GB1352317A - Method of making semi-conductor mounts - Google Patents

Method of making semi-conductor mounts

Info

Publication number
GB1352317A
GB1352317A GB1092970A GB1352317DA GB1352317A GB 1352317 A GB1352317 A GB 1352317A GB 1092970 A GB1092970 A GB 1092970A GB 1352317D A GB1352317D A GB 1352317DA GB 1352317 A GB1352317 A GB 1352317A
Authority
GB
United Kingdom
Prior art keywords
mount
shaped part
copper
blank
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1092970A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GKN Floform Ltd
Original Assignee
GKN Floform Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GKN Floform Ltd filed Critical GKN Floform Ltd
Publication of GB1352317A publication Critical patent/GB1352317A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Forging (AREA)
GB1092970A 1970-03-06 1970-03-06 Method of making semi-conductor mounts Expired GB1352317A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1092970 1970-03-06

Publications (1)

Publication Number Publication Date
GB1352317A true GB1352317A (en) 1974-05-08

Family

ID=9976921

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1092970A Expired GB1352317A (en) 1970-03-06 1970-03-06 Method of making semi-conductor mounts

Country Status (2)

Country Link
FR (1) FR2081746B1 (https=)
GB (1) GB1352317A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2700466A1 (de) * 1976-01-08 1977-08-18 Gkn Floform Ltd Verfahren zur herstellung einer halterung fuer halbleiterbauelemente

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436805A (en) * 1965-08-09 1969-04-08 North American Rockwell Method of joining aluminum and ferrous members

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2700466A1 (de) * 1976-01-08 1977-08-18 Gkn Floform Ltd Verfahren zur herstellung einer halterung fuer halbleiterbauelemente

Also Published As

Publication number Publication date
DE2109845B2 (de) 1977-02-24
FR2081746B1 (https=) 1976-10-29
FR2081746A1 (https=) 1971-12-10
DE2109845A1 (de) 1971-09-23

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee