GB1255780A - Thyristor assemblies - Google Patents
Thyristor assembliesInfo
- Publication number
- GB1255780A GB1255780A GB2223168A GB2223168A GB1255780A GB 1255780 A GB1255780 A GB 1255780A GB 2223168 A GB2223168 A GB 2223168A GB 2223168 A GB2223168 A GB 2223168A GB 1255780 A GB1255780 A GB 1255780A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thyristor
- encapsulation
- terminal
- insulating
- chamfers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thyristors (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
1,255,780. Thyristor encapsulation. JOSEPH LUCAS (INDUSTRIES) Ltd. 28 April, 1969 [10 May, 1968], No. 22231/68. Heading H1K. A thyristor 11 is secured between the chamfered ends of two copper terminal blocks 12, 14 one of which is gripped by a resilient insulating clip 16 bearing a third terminal member 17 to which the gate of the thyristor is wired. The recess between the chamfers is filled with a cured silicone resin and the structure surrounded by an insulating encapsulation from which the three terminals extend. Terminal 17 constitutes a blade connector. The thyristor is mounted between the plates 12a, 14a of a rectifier assembly.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2223168A GB1255780A (en) | 1968-05-10 | 1968-05-10 | Thyristor assemblies |
NL6907077A NL6907077A (en) | 1968-05-10 | 1969-05-08 | |
DE19691923463 DE1923463A1 (en) | 1968-05-10 | 1969-05-08 | Encapsulated thyristor arrangement |
FR6914816A FR2008227A1 (en) | 1968-05-10 | 1969-05-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2223168A GB1255780A (en) | 1968-05-10 | 1968-05-10 | Thyristor assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1255780A true GB1255780A (en) | 1971-12-01 |
Family
ID=10176051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2223168A Expired GB1255780A (en) | 1968-05-10 | 1968-05-10 | Thyristor assemblies |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1923463A1 (en) |
FR (1) | FR2008227A1 (en) |
GB (1) | GB1255780A (en) |
NL (1) | NL6907077A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2841940B2 (en) * | 1990-12-19 | 1998-12-24 | 富士電機株式会社 | Semiconductor element |
-
1968
- 1968-05-10 GB GB2223168A patent/GB1255780A/en not_active Expired
-
1969
- 1969-05-08 FR FR6914816A patent/FR2008227A1/fr active Pending
- 1969-05-08 NL NL6907077A patent/NL6907077A/xx unknown
- 1969-05-08 DE DE19691923463 patent/DE1923463A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
NL6907077A (en) | 1969-11-12 |
FR2008227A1 (en) | 1970-01-16 |
DE1923463A1 (en) | 1970-08-27 |
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