CN111225516A - Welding method of FPC (flexible printed circuit) circuit board and FPC circuit board structure - Google Patents
Welding method of FPC (flexible printed circuit) circuit board and FPC circuit board structure Download PDFInfo
- Publication number
- CN111225516A CN111225516A CN202010032203.4A CN202010032203A CN111225516A CN 111225516 A CN111225516 A CN 111225516A CN 202010032203 A CN202010032203 A CN 202010032203A CN 111225516 A CN111225516 A CN 111225516A
- Authority
- CN
- China
- Prior art keywords
- fpc
- film
- soldering
- circuit board
- pad area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a welding method of an FPC (flexible printed circuit) board and an FPC board structure, wherein the welding method comprises the following steps: pasting a covering film on the FPC board, and then pasting a film on the covering film in the pad area; coating solder resist ink on other areas of the film-free cover film; then, sequentially carrying out exposure and development, and removing the covering film in the pad area; and welding solder paste on the bonding pad area where the covering film is removed. The solder resist ink is coated on the non-soldering pad area, so that the use amount of solder paste can be controlled, the soldering compactness of the soldering pad area is good, the oxidation resistance is high, and the problems of soldering short circuit and poor contact are effectively avoided.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a welding method of an FPC (flexible printed circuit) circuit board and a FPC circuit board structure.
Background
At present, the FPC is combined with electronic components mostly through an SMT welding process, namely, solder paste is soldered on Pad areas (gold finger contact areas) of the FPC, so that the FPC is combined with the electronic components. As shown in fig. 1, the cover film at the Pad area of the copper foil is generally designed to be windowed, that is, a gap 100 (the width of the gap 100 is generally 0.2mm) is left between the cover film and the periphery of the copper foil Pad, so that the copper foil is protected from being exposed in the air, the copper foil is prevented from being oxidized, the copper foil in the gold finger area is exposed, and the gold finger contact point is formed by electroplating in the surface treatment process. However, when the pads of the product are small and the number of the pads is densely arranged, the welding process has certain defects: if the solder paste is excessive, the solder paste easily overflows from the gap and contacts with the solder paste in the gold finger area beside the gap, so that the short circuit of the product during welding is caused; if the solder paste is too little, the solder paste is filled in the gap, so that the solder paste on the front surface of the golden finger is less, and poor contact is easily caused by insufficient soldering/false soldering.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the welding method of the FPC circuit board and the FPC circuit board structure can effectively avoid the problems of short circuit and poor contact during welding.
In order to solve the technical problems, the invention adopts the technical scheme that:
a welding method of FPC circuit board, paste the cover film on FPC circuit board, then paste the film on the cover film in the pad area; coating solder resist ink on other areas of the film-free cover film; then, sequentially carrying out exposure and development, and removing the covering film in the pad area; and welding solder paste on the bonding pad area where the covering film is removed.
The invention adopts another technical scheme that:
the utility model provides a FPC circuit board structure, includes the substrate layer, be equipped with the pad region on the substrate layer, be equipped with cover rete and solder mask ink layer on the substrate layer that does not set up the pad region in proper order, be equipped with the welding tin cream on the pad region.
The invention has the beneficial effects that: the solder resist ink is coated on the non-soldering pad area, so that the use amount of solder paste can be controlled, the soldering compactness of the soldering pad area is good, the oxidation resistance is high, and the problems of soldering short circuit and poor contact are effectively avoided.
Drawings
FIG. 1 is a schematic structural diagram of a prior art FPC board structure;
fig. 2 is a top view of an FPC board structure according to a first embodiment of the present invention;
fig. 3 is a cross-sectional view of an FPC wiring board structure according to a first embodiment of the present invention.
Description of reference numerals:
100. a gap;
1. a substrate layer; 2. a pad region; 3. covering the film layer; 4. a solder resist ink layer; 5. and (7) soldering the solder paste.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: solder resist ink is coated on the non-soldering-pad area, so that the using amount of solder paste can be controlled, and the problems of short circuit and poor contact during soldering are avoided.
A welding method of FPC circuit board, paste the cover film on FPC circuit board, then paste the film on the cover film in the pad area; coating solder resist ink on other areas of the film-free cover film; then, sequentially carrying out exposure and development, and removing the covering film in the pad area; and welding solder paste on the bonding pad area where the covering film is removed.
From the above description, the beneficial effects of the present invention are: the solder resist ink is coated on the non-soldering pad area, so that the use amount of solder paste can be controlled, the soldering compactness of the soldering pad area is good, the oxidation resistance is high, and the problems of soldering short circuit and poor contact are effectively avoided.
Further, the film is removed before exposure.
Furthermore, a first positioning hole is formed in the FPC board, a second positioning hole is formed in the film, and the second positioning hole corresponds to the first positioning hole when the film is attached.
As can be seen from the above description, the number of the first positioning holes and the second positioning holes may be multiple, which facilitates the positioning.
Further, baking treatment is carried out on the FPC circuit board after the development.
Further, the method further comprises the following steps after the solder paste is soldered in the pad area where the cover film is removed: and sequentially carrying out gum pasting and punching treatment.
As is apparent from the above description, the FPC board can be die-cut into a desired shape.
Further, before the attaching of the cover film on the FPC board, the method further comprises: and cutting and etching the circuit on the FPC copper foil in sequence to obtain the FPC circuit board.
Referring to fig. 2 and fig. 3, another technical solution related to the present invention is:
the utility model provides a FPC circuit board structure, includes substrate layer 1, be equipped with the regional 2 of pad on the substrate layer 1, be equipped with cover rete 3 and solder mask ink layer 4 on the substrate layer 1 that does not set up the regional 2 of pad in proper order, be equipped with welding tin cream 5 on the pad region.
The first embodiment of the invention is as follows:
a welding method of an FPC circuit board comprises the following steps:
1. and cutting and etching the circuit on the FPC copper foil in sequence to obtain the FPC circuit board.
2. And pasting a covering film on the FPC board, and then pasting a film on the covering film in the pad area. In this embodiment, the FPC board is provided with a first positioning hole, the film is provided with a second positioning hole, and the second positioning hole corresponds to the first positioning hole when the film is attached. Similarly, corresponding positioning holes can be arranged on the FPC circuit board and the covering film for positioning when the covering film is pasted, and the pasting precision is improved.
3. And coating solder resist ink on other areas of the covering film which is not coated with the film.
4. And sequentially carrying out exposure and development to remove the covering film in the pad area. In this embodiment, the film is removed before exposure. And baking the FPC board after the development.
5. And welding solder paste on the bonding pad area where the covering film is removed.
In this embodiment, after removing the solder paste from the pad area of the cover film, the method further includes: and sequentially carrying out gum pasting and punching treatment.
In this embodiment, the final FPC board structure that obtains after welding is as shown in fig. 2 and fig. 3, and includes substrate layer 1, be equipped with pad area 2 on the substrate layer 1, be equipped with cover rete 3 and solder mask ink layer 4 on the substrate layer 1 that does not set up pad area 2 in proper order, be equipped with welding tin cream 5 on the pad area 2. The cover film layer 3 may cover the edge of the pad region 2.
In summary, according to the method for welding the FPC board and the FPC board structure provided by the present invention, the solder resist ink is coated on the non-pad area, so that the amount of solder paste can be controlled, the welding compactness of the pad area is good, the oxidation resistance is high, and the problems of short circuit during welding and poor contact are effectively avoided.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (7)
1. A welding method of FPC circuit board is characterized in that a covering film is pasted on the FPC circuit board, and then a film is pasted on the covering film in a pad area; coating solder resist ink on other areas of the film-free cover film; then, sequentially carrying out exposure and development, and removing the covering film in the pad area; and welding solder paste on the bonding pad area where the covering film is removed.
2. The method of soldering an FPC board according to claim 1, wherein the film is removed before the exposure.
3. The method of soldering an FPC board according to claim 1, wherein a first positioning hole is formed in the FPC board, a second positioning hole is formed in the film, and the second positioning hole corresponds to the first positioning hole when the film is attached.
4. A soldering method of an FPC board according to claim 1, wherein baking treatment is performed on the FPC board after said development.
5. The method for soldering an FPC board according to claim 1, further comprising, after removing the solder paste from the land area of the coverlay film: and sequentially carrying out gum pasting and punching treatment.
6. The method of soldering an FPC board according to claim 1, further comprising, before the step of applying a cover film to the FPC board: and cutting and etching the circuit on the FPC copper foil in sequence to obtain the FPC circuit board.
7. The utility model provides a FPC circuit board structure, includes the substrate layer, be equipped with the pad region on the substrate layer, its characterized in that is equipped with cover rete and solder mask ink layer on the substrate layer that does not set up the pad region in proper order, be equipped with the welding tin cream on the pad region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010032203.4A CN111225516A (en) | 2020-01-13 | 2020-01-13 | Welding method of FPC (flexible printed circuit) circuit board and FPC circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010032203.4A CN111225516A (en) | 2020-01-13 | 2020-01-13 | Welding method of FPC (flexible printed circuit) circuit board and FPC circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111225516A true CN111225516A (en) | 2020-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010032203.4A Pending CN111225516A (en) | 2020-01-13 | 2020-01-13 | Welding method of FPC (flexible printed circuit) circuit board and FPC circuit board structure |
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| CN (1) | CN111225516A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030079341A1 (en) * | 2001-10-31 | 2003-05-01 | Toshihiro Miyake | Method for connecting printed circuit boards and connected printed circuit boards |
| CN101646307A (en) * | 2008-08-04 | 2010-02-10 | 比亚迪股份有限公司 | Method for manufacturing FPC and FPC |
| CN103179796A (en) * | 2013-03-05 | 2013-06-26 | 泰和电路科技（惠州）有限公司 | Circuit board manufacturing method and circuit board manufactured by same |
| CN107835564A (en) * | 2017-10-19 | 2018-03-23 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
-
2020
- 2020-01-13 CN CN202010032203.4A patent/CN111225516A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030079341A1 (en) * | 2001-10-31 | 2003-05-01 | Toshihiro Miyake | Method for connecting printed circuit boards and connected printed circuit boards |
| CN101646307A (en) * | 2008-08-04 | 2010-02-10 | 比亚迪股份有限公司 | Method for manufacturing FPC and FPC |
| CN103179796A (en) * | 2013-03-05 | 2013-06-26 | 泰和电路科技（惠州）有限公司 | Circuit board manufacturing method and circuit board manufactured by same |
| CN107835564A (en) * | 2017-10-19 | 2018-03-23 | 广东欧珀移动通信有限公司 | A kind of flexible PCB and preparation method thereof, electronic equipment |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200602 |
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| RJ01 | Rejection of invention patent application after publication |