GB1377930A - Semiconductor devices and process for making the same - Google Patents
Semiconductor devices and process for making the sameInfo
- Publication number
- GB1377930A GB1377930A GB2262773A GB2262773A GB1377930A GB 1377930 A GB1377930 A GB 1377930A GB 2262773 A GB2262773 A GB 2262773A GB 2262773 A GB2262773 A GB 2262773A GB 1377930 A GB1377930 A GB 1377930A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- conductor
- vitreous
- bonded
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 13
- 239000011521 glass Substances 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 230000005855 radiation Effects 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 2
- 238000001465 metallisation Methods 0.000 abstract 2
- 241000587161 Gomphocarpus Species 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000005686 electrostatic field Effects 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 238000004382 potting Methods 0.000 abstract 1
- 239000000523 sample Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/818—Bonding techniques
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/12036—PN diode
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Joining Of Glass To Other Materials (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25387972A | 1972-05-16 | 1972-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1377930A true GB1377930A (en) | 1974-12-18 |
Family
ID=22962085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2262773A Expired GB1377930A (en) | 1972-05-16 | 1973-05-11 | Semiconductor devices and process for making the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US3781978A ( ) |
JP (1) | JPS4950871A ( ) |
DE (1) | DE2324030A1 ( ) |
FR (1) | FR2230076B3 ( ) |
GB (1) | GB1377930A ( ) |
IT (1) | IT987625B ( ) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3953920A (en) * | 1975-05-14 | 1976-05-04 | International Telephone & Telegraph Corporation | Method of making a transducer |
US4142662A (en) * | 1978-01-27 | 1979-03-06 | Bell Telephone Laboratories, Incorporated | Method of bonding microelectronic chips |
US4407440A (en) * | 1981-02-23 | 1983-10-04 | Mesa Technology | Semiconductor die bonding machine |
US5182424A (en) * | 1989-10-31 | 1993-01-26 | Vlastimil Frank | Module encapsulation by induction heating |
US5683601A (en) * | 1994-10-24 | 1997-11-04 | Panasonic Technologies, Inc. | Laser ablation forward metal deposition with electrostatic assisted bonding |
US5567336A (en) * | 1994-10-24 | 1996-10-22 | Matsushita Electric Industrial Co., Ltd. | Laser ablation forward metal deposition with electrostatic assisted bonding |
US5935462A (en) * | 1994-10-24 | 1999-08-10 | Matsushita Electric Industrial Co., Ltd. | Repair of metal lines by electrostatically assisted laser ablative deposition |
US6060127A (en) * | 1998-03-31 | 2000-05-09 | Matsushita Electric Industrial Co., Ltd. | Mechanically restricted laser deposition |
US6180912B1 (en) | 1998-03-31 | 2001-01-30 | Matsushita Electric Industrial Co., Ltd. | Fan-out beams for repairing an open defect |
US9776270B2 (en) * | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US27287A (en) * | 1860-02-28 | Pen hack | ||
US3256598A (en) * | 1963-07-25 | 1966-06-21 | Martin Marietta Corp | Diffusion bonding |
US3417459A (en) * | 1965-05-06 | 1968-12-24 | Mallory & Co Inc P R | Bonding electrically conductive metals to insulators |
GB1138401A (en) * | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
US3537175A (en) * | 1966-11-09 | 1970-11-03 | Advalloy Inc | Lead frame for semiconductor devices and method for making same |
US3506424A (en) * | 1967-05-03 | 1970-04-14 | Mallory & Co Inc P R | Bonding an insulator to an insulator |
US3589965A (en) * | 1968-11-27 | 1971-06-29 | Mallory & Co Inc P R | Bonding an insulator to an insulator |
-
1972
- 1972-05-16 US US3781978D patent/US3781978A/en not_active Expired - Lifetime
-
1973
- 1973-05-11 IT IT2395673A patent/IT987625B/it active
- 1973-05-11 GB GB2262773A patent/GB1377930A/en not_active Expired
- 1973-05-12 DE DE2324030A patent/DE2324030A1/de active Pending
- 1973-05-15 JP JP5325873A patent/JPS4950871A/ja active Pending
- 1973-05-16 FR FR7317639A patent/FR2230076B3/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS4950871A ( ) | 1974-05-17 |
FR2230076A1 ( ) | 1974-12-13 |
US3781978A (en) | 1974-01-01 |
DE2324030A1 (de) | 1973-11-29 |
IT987625B (it) | 1975-03-20 |
FR2230076B3 ( ) | 1976-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |