GB1306031A - - Google Patents

Info

Publication number
GB1306031A
GB1306031A GB9371A GB1306031DA GB1306031A GB 1306031 A GB1306031 A GB 1306031A GB 9371 A GB9371 A GB 9371A GB 1306031D A GB1306031D A GB 1306031DA GB 1306031 A GB1306031 A GB 1306031A
Authority
GB
United Kingdom
Prior art keywords
ring
leads
jan
semi
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB9371A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1306031A publication Critical patent/GB1306031A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W76/161—
    • H10W72/50—
    • H10W72/5522—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
GB9371A 1971-01-01 1971-01-01 Expired GB1306031A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9371 1971-01-01

Publications (1)

Publication Number Publication Date
GB1306031A true GB1306031A (cg-RX-API-DMAC10.html) 1973-02-07

Family

ID=9698281

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9371A Expired GB1306031A (cg-RX-API-DMAC10.html) 1971-01-01 1971-01-01

Country Status (1)

Country Link
GB (1) GB1306031A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2315770A1 (fr) * 1975-06-24 1977-01-21 Siemens Ag Ruban electriquement conducteur
FR2393424A1 (fr) * 1977-06-03 1978-12-29 Nippon Electric Co Montage de conducteurs sur armature pour un dispositif semi-conducteur
EP1863086A3 (en) * 2006-06-01 2008-09-17 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders
US7582951B2 (en) 2005-10-20 2009-09-01 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2315770A1 (fr) * 1975-06-24 1977-01-21 Siemens Ag Ruban electriquement conducteur
FR2393424A1 (fr) * 1977-06-03 1978-12-29 Nippon Electric Co Montage de conducteurs sur armature pour un dispositif semi-conducteur
US7582951B2 (en) 2005-10-20 2009-09-01 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
US7781266B2 (en) 2005-10-20 2010-08-24 Broadcom Corporation Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
EP1863086A3 (en) * 2006-06-01 2008-09-17 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders
US7808087B2 (en) 2006-06-01 2010-10-05 Broadcom Corporation Leadframe IC packages having top and bottom integrated heat spreaders

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees