GB1428815A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1428815A
GB1428815A GB2314573A GB2314573A GB1428815A GB 1428815 A GB1428815 A GB 1428815A GB 2314573 A GB2314573 A GB 2314573A GB 2314573 A GB2314573 A GB 2314573A GB 1428815 A GB1428815 A GB 1428815A
Authority
GB
United Kingdom
Prior art keywords
polepieces
wafer
ring
clamped
insulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2314573A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INT RECTIFIER CORPORATIAON
Infineon Technologies Americas Corp
Original Assignee
INT RECTIFIER CORPORATIAON
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INT RECTIFIER CORPORATIAON, International Rectifier Corp USA filed Critical INT RECTIFIER CORPORATIAON
Publication of GB1428815A publication Critical patent/GB1428815A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings

Landscapes

  • Die Bonding (AREA)
  • Measuring Fluid Pressure (AREA)
GB2314573A 1972-05-15 1973-05-15 Semiconductor devices Expired GB1428815A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00253200A US3831067A (en) 1972-05-15 1972-05-15 Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring

Publications (1)

Publication Number Publication Date
GB1428815A true GB1428815A (en) 1976-03-17

Family

ID=22959299

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2314573A Expired GB1428815A (en) 1972-05-15 1973-05-15 Semiconductor devices

Country Status (3)

Country Link
US (1) US3831067A (enExample)
JP (1) JPS49108976A (enExample)
GB (1) GB1428815A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2364728A1 (de) * 1973-12-27 1975-07-03 Licentia Gmbh Scheibenfoermiges halbleiterbauelement grosser leistungsfaehigkeit mit kunststoffummantelung
US3995310A (en) * 1974-12-23 1976-11-30 General Electric Company Semiconductor assembly including mounting plate with recessed periphery
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
JPS5357573A (en) * 1976-11-05 1978-05-24 Teijin Ltd Bag filter
DE2810416C2 (de) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement mit Kunststoffummantelung
US4349831A (en) * 1979-09-04 1982-09-14 General Electric Company Semiconductor device having glass and metal package
JPS6032332A (ja) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan 油封均圧形半導体装置
JPS6032331A (ja) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan 油封均圧形半導体装置
JPS6032330A (ja) * 1983-08-03 1985-02-19 Shipbuild Res Assoc Japan 油封均圧形半導体装置
GB8410847D0 (en) * 1984-04-27 1984-06-06 Westinghouse Brake & Signal Semiconductor housings
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69321965T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS-Leistungs-Chip-Typ und Packungszusammenbau
DE69321966T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Leistungs-Halbleiterbauelement
DE69418037T2 (de) * 1994-08-02 1999-08-26 Consorzio Per La Ricerca Sulla Microelettronica Ne Leistungshalbleitervorrichtung aus MOS-Technology-Chips und Gehäuseaufbau
US6075288A (en) * 1998-06-08 2000-06-13 Micron Technology, Inc. Semiconductor package having interlocking heat sinks and method of fabrication
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
US6781227B2 (en) * 2002-01-25 2004-08-24 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2373720A (en) * 1940-08-02 1945-04-17 Stupakoff Ceramic And Mfg Co Composite ceramic and metal structure and method of making the same
US2365518A (en) * 1941-09-17 1944-12-19 Westinghouse Electric & Mfg Co Electric discharge device
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
US3265805A (en) * 1964-02-03 1966-08-09 Power Components Inc Semiconductor power device
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting
GB1188452A (en) * 1968-02-02 1970-04-15 Westinghouse Brake & Signal Encapsulated Semiconductor Elements
US3559001A (en) * 1968-08-21 1971-01-26 Motorola Inc Semiconductor housing assembly

Also Published As

Publication number Publication date
US3831067A (en) 1974-08-20
JPS49108976A (enExample) 1974-10-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee