JPS5232553B1 - - Google Patents

Info

Publication number
JPS5232553B1
JPS5232553B1 JP46081552A JP8155271A JPS5232553B1 JP S5232553 B1 JPS5232553 B1 JP S5232553B1 JP 46081552 A JP46081552 A JP 46081552A JP 8155271 A JP8155271 A JP 8155271A JP S5232553 B1 JPS5232553 B1 JP S5232553B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46081552A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5232553B1 publication Critical patent/JPS5232553B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
    • Y10T225/321—Preliminary weakener
    • Y10T225/325—With means to apply moment of force to weakened work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP46081552A 1971-03-08 1971-10-15 Pending JPS5232553B1 (enrdf_load_html_response)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12188671A 1971-03-08 1971-03-08

Publications (1)

Publication Number Publication Date
JPS5232553B1 true JPS5232553B1 (enrdf_load_html_response) 1977-08-22

Family

ID=22399370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46081552A Pending JPS5232553B1 (enrdf_load_html_response) 1971-03-08 1971-10-15

Country Status (6)

Country Link
US (1) US3743148A (enrdf_load_html_response)
JP (1) JPS5232553B1 (enrdf_load_html_response)
CA (1) CA958492A (enrdf_load_html_response)
DE (1) DE2205354C3 (enrdf_load_html_response)
FR (1) FR2128717B1 (enrdf_load_html_response)
GB (1) GB1388928A (enrdf_load_html_response)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285451A (en) * 1979-12-10 1981-08-25 Ppg Industries, Inc. Method of and apparatus for severing edges of a glass sheet
FR2516848A1 (fr) * 1981-11-25 1983-05-27 Radiotechnique Compelec Procede et machine pour subdiviser une plaque de ceramiqueŸa
KR920004514B1 (ko) * 1987-05-01 1992-06-08 스미도모덴기고오교오 가부시기가이샤 반도체소자 제조장치
EP0457998B1 (en) * 1990-05-25 1994-01-26 International Business Machines Corporation Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets
US5785225A (en) * 1991-12-06 1998-07-28 Loomis Industries, Inc. Frangible semiconductor wafer dicing apparatus which employs scribing and breaking
US5792566A (en) * 1996-07-02 1998-08-11 American Xtal Technology Single crystal wafers
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
CN103646848B (zh) 2004-06-04 2018-06-05 伊利诺伊大学评议会 组装可印刷半导体元件和制造电子器件的方法
CA2490849C (en) * 2004-12-22 2009-12-22 Ibm Canada Limited - Ibm Canada Limitee An automated singularization tool for brittle insulating arrays
TWI262542B (en) * 2005-06-23 2006-09-21 Advanced Semiconductor Eng Apparatus and method for separating dice
CN1994713B (zh) * 2006-01-06 2010-05-12 日月光半导体制造股份有限公司 晶粒分离装置及其分离晶粒的方法
JP6576172B2 (ja) * 2015-09-03 2019-09-18 株式会社ディスコ チャックテーブル
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3182873A (en) * 1961-09-11 1965-05-11 Motorola Inc Method for dicing semiconductor material
US3396452A (en) * 1965-06-02 1968-08-13 Nippon Electric Co Method and apparatus for breaking a semiconductor wafer into elementary pieces
US3562058A (en) * 1967-05-16 1971-02-09 Texas Instruments Inc Method for breaking and separating substrate material
US3507426A (en) * 1968-02-23 1970-04-21 Rca Corp Method of dicing semiconductor wafers
US3493155A (en) * 1969-05-05 1970-02-03 Nasa Apparatus and method for separating a semiconductor wafer
US3615047A (en) * 1969-06-30 1971-10-26 Bell Telephone Labor Inc Apparatus and method for separating scribed plates of brittle material

Also Published As

Publication number Publication date
DE2205354A1 (enrdf_load_html_response) 1972-09-21
CA958492A (en) 1974-11-26
DE2205354B2 (de) 1979-06-28
US3743148A (en) 1973-07-03
FR2128717A1 (enrdf_load_html_response) 1972-10-20
FR2128717B1 (enrdf_load_html_response) 1976-10-29
GB1388928A (en) 1975-03-26
DE2205354C3 (de) 1980-02-28

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