GB1388928A - Wafer breaker - Google Patents

Wafer breaker

Info

Publication number
GB1388928A
GB1388928A GB1083072A GB1083072A GB1388928A GB 1388928 A GB1388928 A GB 1388928A GB 1083072 A GB1083072 A GB 1083072A GB 1083072 A GB1083072 A GB 1083072A GB 1388928 A GB1388928 A GB 1388928A
Authority
GB
United Kingdom
Prior art keywords
wafer
platen
along
score lines
central
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1083072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carlson H F
Original Assignee
Carlson H F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carlson H F filed Critical Carlson H F
Publication of GB1388928A publication Critical patent/GB1388928A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB1083072A 1971-03-08 1972-03-08 Wafer breaker Expired GB1388928A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12188671A 1971-03-08 1971-03-08

Publications (1)

Publication Number Publication Date
GB1388928A true GB1388928A (en) 1975-03-26

Family

ID=22399370

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1083072A Expired GB1388928A (en) 1971-03-08 1972-03-08 Wafer breaker

Country Status (6)

Country Link
US (1) US3743148A (enrdf_load_html_response)
JP (1) JPS5232553B1 (enrdf_load_html_response)
CA (1) CA958492A (enrdf_load_html_response)
DE (1) DE2205354C3 (enrdf_load_html_response)
FR (1) FR2128717B1 (enrdf_load_html_response)
GB (1) GB1388928A (enrdf_load_html_response)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285451A (en) * 1979-12-10 1981-08-25 Ppg Industries, Inc. Method of and apparatus for severing edges of a glass sheet
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
KR920004514B1 (ko) * 1987-05-01 1992-06-08 스미도모덴기고오교오 가부시기가이샤 반도체소자 제조장치
EP0457998B1 (en) * 1990-05-25 1994-01-26 International Business Machines Corporation Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets
US5785225A (en) * 1991-12-06 1998-07-28 Loomis Industries, Inc. Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
US5792566A (en) * 1996-07-02 1998-08-11 American Xtal Technology Single crystal wafers
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
CN103646848B (zh) 2004-06-04 2018-06-05 伊利诺伊大学评议会 组装可印刷半导体元件和制造电子器件的方法
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
TWI262542B (en) * 2005-06-23 2006-09-21 Advanced Semiconductor Eng Apparatus and method for separating dice
CN1994713B (zh) * 2006-01-06 2010-05-12 日月光半导体制造股份有限公司 晶粒分离装置及其分离晶粒的方法
JP6576172B2 (ja) * 2015-09-03 2019-09-18 株式会社ディスコ チャックテーブル
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces
US3562058A (en) * 1967-05-16 1971-02-09 Texas Instruments Inc Method for breaking and separating substrate material
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers
US3493155A (en) * 1969-05-05 1970-02-03 Nasa Apparatus and method for separating a semiconductor wafer
US3615047A (en) * 1969-06-30 1971-10-26 Bell Telephone Labor Inc Apparatus and method for separating scribed plates of brittle material

Also Published As

Publication number Publication date
DE2205354A1 (enrdf_load_html_response) 1972-09-21
CA958492A (en) 1974-11-26
DE2205354B2 (de) 1979-06-28
JPS5232553B1 (enrdf_load_html_response) 1977-08-22
US3743148A (en) 1973-07-03
FR2128717A1 (enrdf_load_html_response) 1972-10-20
FR2128717B1 (enrdf_load_html_response) 1976-10-29
DE2205354C3 (de) 1980-02-28

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee