GB1255780A - Thyristor assemblies - Google Patents

Thyristor assemblies

Info

Publication number
GB1255780A
GB1255780A GB2223168A GB2223168A GB1255780A GB 1255780 A GB1255780 A GB 1255780A GB 2223168 A GB2223168 A GB 2223168A GB 2223168 A GB2223168 A GB 2223168A GB 1255780 A GB1255780 A GB 1255780A
Authority
GB
United Kingdom
Prior art keywords
thyristor
encapsulation
terminal
insulating
chamfers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2223168A
Inventor
Raymond Patrick Siddell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB2223168A priority Critical patent/GB1255780A/en
Priority to NL6907077A priority patent/NL6907077A/xx
Priority to DE19691923463 priority patent/DE1923463A1/en
Priority to FR6914816A priority patent/FR2008227A1/fr
Publication of GB1255780A publication Critical patent/GB1255780A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

1,255,780. Thyristor encapsulation. JOSEPH LUCAS (INDUSTRIES) Ltd. 28 April, 1969 [10 May, 1968], No. 22231/68. Heading H1K. A thyristor 11 is secured between the chamfered ends of two copper terminal blocks 12, 14 one of which is gripped by a resilient insulating clip 16 bearing a third terminal member 17 to which the gate of the thyristor is wired. The recess between the chamfers is filled with a cured silicone resin and the structure surrounded by an insulating encapsulation from which the three terminals extend. Terminal 17 constitutes a blade connector. The thyristor is mounted between the plates 12a, 14a of a rectifier assembly.
GB2223168A 1968-05-10 1968-05-10 Thyristor assemblies Expired GB1255780A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB2223168A GB1255780A (en) 1968-05-10 1968-05-10 Thyristor assemblies
NL6907077A NL6907077A (en) 1968-05-10 1969-05-08
DE19691923463 DE1923463A1 (en) 1968-05-10 1969-05-08 Encapsulated thyristor arrangement
FR6914816A FR2008227A1 (en) 1968-05-10 1969-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2223168A GB1255780A (en) 1968-05-10 1968-05-10 Thyristor assemblies

Publications (1)

Publication Number Publication Date
GB1255780A true GB1255780A (en) 1971-12-01

Family

ID=10176051

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2223168A Expired GB1255780A (en) 1968-05-10 1968-05-10 Thyristor assemblies

Country Status (4)

Country Link
DE (1) DE1923463A1 (en)
FR (1) FR2008227A1 (en)
GB (1) GB1255780A (en)
NL (1) NL6907077A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841940B2 (en) * 1990-12-19 1998-12-24 富士電機株式会社 Semiconductor element

Also Published As

Publication number Publication date
NL6907077A (en) 1969-11-12
FR2008227A1 (en) 1970-01-16
DE1923463A1 (en) 1970-08-27

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