GB1406253A - Semiconductor assembly - Google Patents
Semiconductor assemblyInfo
- Publication number
- GB1406253A GB1406253A GB3631972A GB3631972A GB1406253A GB 1406253 A GB1406253 A GB 1406253A GB 3631972 A GB3631972 A GB 3631972A GB 3631972 A GB3631972 A GB 3631972A GB 1406253 A GB1406253 A GB 1406253A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- recess
- electrodes
- retaining member
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 13
- 239000000919 ceramic Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000002966 varnish Substances 0.000 abstract 2
- MPDDTAJMJCESGV-CTUHWIOQSA-M (3r,5r)-7-[2-(4-fluorophenyl)-5-[methyl-[(1r)-1-phenylethyl]carbamoyl]-4-propan-2-ylpyrazol-3-yl]-3,5-dihydroxyheptanoate Chemical compound C1([C@@H](C)N(C)C(=O)C2=NN(C(CC[C@@H](O)C[C@@H](O)CC([O-])=O)=C2C(C)C)C=2C=CC(F)=CC=2)=CC=CC=C1 MPDDTAJMJCESGV-CTUHWIOQSA-M 0.000 abstract 1
- 235000010624 Medicago sativa Nutrition 0.000 abstract 1
- 240000004658 Medicago sativa Species 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Abstract
1406253 Semiconductor devices LUCERNE PRODUCTS Inc 3 Aug 1972 [5 Aug 1971] 36319/72 Heading H1K A semiconductor assembly comprises a semiconductor device 10, Fig. 6, having two parallel faces and at least one electrode on at least one of the faces, a headed lead, 34, 36, for the electrode or at least one of the electrodes, a body 22, at least partly of ceramic material and formed with a recess 24 and a bore 30, 32 for each lead 34, 36 communicating with the recess, a rigid retaining member 40 and a settable compound, e.g. the encapsulant 50, for securing the retaining member 40 to the body 22; wherein the assembly is put together by inserting each lead through its respective bore so that its head rests against the face of the recess, placing the semiconductor device in the recess so that the electrode is against the head and securing the retaining member to the body over the recess to secure the semiconductor device non-resiliently therein, by means of the settable compound. As shown in Fig. 6 the semiconductor device 10 has two electrodes 12, 14 on one face having respective headed leads 34, 36 and a further electrode 18 on the other face which is electrically contacted by the cap 40, the open end of the cap 40 being sealed by an encapsulating compound 50 to complete the assembly. The electrodes may be fused to their respective connections by subsequently heating the assembly in a furnace. Additional semiconductor or passive components may be interposed between the semiconductor device and one or more of its respective leads, e.g. Fig. 8 (not shown). In a further embodiment, Fig. 10, the rigid retaining member comprises a second recessed and appropriately bored matching ceramic body so that similar lead connections are provided to electrodes on both faces of the semiconductor device. The ceramic bodies 104, 106 are sealed together by varnish placed between the peripheral joints. In another embodiment, Fig. 21, the recessed body accommodating the semiconductor device comprises a ceramic block 222 surrounded by an insulating sleeve 233 providing stepped recesses for receiving the semiconductor device 210 and the chip 225. Varnish may again be used to retain the parts together. Preferably the shape of the recess in the body in all of the embodiments is such as to provide a snug fit for the semiconductor device, which may be triangular, square, round, oval, hexagonal, diamondshaped, &c.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16925571A | 1971-08-05 | 1971-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1406253A true GB1406253A (en) | 1975-09-17 |
Family
ID=22614857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3631972A Expired GB1406253A (en) | 1971-08-05 | 1972-08-03 | Semiconductor assembly |
Country Status (5)
Country | Link |
---|---|
CA (1) | CA968070A (en) |
DE (1) | DE2238893B2 (en) |
GB (1) | GB1406253A (en) |
IT (1) | IT961877B (en) |
NL (1) | NL7210713A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3406538A1 (en) * | 1984-02-23 | 1985-08-29 | Bbc Brown Boveri & Cie | PERFORMANCE SEMICONDUCTOR MODULE AND PRODUCTION METHOD |
-
1972
- 1972-08-03 GB GB3631972A patent/GB1406253A/en not_active Expired
- 1972-08-04 NL NL7210713A patent/NL7210713A/xx not_active Application Discontinuation
- 1972-08-04 IT IT5199972A patent/IT961877B/en active
- 1972-08-04 CA CA148,780A patent/CA968070A/en not_active Expired
- 1972-08-07 DE DE19722238893 patent/DE2238893B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CA968070A (en) | 1975-05-20 |
DE2238893A1 (en) | 1973-02-15 |
IT961877B (en) | 1973-12-10 |
NL7210713A (en) | 1973-02-07 |
DE2238893B2 (en) | 1976-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |