GB1282565A - Improvements relating to the formation of metallic patterns on insulating surfaces involving electroplating - Google Patents

Abstract

1282565 Coils EMI Ltd 17 Oct 1969 [18 Oct 1968] 49420/68 Heading H1P [Also in Division C7] A metallic pattern, e.g. conductors 4, 5 for forming a printed scanning coil for a vidicon, is formed on an insulating layer 3 by plating a metal (or alloy) on to portions of a metallic matrix 1, electronegative with respect to plating metal and connected as cathode in a plating bath, which portions are exposed by a mask of plating resist 2, e.g. borosilicate glass in the configuration of the pattern, applying to the plated matrix an insulating layer 3 coated with a tacky adhesive of peel strength greater than the bond strength between the plated and matrix metals, and removing the layer with the metallic pattern adhering thereto by peeling from the matrix. The pattern metal may be Cu or Ni-Cr and the matrix metal stainless steel or a metal having a Cr layer, highly polished to give weak bond strength. After plating, the surface of the pattern metal may be treated, e.g. oxidized or roughened, to improve bonding to the tacky adhesive. Prior to plating with the pattern metal, the matrix layer pattern may be plated with a further metallic such as of solder, e.g. 60 Sn-40 Pb alloy, which will form a coating over the pattern metal when the layer 3 is peeled from the matrix. The matrix may be flat or wound around a plastic drum (as shown) made by fixing discs 6 provided with apertures 8 with stub axles 7 at each end of a hollow cylinder; the drum may be arranged in the plating bath, e.g. with an arcuate Cu anode, for rotation. To form a printed scanning coil, the layer 3 with conductors 4, 5 adhering thereto may be wound into a cylinder and heated to cure the adhesive.