Elektrisches relaisInfo
- Publication number
- DE2459906A1 DE2459906A1 DE19742459906 DE2459906A DE2459906A1 DE 2459906 A1 DE2459906 A1 DE 2459906A1 DE 19742459906 DE19742459906 DE 19742459906 DE 2459906 A DE2459906 A DE 2459906A DE 2459906 A1 DE2459906 A1 DE 2459906A1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- sensor
- relay according
- attached
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004353 relayed correlation spectroscopy Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 71
- 238000010438 heat treatment Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 32
- 239000011888 foil Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 229910021542 Vanadium(IV) oxide Inorganic materials 0.000 claims description 4
- 239000010408 film Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- GRUMUEUJTSXQOI-UHFFFAOYSA-N vanadium dioxide Chemical compound O=[V]=O GRUMUEUJTSXQOI-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims 1
- 229910001935 vanadium oxide Inorganic materials 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910021541 Vanadium(III) oxide Inorganic materials 0.000 description 1
- 229910052946 acanthite Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- QPADNTZLUBYNEN-UHFFFAOYSA-N etallobarbital Chemical compound C=CCC1(CC)C(=O)NC(=O)NC1=O QPADNTZLUBYNEN-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/047—Vanadium oxides or oxidic compounds, e.g. VOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of Resistance Heating (AREA)
- Thermistors And Varistors (AREA)
- Thermally Actuated Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US431428A US3872418A (en) | 1974-01-07 | 1974-01-07 | Electrical relay device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2459906A1 true DE2459906A1 (de) | 1975-07-17 |
Family
ID=23711900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19742459906 Pending DE2459906A1 (de) | 1974-01-07 | 1974-12-18 | Elektrisches relais |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3872418A (en, 2012) |
| JP (1) | JPS50116945A (en, 2012) |
| AU (1) | AU7596574A (en, 2012) |
| BE (1) | BE824173A (en, 2012) |
| CA (1) | CA997480A (en, 2012) |
| DE (1) | DE2459906A1 (en, 2012) |
| FR (1) | FR2257152B3 (en, 2012) |
| GB (1) | GB1469008A (en, 2012) |
| NL (1) | NL7415921A (en, 2012) |
| SE (1) | SE7500085L (en, 2012) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4237474A (en) * | 1978-10-18 | 1980-12-02 | Rca Corporation | Electroluminescent diode and optical fiber assembly |
| US4450496A (en) * | 1979-08-16 | 1984-05-22 | Raychem Corporation | Protection of certain electrical systems by use of PTC device |
| US4739382A (en) * | 1985-05-31 | 1988-04-19 | Tektronix, Inc. | Package for a charge-coupled device with temperature dependent cooling |
| DE3671581D1 (de) * | 1985-07-09 | 1990-06-28 | Siemens Ag | Mosfet mit temperaturschutz. |
| US4757528A (en) * | 1986-09-05 | 1988-07-12 | Harris Corporation | Thermally coupled information transmission across electrical isolation boundaries |
| US5008736A (en) * | 1989-11-20 | 1991-04-16 | Motorola, Inc. | Thermal protection method for a power device |
| US5374123A (en) * | 1992-05-20 | 1994-12-20 | Goldstar Co., Ltd. | Thermal comfort sensing device |
| US6300859B1 (en) * | 1999-08-24 | 2001-10-09 | Tyco Electronics Corporation | Circuit protection devices |
| US9632630B2 (en) * | 2011-11-17 | 2017-04-25 | Tera Xtal Technology Corp. | Touch panel structure |
| US11332381B2 (en) * | 2016-09-01 | 2022-05-17 | Panasonic Intellectual Property Management Co., Ltd. | Functional element and temperature sensor of crystal grain trititanium pentoxide |
| EP3872876B1 (en) * | 2018-12-14 | 2023-06-14 | Nuvoton Technology Corporation Japan | Semiconductor device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3503030A (en) * | 1966-11-11 | 1970-03-24 | Fujitsu Ltd | Indirectly-heated thermistor |
| US3621446A (en) * | 1969-02-17 | 1971-11-16 | Bell Telephone Labor Inc | Thermal relay |
| US3614345A (en) * | 1969-11-17 | 1971-10-19 | Zyrotron Ind Inc | Thermal sensing device |
-
1974
- 1974-01-07 US US431428A patent/US3872418A/en not_active Expired - Lifetime
- 1974-12-02 AU AU75965/74A patent/AU7596574A/en not_active Expired
- 1974-12-06 NL NL7415921A patent/NL7415921A/xx not_active Application Discontinuation
- 1974-12-13 CA CA215,958A patent/CA997480A/en not_active Expired
- 1974-12-18 DE DE19742459906 patent/DE2459906A1/de active Pending
- 1974-12-20 JP JP49146652A patent/JPS50116945A/ja active Pending
- 1974-12-23 GB GB5557774A patent/GB1469008A/en not_active Expired
-
1975
- 1975-01-03 SE SE7500085A patent/SE7500085L/xx unknown
- 1975-01-03 FR FR7500151A patent/FR2257152B3/fr not_active Expired
- 1975-01-07 BE BE152205A patent/BE824173A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3872418A (en) | 1975-03-18 |
| JPS50116945A (en, 2012) | 1975-09-12 |
| BE824173A (fr) | 1975-05-02 |
| FR2257152A1 (en, 2012) | 1975-08-01 |
| SE7500085L (en, 2012) | 1975-07-08 |
| AU7596574A (en) | 1976-06-03 |
| CA997480A (en) | 1976-09-21 |
| FR2257152B3 (en, 2012) | 1977-09-30 |
| NL7415921A (nl) | 1975-07-09 |
| GB1469008A (en) | 1977-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OGA | New person/name/address of the applicant | ||
| OHJ | Non-payment of the annual fee |