GB1406253A - Semiconductor assembly - Google Patents

Semiconductor assembly

Info

Publication number
GB1406253A
GB1406253A GB3631972A GB3631972A GB1406253A GB 1406253 A GB1406253 A GB 1406253A GB 3631972 A GB3631972 A GB 3631972A GB 3631972 A GB3631972 A GB 3631972A GB 1406253 A GB1406253 A GB 1406253A
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
recess
electrodes
retaining member
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3631972A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucerne Products Inc
Original Assignee
Lucerne Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucerne Products Inc filed Critical Lucerne Products Inc
Publication of GB1406253A publication Critical patent/GB1406253A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

1406253 Semiconductor devices LUCERNE PRODUCTS Inc 3 Aug 1972 [5 Aug 1971] 36319/72 Heading H1K A semiconductor assembly comprises a semiconductor device 10, Fig. 6, having two parallel faces and at least one electrode on at least one of the faces, a headed lead, 34, 36, for the electrode or at least one of the electrodes, a body 22, at least partly of ceramic material and formed with a recess 24 and a bore 30, 32 for each lead 34, 36 communicating with the recess, a rigid retaining member 40 and a settable compound, e.g. the encapsulant 50, for securing the retaining member 40 to the body 22; wherein the assembly is put together by inserting each lead through its respective bore so that its head rests against the face of the recess, placing the semiconductor device in the recess so that the electrode is against the head and securing the retaining member to the body over the recess to secure the semiconductor device non-resiliently therein, by means of the settable compound. As shown in Fig. 6 the semiconductor device 10 has two electrodes 12, 14 on one face having respective headed leads 34, 36 and a further electrode 18 on the other face which is electrically contacted by the cap 40, the open end of the cap 40 being sealed by an encapsulating compound 50 to complete the assembly. The electrodes may be fused to their respective connections by subsequently heating the assembly in a furnace. Additional semiconductor or passive components may be interposed between the semiconductor device and one or more of its respective leads, e.g. Fig. 8 (not shown). In a further embodiment, Fig. 10, the rigid retaining member comprises a second recessed and appropriately bored matching ceramic body so that similar lead connections are provided to electrodes on both faces of the semiconductor device. The ceramic bodies 104, 106 are sealed together by varnish placed between the peripheral joints. In another embodiment, Fig. 21, the recessed body accommodating the semiconductor device comprises a ceramic block 222 surrounded by an insulating sleeve 233 providing stepped recesses for receiving the semiconductor device 210 and the chip 225. Varnish may again be used to retain the parts together. Preferably the shape of the recess in the body in all of the embodiments is such as to provide a snug fit for the semiconductor device, which may be triangular, square, round, oval, hexagonal, diamondshaped, &c.
GB3631972A 1971-08-05 1972-08-03 Semiconductor assembly Expired GB1406253A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16925571A 1971-08-05 1971-08-05

Publications (1)

Publication Number Publication Date
GB1406253A true GB1406253A (en) 1975-09-17

Family

ID=22614857

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3631972A Expired GB1406253A (en) 1971-08-05 1972-08-03 Semiconductor assembly

Country Status (5)

Country Link
CA (1) CA968070A (en)
DE (1) DE2238893B2 (en)
GB (1) GB1406253A (en)
IT (1) IT961877B (en)
NL (1) NL7210713A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406538A1 (en) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie PERFORMANCE SEMICONDUCTOR MODULE AND PRODUCTION METHOD

Also Published As

Publication number Publication date
DE2238893B2 (en) 1976-11-25
DE2238893A1 (en) 1973-02-15
IT961877B (en) 1973-12-10
NL7210713A (en) 1973-02-07
CA968070A (en) 1975-05-20

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee