GB1279585A - Improvements in or relating to the manufacture of semiconductor devices - Google Patents

Improvements in or relating to the manufacture of semiconductor devices

Info

Publication number
GB1279585A
GB1279585A GB20601/71A GB2060171A GB1279585A GB 1279585 A GB1279585 A GB 1279585A GB 20601/71 A GB20601/71 A GB 20601/71A GB 2060171 A GB2060171 A GB 2060171A GB 1279585 A GB1279585 A GB 1279585A
Authority
GB
United Kingdom
Prior art keywords
base member
foil
base
solder
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB20601/71A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of GB1279585A publication Critical patent/GB1279585A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W72/30—
    • H10W76/138—
    • H10W72/073—
    • H10W72/07336—

Landscapes

  • Die Bonding (AREA)
GB20601/71A 1970-01-30 1971-04-19 Improvements in or relating to the manufacture of semiconductor devices Expired GB1279585A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19702004320 DE2004320A1 (de) 1970-01-30 1970-01-30 Verfahren zum Herstellen eines Halb leiterbauelementes
FR7102793A FR2077409A1 (enExample) 1970-01-30 1971-01-28

Publications (1)

Publication Number Publication Date
GB1279585A true GB1279585A (en) 1972-06-28

Family

ID=25758573

Family Applications (1)

Application Number Title Priority Date Filing Date
GB20601/71A Expired GB1279585A (en) 1970-01-30 1971-04-19 Improvements in or relating to the manufacture of semiconductor devices

Country Status (6)

Country Link
BE (1) BE762282A (enExample)
CH (1) CH512823A (enExample)
DE (1) DE2004320A1 (enExample)
FR (1) FR2077409A1 (enExample)
GB (1) GB1279585A (enExample)
NL (1) NL7101226A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2511210C3 (de) * 1975-03-14 1980-03-06 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen

Also Published As

Publication number Publication date
CH512823A (de) 1971-09-15
DE2004320A1 (de) 1971-08-05
BE762282A (fr) 1971-07-29
NL7101226A (enExample) 1971-08-03
FR2077409A1 (enExample) 1971-10-22

Similar Documents

Publication Publication Date Title
GB1333848A (en) Method of bonding metal bodies together by vibratory energy
GB907427A (en) A process for the production of a semi-conductor device
GB1078779A (en) Semiconductor devices
GB1279585A (en) Improvements in or relating to the manufacture of semiconductor devices
GB730615A (en) Improvements in or relating to electrical contacts
JPS56122156A (en) Lead frame for semiconductor device
GB1025555A (en) Improvements in and relating to methods of manufacturing peltier devices
JPS54124678A (en) Lead frame
GB992472A (en) Semiconductor devices
GB1275153A (en) Semiconductor device
GB1469973A (en) Semiconductor device incorporating a control electrode
GB1296744A (enExample)
GB1190290A (en) Method of Fitting Semiconductor Pellet on Metal Body
GB1331028A (en) Method of soldering a semiconductor plate
GB1502066A (en) Controllable semiconductor components
JPS57114265A (en) Ic lead frame and transistor comb and manufacture thereof
JPS5660038A (en) Semiconductor device
JPS5715447A (en) Production of substrate for carrying components
GB1057687A (en) Improvements in and relating to methods of manufacturing semiconductor devices
US3378735A (en) Semiconductor device housing with spring contact means and improved thermal characteristics
JPS5473565A (en) Assembling method of semiconductor device and substrate used for such method
JPS57160138A (en) Lead frame for semiconductor device
GB1275343A (en) Improvements relating to lead frames for use with semiconductor devices
JPS5756938A (en) Semiconductor device
JPS568851A (en) Lead wire connecting method of semiconductor device

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees