GB1433198A - Automatic thermocompression wire bonding apparatus - Google Patents

Automatic thermocompression wire bonding apparatus

Info

Publication number
GB1433198A
GB1433198A GB3426373A GB3426373A GB1433198A GB 1433198 A GB1433198 A GB 1433198A GB 3426373 A GB3426373 A GB 3426373A GB 3426373 A GB3426373 A GB 3426373A GB 1433198 A GB1433198 A GB 1433198A
Authority
GB
United Kingdom
Prior art keywords
tool
shaft
wire
arm
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3426373A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1433198A publication Critical patent/GB1433198A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
GB3426373A 1972-07-26 1973-07-18 Automatic thermocompression wire bonding apparatus Expired GB1433198A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (enExample) 1972-07-26 1972-07-26

Publications (1)

Publication Number Publication Date
GB1433198A true GB1433198A (en) 1976-04-22

Family

ID=13539787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3426373A Expired GB1433198A (en) 1972-07-26 1973-07-18 Automatic thermocompression wire bonding apparatus

Country Status (7)

Country Link
US (1) US4119259A (enExample)
JP (1) JPS5311192B2 (enExample)
AU (1) AU5832273A (enExample)
DE (1) DE2337303B2 (enExample)
GB (1) GB1433198A (enExample)
HK (1) HK76276A (enExample)
MY (1) MY7700101A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2457746C2 (de) * 1974-12-06 1983-06-16 Deutsche Itt Industries Gmbh, 7800 Freiburg Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5826663B2 (ja) * 1977-07-24 1983-06-04 株式会社新川 ワイヤボンディング方法
DE2917110A1 (de) * 1979-04-27 1980-10-30 Preh Elektro Feinmechanik Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass
US4371105A (en) * 1980-07-23 1983-02-01 Melton Vernon L Cam controlled multi-axis automatic welding machine
GB8415912D0 (en) * 1984-06-21 1984-07-25 Abbalong Ltd Step and repeat apparatus
DE3447587A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses
DE8714814U1 (de) * 1987-11-06 1989-03-09 J. Mühlbauer GmbH, 8495 Roding Die-Bonder
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
JP6250372B2 (ja) * 2013-11-22 2017-12-20 Ntn株式会社 自動溶接機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110425A (en) * 1961-01-10 1963-11-12 Gen Motors Corp Fluid dispensing apparatus
US3342395A (en) * 1966-10-10 1967-09-19 Unitek Corp Precision drive apparatus for a tool mount
US3653268A (en) * 1970-03-10 1972-04-04 John C Diepeveen Tool moving mechanism
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US3813022A (en) * 1972-06-19 1974-05-28 Automated Equipment Corp Wire bonder apparatus

Also Published As

Publication number Publication date
US4119259A (en) 1978-10-10
JPS5311192B2 (enExample) 1978-04-19
HK76276A (en) 1976-12-10
DE2337303B2 (de) 1975-05-15
MY7700101A (en) 1977-12-31
AU5832273A (en) 1975-01-23
JPS4933565A (enExample) 1974-03-28
DE2337303A1 (de) 1974-02-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees