GB1380511A - Vapour processing apparatus - Google Patents
Vapour processing apparatusInfo
- Publication number
- GB1380511A GB1380511A GB2096073A GB2096073A GB1380511A GB 1380511 A GB1380511 A GB 1380511A GB 2096073 A GB2096073 A GB 2096073A GB 2096073 A GB2096073 A GB 2096073A GB 1380511 A GB1380511 A GB 1380511A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gas
- partitions
- reaction
- inlets
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/10—Reaction chambers; Selection of materials therefor
- C30B31/106—Continuous processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/16—Feed and outlet means for the gases; Modifying the flow of the gases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/935—Gas flow control
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
1380511 Continuous furnace; preventing ingress of air INTERNATIONAL BUSINESS MACHINES CORP 2 May 1973 [19 June 1972] 20960/73 Heading F4B [Also in Division H1] A gaseous-reaction tube 10, e.g. for use in the oxidation, diffusion or etching of semi-conductor wafers 24 which move successively through entrance, reaction and exit zones of the tube, includes aligned, longitudinal partitions 12, 14 at its entrance and exit zones, and gas inlets 16, 18 for introducing a gas under the two partitions 12, 14. Reaction gas is introduced to the uniformly heated reaction zone through a central inlet 20 and the flow of gas into the inlets 16, 18 is controlled so that back pressure develops beneath the partitions 12, 14 and some of the introduced gas flows out into the edge of the central reaction zone, causing the reaction gas flow to be deflected above the partitions 12, 14 on its way to exhaustion from the ends of the tube 10. A well defined reaction zone is obtained in this manner. Down-turned extensions of the partitions 12, 14 may be provided as shown to restrict flow of gas from beneath the partitions 12, 14 into the reaction zone, and similar extensions at the opposite ends of the partitions may restrict escape of gas out of the tube 10. The gas introduced into inlets 16, 18 may be inert, forming a purge gas, but sequential processing may be obtained if different reaction gases are fed into the inlets 16, 18 and 20.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26391572A | 1972-06-19 | 1972-06-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1380511A true GB1380511A (en) | 1975-01-15 |
Family
ID=23003786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2096073A Expired GB1380511A (en) | 1972-06-19 | 1973-05-02 | Vapour processing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US3790404A (en) |
JP (1) | JPS5551331B2 (en) |
DE (1) | DE2327351A1 (en) |
FR (1) | FR2189874B1 (en) |
GB (1) | GB1380511A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2282871A (en) * | 1993-10-12 | 1995-04-19 | Air Prod & Chem | Inert gas delivery for reflow solder furnaces |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2718184C2 (en) * | 1977-04-23 | 1982-10-14 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Method and apparatus for the continuous coating of an elongated body |
JPS5862489A (en) * | 1981-10-07 | 1983-04-13 | 株式会社日立製作所 | Soft landing device |
JPS59156996A (en) * | 1983-02-23 | 1984-09-06 | Koito Mfg Co Ltd | Method and device for manufacturing crystalline film of compound |
US4504526A (en) * | 1983-09-26 | 1985-03-12 | Libbey-Owens-Ford Company | Apparatus and method for producing a laminar flow of constant velocity fluid along a substrate |
US4807561A (en) * | 1986-05-19 | 1989-02-28 | Toshiba Machine Co., Ltd. | Semiconductor vapor phase growth apparatus |
US5393563A (en) * | 1991-10-29 | 1995-02-28 | Ellis, Jr.; Frank B. | Formation of tin oxide films on glass substrates |
JP3042659B2 (en) * | 1993-07-06 | 2000-05-15 | 信越半導体株式会社 | Method for oxidizing semiconductor wafer |
US5563095A (en) * | 1994-12-01 | 1996-10-08 | Frey; Jeffrey | Method for manufacturing semiconductor devices |
WO1997049132A1 (en) * | 1996-06-20 | 1997-12-24 | Jeffrey Frey | Light-emitting semiconductor device |
DE102005045582B3 (en) | 2005-09-23 | 2007-03-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus and method for continuous vapor deposition under atmospheric pressure and their use |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623854A (en) * | 1968-08-28 | 1971-11-30 | Owens Illinois Inc | Vapor treatment of containers with finish air barrier |
GB1307216A (en) * | 1969-04-23 | 1973-02-14 | Pilkington Brothers Ltd | Treating glass |
US3688737A (en) * | 1969-11-04 | 1972-09-05 | Glass Container Mfg Inst Inc | Vapor deposition apparatus including air mask |
BE760041A (en) * | 1970-01-02 | 1971-05-17 | Ibm | GAS MASS TRANSFER METHOD AND APPARATUS |
-
1972
- 1972-06-19 US US00263915A patent/US3790404A/en not_active Expired - Lifetime
-
1973
- 1973-05-02 GB GB2096073A patent/GB1380511A/en not_active Expired
- 1973-05-11 FR FR7317614A patent/FR2189874B1/fr not_active Expired
- 1973-05-16 JP JP5374673A patent/JPS5551331B2/ja not_active Expired
- 1973-05-29 DE DE2327351A patent/DE2327351A1/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2282871A (en) * | 1993-10-12 | 1995-04-19 | Air Prod & Chem | Inert gas delivery for reflow solder furnaces |
GB2282871B (en) * | 1993-10-12 | 1997-07-09 | Air Prod & Chem | Inert gas delivery for reflow solder furnaces |
Also Published As
Publication number | Publication date |
---|---|
FR2189874A1 (en) | 1974-01-25 |
FR2189874B1 (en) | 1977-09-02 |
DE2327351A1 (en) | 1974-01-03 |
JPS4944668A (en) | 1974-04-26 |
US3790404A (en) | 1974-02-05 |
JPS5551331B2 (en) | 1980-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |