GB1446799A - Patch array for repair of printed circuits - Google Patents

Patch array for repair of printed circuits

Info

Publication number
GB1446799A
GB1446799A GB5053374A GB5053374A GB1446799A GB 1446799 A GB1446799 A GB 1446799A GB 5053374 A GB5053374 A GB 5053374A GB 5053374 A GB5053374 A GB 5053374A GB 1446799 A GB1446799 A GB 1446799A
Authority
GB
United Kingdom
Prior art keywords
track
pad
array
repair
electrolytically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5053374A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pace Inc
Original Assignee
Pace Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pace Inc filed Critical Pace Inc
Publication of GB1446799A publication Critical patent/GB1446799A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

1446799 Repairing printed circuit board circuitry PACE Inc 21 Nov 1974 [7 Nov 1974] 50533/74 Heading B3A [Also in Division H1] A patch arrangement for the repair of printed circuit boards comprises an unsupported thin metal sheet having a surrounding rim and an array, in two rows, of spaced parallel tracks and pads 14 extending from the rim to a central rib. Particular track and pad configurations and sizes are indexed alphabetically at 19. An individual pad 18 and track 14 is structured for easy removal by connection over narrow necks 23, 25 (Fig. 3) and the array is formed, e.g. of copper foil on which the required shape is defined in a photoresist pattern; after which excess metal is electrolytically or electrolessly etched out and the remaining foil is electrolytically solder coated. In use a selected pad 18 is placed over an aperture of the circuit board located by an eyelet, which is soldered to the pad with track 20 overlying the existing track to be repaired for lap soldering thereto. The solder layer may be replaced by a gold and/or gold solder layer.
GB5053374A 1974-11-07 1974-11-21 Patch array for repair of printed circuits Expired GB1446799A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52177374A 1974-11-07 1974-11-07

Publications (1)

Publication Number Publication Date
GB1446799A true GB1446799A (en) 1976-08-18

Family

ID=24078092

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5053374A Expired GB1446799A (en) 1974-11-07 1974-11-21 Patch array for repair of printed circuits

Country Status (4)

Country Link
JP (1) JPS5154263A (en)
DE (1) DE2456903A1 (en)
FR (1) FR2290820A1 (en)
GB (1) GB1446799A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2925286A1 (en) * 1979-06-22 1981-01-08 Siemens Ag Controlled modification of printed circuits - using cutter for removing conductor material and solder tip for connecting new wire
US5079070A (en) * 1990-10-11 1992-01-07 International Business Machines Corporation Repair of open defects in thin film conductors

Also Published As

Publication number Publication date
DE2456903A1 (en) 1976-06-16
JPS5154263A (en) 1976-05-13
FR2290820B1 (en) 1979-07-06
FR2290820A1 (en) 1976-06-04

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee