GB1349478A - Semiconductor module - Google Patents

Semiconductor module

Info

Publication number
GB1349478A
GB1349478A GB2082671A GB2082671A GB1349478A GB 1349478 A GB1349478 A GB 1349478A GB 2082671 A GB2082671 A GB 2082671A GB 2082671 A GB2082671 A GB 2082671A GB 1349478 A GB1349478 A GB 1349478A
Authority
GB
United Kingdom
Prior art keywords
semiconductor module
semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2082671A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1349478A publication Critical patent/GB1349478A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thyristors (AREA)
GB2082671A 1970-02-02 1971-04-19 Semiconductor module Expired GB1349478A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US745370A 1970-02-02 1970-02-02

Publications (1)

Publication Number Publication Date
GB1349478A true GB1349478A (en) 1974-04-03

Family

ID=21726248

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2082671A Expired GB1349478A (en) 1970-02-02 1971-04-19 Semiconductor module

Country Status (5)

Country Link
DE (2) DE7103749U (cg-RX-API-DMAC7.html)
FR (1) FR2079196A1 (cg-RX-API-DMAC7.html)
GB (1) GB1349478A (cg-RX-API-DMAC7.html)
IE (1) IE34925B1 (cg-RX-API-DMAC7.html)
SE (1) SE372847B (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442295A1 (de) * 1993-11-29 1995-06-01 Mitsubishi Electric Corp Halbleitervorrichtung in Druckverbindungsausführung und Verfahren zu deren Herstellung
EP2278616A3 (de) * 2009-07-22 2011-04-20 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
FR2412168A1 (fr) * 1977-12-15 1979-07-13 Silicium Semiconducteur Ssc Diodes ecreteuses de surtension
WO1979000817A1 (en) * 1978-03-23 1979-10-18 Bbc Brown Boveri & Cie Semiconductor device comprising at least two semiconductor elements
DE2812700A1 (de) * 1978-03-23 1979-12-06 Bbc Brown Boveri & Cie Halbleiteranordnung mit zwei halbleiterelementen
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
JPH0714029B2 (ja) * 1990-02-07 1995-02-15 日本碍子株式会社 電力用半導体素子
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4442295A1 (de) * 1993-11-29 1995-06-01 Mitsubishi Electric Corp Halbleitervorrichtung in Druckverbindungsausführung und Verfahren zu deren Herstellung
EP2278616A3 (de) * 2009-07-22 2011-04-20 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit einem Sandwich mit einem Leistungshalbleiterbauelement

Also Published As

Publication number Publication date
DE2104726A1 (de) 1972-08-10
SE372847B (cg-RX-API-DMAC7.html) 1975-01-13
IE34925L (en) 1971-08-02
DE7103749U (de) 1971-10-28
FR2079196A1 (cg-RX-API-DMAC7.html) 1971-11-12
IE34925B1 (en) 1975-09-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees