GB1364035A - Method for the manufacturing of a zener diode - Google Patents

Method for the manufacturing of a zener diode

Info

Publication number
GB1364035A
GB1364035A GB743173A GB743173A GB1364035A GB 1364035 A GB1364035 A GB 1364035A GB 743173 A GB743173 A GB 743173A GB 743173 A GB743173 A GB 743173A GB 1364035 A GB1364035 A GB 1364035A
Authority
GB
United Kingdom
Prior art keywords
zone
diffused
mask
donor
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB743173A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of GB1364035A publication Critical patent/GB1364035A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/866Zener diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thyristors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

1364035 Zener diodes ITT INDUSTRIES Inc 15 Feb 1973 [18 Feb 1972] 7431/73 Heading H1K A silicon Zener diode comprising a PN junction, the central area of which has a breakdown voltage less than 10 volts and lower than that of the surrounding portion of the junction, is made by diffusing donor impurity into one face of an N-type silicon wafer to produce a zone with a doping concentration between 10<SP>19</SP> atoms/c.c. and the degenerate concentration and then diffusing boron into the wafer to a plane of constant concentration within the donor diffused zone to form the central area of the junction. The wafer may have a resistivity of 10-100 milliohm/cm. due to antimony or phosphorus doping, and antimony contained in a silicon oxide layer is the preferred donor diffusant, though arsenic and phosphorus may be used if the source concentration is suitably controlled. In the preferred embodiment after donor diffusion into the entire surface an oxide mask with an annular aperture is formed on the zone and an acceptor diffused through it to provide a P ring 4 extending through the N+ zone 2. Then the boron is diffused through a mask having an aperture within the outer periphery of the annular aperture to form P + zone 3. In an alternative embodiment the N+ zone is formed by diffusion through a mask. The aperture in this mask is then enlarged and the boron diffused through it.
GB743173A 1972-02-18 1973-02-15 Method for the manufacturing of a zener diode Expired GB1364035A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722207654 DE2207654B2 (en) 1972-02-18 1972-02-18 Method of manufacturing a zener diode

Publications (1)

Publication Number Publication Date
GB1364035A true GB1364035A (en) 1974-08-21

Family

ID=5836353

Family Applications (1)

Application Number Title Priority Date Filing Date
GB743173A Expired GB1364035A (en) 1972-02-18 1973-02-15 Method for the manufacturing of a zener diode

Country Status (5)

Country Link
AU (1) AU463838B2 (en)
DE (1) DE2207654B2 (en)
FR (1) FR2172191B1 (en)
GB (1) GB1364035A (en)
IT (1) IT979130B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2149205A (en) * 1983-10-31 1985-06-05 Burr Brown Corp Integrated circuit reference diode and fabrication method therefor
EP1164643A2 (en) * 2000-06-07 2001-12-19 Nec Corporation Diode having breakdown voltage adjustable to arbitrary value without increase of parasitic capacitance and process for fabrication thereof
CN113206157A (en) * 2021-04-30 2021-08-03 中国振华集团永光电子有限公司(国营第八七三厂) In-vivo breakdown blunt glass diode and manufacturing method thereof

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7513161A (en) * 1975-11-11 1977-05-13 Philips Nv PROCESS FOR THE MANUFACTURE OF A SEMICONDUCTOR DEVICE, AND DEVICE MANUFACTURED ACCORDING TO THE PROCEDURE.
DE2916114A1 (en) * 1978-04-21 1979-10-31 Hitachi Ltd SEMI-CONDUCTOR DEVICE
NL7907680A (en) * 1979-10-18 1981-04-22 Philips Nv ZENERDIODE.
NL187942C (en) * 1980-08-18 1992-02-17 Philips Nv ZENERDIODE AND METHOD OF MANUFACTURE THEREOF
FR2500855A1 (en) * 1981-02-27 1982-09-03 Thomson Csf Doping and metallisation of semiconductor device - using polycrystalline silicon layer and button on top contacted with metal
US4441114A (en) * 1981-12-22 1984-04-03 International Business Machines Corporation CMOS Subsurface breakdown zener diode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2149205A (en) * 1983-10-31 1985-06-05 Burr Brown Corp Integrated circuit reference diode and fabrication method therefor
EP1164643A2 (en) * 2000-06-07 2001-12-19 Nec Corporation Diode having breakdown voltage adjustable to arbitrary value without increase of parasitic capacitance and process for fabrication thereof
EP1164643A3 (en) * 2000-06-07 2004-09-29 NEC Electronics Corporation Diode having breakdown voltage adjustable to arbitrary value without increase of parasitic capacitance and process for fabrication thereof
CN113206157A (en) * 2021-04-30 2021-08-03 中国振华集团永光电子有限公司(国营第八七三厂) In-vivo breakdown blunt glass diode and manufacturing method thereof

Also Published As

Publication number Publication date
IT979130B (en) 1974-09-30
DE2207654B2 (en) 1974-02-14
DE2207654A1 (en) 1973-08-30
FR2172191B1 (en) 1978-04-14
AU5200373A (en) 1974-08-08
FR2172191A1 (en) 1973-09-28
AU463838B2 (en) 1975-08-07

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee