GB1465328A - Compression bond assembly for a planar semiconductor device - Google Patents

Compression bond assembly for a planar semiconductor device

Info

Publication number
GB1465328A
GB1465328A GB2445474A GB2445474A GB1465328A GB 1465328 A GB1465328 A GB 1465328A GB 2445474 A GB2445474 A GB 2445474A GB 2445474 A GB2445474 A GB 2445474A GB 1465328 A GB1465328 A GB 1465328A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
preform
region
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2445474A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Westinghouse Electric Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1465328A publication Critical patent/GB1465328A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings

Landscapes

  • Die Bonding (AREA)
GB2445474A 1973-06-19 1974-06-03 Compression bond assembly for a planar semiconductor device Expired GB1465328A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37144873A 1973-06-19 1973-06-19

Publications (1)

Publication Number Publication Date
GB1465328A true GB1465328A (en) 1977-02-23

Family

ID=23464029

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2445474A Expired GB1465328A (en) 1973-06-19 1974-06-03 Compression bond assembly for a planar semiconductor device

Country Status (4)

Country Link
JP (1) JPS5037368A (https=)
CH (1) CH582425A5 (https=)
GB (1) GB1465328A (https=)
SE (1) SE7408138L (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5383073U (https=) * 1976-12-11 1978-07-10
JPH0214777B2 (https=) * 1979-07-04 1990-04-10 Uesuchinguhausu Bureiku Ando Shigunaru Co Ltd
JPH0219974Y2 (https=) * 1979-12-18 1990-05-31
JPS60150670A (ja) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp 半導体装置
JPS60177674A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 圧接形半導体装置の插入電極板の固定方法
DE58905844D1 (de) * 1989-02-02 1993-11-11 Asea Brown Boveri Druckkontaktiertes Halbleiterbauelement.
JP2502386B2 (ja) * 1989-04-11 1996-05-29 富士電機株式会社 半導体装置
EP0433650B1 (en) * 1989-11-17 1998-03-04 Kabushiki Kaisha Toshiba Semiconductor device having bipolar-MOS composite element pellet suitable for pressure contacted structure
DE19505387A1 (de) * 1995-02-17 1996-08-22 Abb Management Ag Druckkontaktgehäuse für Halbleiterbauelemente

Also Published As

Publication number Publication date
JPS5037368A (https=) 1975-04-08
SE7408138L (https=) 1975-02-24
CH582425A5 (https=) 1976-11-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930603