GB1288564A - - Google Patents

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Publication number
GB1288564A
GB1288564A GB429669A GB1288564DA GB1288564A GB 1288564 A GB1288564 A GB 1288564A GB 429669 A GB429669 A GB 429669A GB 1288564D A GB1288564D A GB 1288564DA GB 1288564 A GB1288564 A GB 1288564A
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United Kingdom
Prior art keywords
pips
gold
bonding
silicon
layer
Prior art date
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Expired
Application number
GB429669A
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English (en)
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Publication date
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Publication of GB1288564A publication Critical patent/GB1288564A/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB429669A 1969-01-24 1969-01-24 Expired GB1288564A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB429669 1969-01-24

Publications (1)

Publication Number Publication Date
GB1288564A true GB1288564A (enrdf_load_stackoverflow) 1972-09-13

Family

ID=9774489

Family Applications (1)

Application Number Title Priority Date Filing Date
GB429669A Expired GB1288564A (enrdf_load_stackoverflow) 1969-01-24 1969-01-24

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Country Link
GB (1) GB1288564A (enrdf_load_stackoverflow)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2383522A1 (fr) * 1977-03-08 1978-10-06 Ates Componenti Elettron Procede de formation de zones metallisees sur une serie de dispositifs a semi-conducteurs
US4216488A (en) * 1978-07-31 1980-08-05 Hutson Jearld L Lateral semiconductor diac
GB2157079A (en) * 1984-03-30 1985-10-16 Mitsubishi Electric Corp Electrode arrangement for semiconductor devices
WO1996031905A1 (en) * 1995-04-05 1996-10-10 Mcnc A solder bump structure for a microelectronic substrate
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers

Cited By (26)

* Cited by examiner, † Cited by third party
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FR2383522A1 (fr) * 1977-03-08 1978-10-06 Ates Componenti Elettron Procede de formation de zones metallisees sur une serie de dispositifs a semi-conducteurs
US4216488A (en) * 1978-07-31 1980-08-05 Hutson Jearld L Lateral semiconductor diac
GB2157079A (en) * 1984-03-30 1985-10-16 Mitsubishi Electric Corp Electrode arrangement for semiconductor devices
US4709469A (en) * 1984-03-30 1987-12-01 Mitsubishi Denki Kabushiki Kaisha Method of making a bipolar transistor with polycrystalline contacts
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
US6392163B1 (en) 1995-04-04 2002-05-21 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps
WO1996031905A1 (en) * 1995-04-05 1996-10-10 Mcnc A solder bump structure for a microelectronic substrate
US5892179A (en) * 1995-04-05 1999-04-06 Mcnc Solder bumps and structures for integrated redistribution routing conductors
US6329608B1 (en) 1995-04-05 2001-12-11 Unitive International Limited Key-shaped solder bumps and under bump metallurgy
US6389691B1 (en) 1995-04-05 2002-05-21 Unitive International Limited Methods for forming integrated redistribution routing conductors and solder bumps
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7839000B2 (en) 2002-06-25 2010-11-23 Unitive International Limited Solder structures including barrier layers with nickel and/or copper
US8294269B2 (en) 2002-06-25 2012-10-23 Unitive International Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7879715B2 (en) 2002-06-25 2011-02-01 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7659621B2 (en) 2003-10-14 2010-02-09 Unitive International Limited Solder structures for out of plane connections
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers

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