GB1258488A - - Google Patents

Info

Publication number
GB1258488A
GB1258488A GB1258488DA GB1258488A GB 1258488 A GB1258488 A GB 1258488A GB 1258488D A GB1258488D A GB 1258488DA GB 1258488 A GB1258488 A GB 1258488A
Authority
GB
United Kingdom
Prior art keywords
plastic metal
components
board
vacuum forming
sept
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258488A publication Critical patent/GB1258488A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
GB1258488D 1969-10-18 1969-10-18 Expired GB1258488A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5125969 1969-10-18

Publications (1)

Publication Number Publication Date
GB1258488A true GB1258488A (enrdf_load_stackoverflow) 1971-12-30

Family

ID=10459291

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1258488D Expired GB1258488A (enrdf_load_stackoverflow) 1969-10-18 1969-10-18

Country Status (1)

Country Link
GB (1) GB1258488A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module
US5208733A (en) * 1990-11-09 1993-05-04 Merlin Gerin Enclosure and printed circuit card with heat sink
US5208728A (en) * 1991-04-12 1993-05-04 Telefunken Electronic Gmbh Housing for fitting in motor vehicles to hold electronic components
US5309320A (en) * 1991-02-06 1994-05-03 Hughes Aircraft Company Circuit card assembly conduction converter
US5315480A (en) * 1991-11-14 1994-05-24 Digital Equipment Corporation Conformal heat sink for electronic module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module
US5208733A (en) * 1990-11-09 1993-05-04 Merlin Gerin Enclosure and printed circuit card with heat sink
AU645371B2 (en) * 1990-11-09 1994-01-13 Schneider Electric Sa Enclosure and printed circuit card with heat sink and manufacturing process of such a card
US5309320A (en) * 1991-02-06 1994-05-03 Hughes Aircraft Company Circuit card assembly conduction converter
US5208728A (en) * 1991-04-12 1993-05-04 Telefunken Electronic Gmbh Housing for fitting in motor vehicles to hold electronic components
US5315480A (en) * 1991-11-14 1994-05-24 Digital Equipment Corporation Conformal heat sink for electronic module

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees