GB1257780A - - Google Patents
Info
- Publication number
- GB1257780A GB1257780A GB1257780DA GB1257780A GB 1257780 A GB1257780 A GB 1257780A GB 1257780D A GB1257780D A GB 1257780DA GB 1257780 A GB1257780 A GB 1257780A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rungs
- conductors
- semi
- base
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1169068 | 1968-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1257780A true GB1257780A (enrdf_load_html_response) | 1971-12-22 |
Family
ID=9990906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1257780D Expired GB1257780A (enrdf_load_html_response) | 1968-03-11 | 1968-03-11 |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1257780A (enrdf_load_html_response) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2284301A (en) * | 1993-11-29 | 1995-05-31 | Mitsubishi Electric Corp | Pressure-connection type semiconductor device and method of fabricating the same |
-
1968
- 1968-03-11 GB GB1257780D patent/GB1257780A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2284301A (en) * | 1993-11-29 | 1995-05-31 | Mitsubishi Electric Corp | Pressure-connection type semiconductor device and method of fabricating the same |
US5519231A (en) * | 1993-11-29 | 1996-05-21 | Mitsubishi Denki Kabushiki Kaisha | Pressure-connection type semiconductor device having a thermal compensator in contact with a semiconductor base substrate in an alloy-free state |
GB2284301B (en) * | 1993-11-29 | 1997-09-03 | Mitsubishi Electric Corp | Pressure-connection type semiconductor device and method of fabricating the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |